JPWO2023120586A1 - - Google Patents

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Publication number
JPWO2023120586A1
JPWO2023120586A1 JP2023569496A JP2023569496A JPWO2023120586A1 JP WO2023120586 A1 JPWO2023120586 A1 JP WO2023120586A1 JP 2023569496 A JP2023569496 A JP 2023569496A JP 2023569496 A JP2023569496 A JP 2023569496A JP WO2023120586 A1 JPWO2023120586 A1 JP WO2023120586A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023569496A
Other languages
Japanese (ja)
Other versions
JP7753391B2 (ja
JPWO2023120586A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023120586A1 publication Critical patent/JPWO2023120586A1/ja
Publication of JPWO2023120586A5 publication Critical patent/JPWO2023120586A5/ja
Application granted granted Critical
Publication of JP7753391B2 publication Critical patent/JP7753391B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
JP2023569496A 2021-12-23 2022-12-21 配線基板、配線基板を用いた電子部品実装用パッケージ、および電子モジュール Active JP7753391B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021209543 2021-12-23
JP2021209543 2021-12-23
PCT/JP2022/047139 WO2023120586A1 (ja) 2021-12-23 2022-12-21 配線基板、配線基板を用いた電子部品実装用パッケージ、および電子モジュール

Publications (3)

Publication Number Publication Date
JPWO2023120586A1 true JPWO2023120586A1 (https=) 2023-06-29
JPWO2023120586A5 JPWO2023120586A5 (https=) 2024-09-03
JP7753391B2 JP7753391B2 (ja) 2025-10-14

Family

ID=86902683

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023569496A Active JP7753391B2 (ja) 2021-12-23 2022-12-21 配線基板、配線基板を用いた電子部品実装用パッケージ、および電子モジュール

Country Status (3)

Country Link
US (1) US20250056726A1 (https=)
JP (1) JP7753391B2 (https=)
WO (1) WO2023120586A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119653579A (zh) * 2024-03-14 2025-03-18 华为技术有限公司 柔性电路板、中框组件、电子设备

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025070079A1 (ja) * 2023-09-29 2025-04-03 京セラ株式会社 配線基板および電子モジュール
WO2026048713A1 (ja) * 2024-08-29 2026-03-05 株式会社村田製作所 伝送線路及び電子機器
WO2026058654A1 (ja) * 2024-09-13 2026-03-19 株式会社村田製作所 多層基板及び電子機器

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080023804A1 (en) * 2004-11-24 2008-01-31 Banpil Photonics, Inc. High-speed electrical interconnects and method of manufacturing
JP2010154230A (ja) * 2008-12-25 2010-07-08 Nec Corp 観測パッド付き伝送線路と伝送方法
JP2016115736A (ja) * 2014-12-12 2016-06-23 京セラ株式会社 半導体素子パッケージおよび半導体装置
WO2017130731A1 (ja) * 2016-01-27 2017-08-03 株式会社村田製作所 信号伝送線路
WO2021049111A1 (ja) * 2019-09-11 2021-03-18 Ｎｇｋエレクトロデバイス株式会社 端子構造、パッケージ、および、端子構造の製造方法
WO2021095620A1 (ja) * 2019-11-15 2021-05-20 株式会社村田製作所 伝送線路及び電子機器

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5666270B2 (ja) * 2010-11-29 2015-02-12 株式会社ヨコオ 信号伝送媒体、高周波信号伝送媒体
WO2022114092A1 (ja) * 2020-11-30 2022-06-02 株式会社村田製作所 伝送線路及び電子機器

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080023804A1 (en) * 2004-11-24 2008-01-31 Banpil Photonics, Inc. High-speed electrical interconnects and method of manufacturing
JP2010154230A (ja) * 2008-12-25 2010-07-08 Nec Corp 観測パッド付き伝送線路と伝送方法
JP2016115736A (ja) * 2014-12-12 2016-06-23 京セラ株式会社 半導体素子パッケージおよび半導体装置
WO2017130731A1 (ja) * 2016-01-27 2017-08-03 株式会社村田製作所 信号伝送線路
WO2021049111A1 (ja) * 2019-09-11 2021-03-18 Ｎｇｋエレクトロデバイス株式会社 端子構造、パッケージ、および、端子構造の製造方法
WO2021095620A1 (ja) * 2019-11-15 2021-05-20 株式会社村田製作所 伝送線路及び電子機器

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119653579A (zh) * 2024-03-14 2025-03-18 华为技术有限公司 柔性电路板、中框组件、电子设备
CN119653579B (zh) * 2024-03-14 2025-11-14 华为技术有限公司 柔性电路板、中框组件、电子设备

Also Published As

Publication number Publication date
JP7753391B2 (ja) 2025-10-14
WO2023120586A1 (ja) 2023-06-29
US20250056726A1 (en) 2025-02-13

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