JP7753391B2 - 配線基板、配線基板を用いた電子部品実装用パッケージ、および電子モジュール - Google Patents

配線基板、配線基板を用いた電子部品実装用パッケージ、および電子モジュール

Info

Publication number
JP7753391B2
JP7753391B2 JP2023569496A JP2023569496A JP7753391B2 JP 7753391 B2 JP7753391 B2 JP 7753391B2 JP 2023569496 A JP2023569496 A JP 2023569496A JP 2023569496 A JP2023569496 A JP 2023569496A JP 7753391 B2 JP7753391 B2 JP 7753391B2
Authority
JP
Japan
Prior art keywords
line conductor
conductor
wiring board
insulating layer
line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023569496A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023120586A5 (https=
JPWO2023120586A1 (https=
Inventor
芳規 川頭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of JPWO2023120586A1 publication Critical patent/JPWO2023120586A1/ja
Publication of JPWO2023120586A5 publication Critical patent/JPWO2023120586A5/ja
Application granted granted Critical
Publication of JP7753391B2 publication Critical patent/JP7753391B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
JP2023569496A 2021-12-23 2022-12-21 配線基板、配線基板を用いた電子部品実装用パッケージ、および電子モジュール Active JP7753391B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021209543 2021-12-23
JP2021209543 2021-12-23
PCT/JP2022/047139 WO2023120586A1 (ja) 2021-12-23 2022-12-21 配線基板、配線基板を用いた電子部品実装用パッケージ、および電子モジュール

Publications (3)

Publication Number Publication Date
JPWO2023120586A1 JPWO2023120586A1 (https=) 2023-06-29
JPWO2023120586A5 JPWO2023120586A5 (https=) 2024-09-03
JP7753391B2 true JP7753391B2 (ja) 2025-10-14

Family

ID=86902683

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023569496A Active JP7753391B2 (ja) 2021-12-23 2022-12-21 配線基板、配線基板を用いた電子部品実装用パッケージ、および電子モジュール

Country Status (3)

Country Link
US (1) US20250056726A1 (https=)
JP (1) JP7753391B2 (https=)
WO (1) WO2023120586A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025070079A1 (ja) * 2023-09-29 2025-04-03 京セラ株式会社 配線基板および電子モジュール
CN119653579B (zh) * 2024-03-14 2025-11-14 华为技术有限公司 柔性电路板、中框组件、电子设备
WO2026048713A1 (ja) * 2024-08-29 2026-03-05 株式会社村田製作所 伝送線路及び電子機器
WO2026058654A1 (ja) * 2024-09-13 2026-03-19 株式会社村田製作所 多層基板及び電子機器

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080023804A1 (en) 2004-11-24 2008-01-31 Banpil Photonics, Inc. High-speed electrical interconnects and method of manufacturing
JP2010154230A (ja) 2008-12-25 2010-07-08 Nec Corp 観測パッド付き伝送線路と伝送方法
JP2016115736A (ja) 2014-12-12 2016-06-23 京セラ株式会社 半導体素子パッケージおよび半導体装置
WO2017130731A1 (ja) 2016-01-27 2017-08-03 株式会社村田製作所 信号伝送線路
WO2021049111A1 (ja) 2019-09-11 2021-03-18 Ｎｇｋエレクトロデバイス株式会社 端子構造、パッケージ、および、端子構造の製造方法
WO2021095620A1 (ja) 2019-11-15 2021-05-20 株式会社村田製作所 伝送線路及び電子機器

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5666270B2 (ja) * 2010-11-29 2015-02-12 株式会社ヨコオ 信号伝送媒体、高周波信号伝送媒体
WO2022114092A1 (ja) * 2020-11-30 2022-06-02 株式会社村田製作所 伝送線路及び電子機器

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080023804A1 (en) 2004-11-24 2008-01-31 Banpil Photonics, Inc. High-speed electrical interconnects and method of manufacturing
JP2010154230A (ja) 2008-12-25 2010-07-08 Nec Corp 観測パッド付き伝送線路と伝送方法
JP2016115736A (ja) 2014-12-12 2016-06-23 京セラ株式会社 半導体素子パッケージおよび半導体装置
WO2017130731A1 (ja) 2016-01-27 2017-08-03 株式会社村田製作所 信号伝送線路
WO2021049111A1 (ja) 2019-09-11 2021-03-18 Ｎｇｋエレクトロデバイス株式会社 端子構造、パッケージ、および、端子構造の製造方法
WO2021095620A1 (ja) 2019-11-15 2021-05-20 株式会社村田製作所 伝送線路及び電子機器

Also Published As

Publication number Publication date
WO2023120586A1 (ja) 2023-06-29
JPWO2023120586A1 (https=) 2023-06-29
US20250056726A1 (en) 2025-02-13

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