JP7740360B2 - 化学機械研磨用の添加剤及びその製造方法、並びに、研磨液組成物 - Google Patents

化学機械研磨用の添加剤及びその製造方法、並びに、研磨液組成物

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Publication number
JP7740360B2
JP7740360B2 JP2023559475A JP2023559475A JP7740360B2 JP 7740360 B2 JP7740360 B2 JP 7740360B2 JP 2023559475 A JP2023559475 A JP 2023559475A JP 2023559475 A JP2023559475 A JP 2023559475A JP 7740360 B2 JP7740360 B2 JP 7740360B2
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Japan
Prior art keywords
polymer
group
polishing
mass
meth
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Application number
JP2023559475A
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English (en)
Japanese (ja)
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JPWO2023084951A1 (https=
Inventor
紗知子 井村
晃嗣 柴田
彰宏 後藤
慎哉 神戸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toagosei Co Ltd
Original Assignee
Toagosei Co Ltd
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Publication date
Application filed by Toagosei Co Ltd filed Critical Toagosei Co Ltd
Publication of JPWO2023084951A1 publication Critical patent/JPWO2023084951A1/ja
Application granted granted Critical
Publication of JP7740360B2 publication Critical patent/JP7740360B2/ja
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F293/00—Macromolecular compounds obtained by polymerisation on to a macromolecule having groups capable of inducing the formation of new polymer chains bound exclusively at one or both ends of the starting macromolecule
    • C08F293/005—Macromolecular compounds obtained by polymerisation on to a macromolecule having groups capable of inducing the formation of new polymer chains bound exclusively at one or both ends of the starting macromolecule using free radical "living" or "controlled" polymerisation, e.g. using a complexing agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2438/00—Living radical polymerisation
    • C08F2438/03—Use of a di- or tri-thiocarbonylthio compound, e.g. di- or tri-thioester, di- or tri-thiocarbamate, or a xanthate as chain transfer agent, e.g . Reversible Addition Fragmentation chain Transfer [RAFT] or Macromolecular Design via Interchange of Xanthates [MADIX]
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/221—Oxides; Hydroxides of metals of rare earth metal
    • C08K2003/2213—Oxides; Hydroxides of metals of rare earth metal of cerium

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Lubricants (AREA)
JP2023559475A 2021-11-15 2022-10-05 化学機械研磨用の添加剤及びその製造方法、並びに、研磨液組成物 Active JP7740360B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021185491 2021-11-15
JP2021185491 2021-11-15
PCT/JP2022/037217 WO2023084951A1 (ja) 2021-11-15 2022-10-05 化学機械研磨用の添加剤及びその製造方法、並びに、研磨液組成物

Publications (2)

Publication Number Publication Date
JPWO2023084951A1 JPWO2023084951A1 (https=) 2023-05-19
JP7740360B2 true JP7740360B2 (ja) 2025-09-17

Family

ID=86335496

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023559475A Active JP7740360B2 (ja) 2021-11-15 2022-10-05 化学機械研磨用の添加剤及びその製造方法、並びに、研磨液組成物

Country Status (6)

Country Link
US (1) US20240392163A1 (https=)
JP (1) JP7740360B2 (https=)
KR (1) KR20240108474A (https=)
CN (1) CN118119684A (https=)
TW (1) TW202336060A (https=)
WO (1) WO2023084951A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009104334A1 (ja) 2008-02-18 2009-08-27 Jsr株式会社 化学機械研磨用水系分散体および化学機械研磨方法
JP2013043893A (ja) 2011-08-22 2013-03-04 Jsr Corp 化学機械研磨用水系分散体およびそれを用いた化学機械研磨方法
WO2016104611A1 (ja) 2014-12-26 2016-06-30 花王株式会社 酸化珪素膜研磨用研磨液組成物
JP2019121795A (ja) 2017-12-27 2019-07-22 花王株式会社 シリコンウェーハの製造方法
WO2021131198A1 (ja) 2019-12-27 2021-07-01 東亞合成株式会社 分散剤及び研磨剤組成物

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3480323B2 (ja) 1998-06-30 2003-12-15 日立化成工業株式会社 酸化セリウム研磨剤、基板の研磨法及び半導体装置
JP5105869B2 (ja) 2006-04-27 2012-12-26 花王株式会社 研磨液組成物

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009104334A1 (ja) 2008-02-18 2009-08-27 Jsr株式会社 化学機械研磨用水系分散体および化学機械研磨方法
JP2013043893A (ja) 2011-08-22 2013-03-04 Jsr Corp 化学機械研磨用水系分散体およびそれを用いた化学機械研磨方法
WO2016104611A1 (ja) 2014-12-26 2016-06-30 花王株式会社 酸化珪素膜研磨用研磨液組成物
JP2019121795A (ja) 2017-12-27 2019-07-22 花王株式会社 シリコンウェーハの製造方法
WO2021131198A1 (ja) 2019-12-27 2021-07-01 東亞合成株式会社 分散剤及び研磨剤組成物

Also Published As

Publication number Publication date
US20240392163A1 (en) 2024-11-28
WO2023084951A1 (ja) 2023-05-19
TW202336060A (zh) 2023-09-16
CN118119684A (zh) 2024-05-31
KR20240108474A (ko) 2024-07-09
JPWO2023084951A1 (https=) 2023-05-19

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