JP7734182B2 - 積層圧電素子 - Google Patents

積層圧電素子

Info

Publication number
JP7734182B2
JP7734182B2 JP2023505218A JP2023505218A JP7734182B2 JP 7734182 B2 JP7734182 B2 JP 7734182B2 JP 2023505218 A JP2023505218 A JP 2023505218A JP 2023505218 A JP2023505218 A JP 2023505218A JP 7734182 B2 JP7734182 B2 JP 7734182B2
Authority
JP
Japan
Prior art keywords
piezoelectric
layer
piezoelectric element
electrode layer
esr
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023505218A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2022190729A1 (https=
JPWO2022190729A5 (https=
Inventor
哲 三好
裕介 香川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of JPWO2022190729A1 publication Critical patent/JPWO2022190729A1/ja
Publication of JPWO2022190729A5 publication Critical patent/JPWO2022190729A5/ja
Application granted granted Critical
Publication of JP7734182B2 publication Critical patent/JP7734182B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0611—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements in a pile
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/852—Composite materials, e.g. having 1-3 or 2-2 type connectivity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/871—Single-layered electrodes of multilayer piezoelectric or electrostrictive devices, e.g. internal electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings
    • H10N30/883—Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B2201/00—Indexing scheme associated with B06B1/0207 for details covered by B06B1/0207 but not provided for in any of its subgroups
    • B06B2201/50—Application to a particular transducer type
    • B06B2201/55—Piezoelectric transducer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
  • Ceramic Engineering (AREA)
  • Laminated Bodies (AREA)
JP2023505218A 2021-03-12 2022-02-04 積層圧電素子 Active JP7734182B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2021040070 2021-03-12
JP2021040070 2021-03-12
JP2021079134 2021-05-07
JP2021079134 2021-05-07
JP2021112010 2021-07-06
JP2021112010 2021-07-06
PCT/JP2022/004356 WO2022190729A1 (ja) 2021-03-12 2022-02-04 積層圧電素子

Publications (3)

Publication Number Publication Date
JPWO2022190729A1 JPWO2022190729A1 (https=) 2022-09-15
JPWO2022190729A5 JPWO2022190729A5 (https=) 2023-12-07
JP7734182B2 true JP7734182B2 (ja) 2025-09-04

Family

ID=83227904

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023505218A Active JP7734182B2 (ja) 2021-03-12 2022-02-04 積層圧電素子

Country Status (6)

Country Link
US (1) US20230413674A1 (https=)
EP (1) EP4306225A1 (https=)
JP (1) JP7734182B2 (https=)
KR (1) KR20230133920A (https=)
TW (1) TW202236705A (https=)
WO (1) WO2022190729A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017018313A1 (ja) 2015-07-27 2017-02-02 富士フイルム株式会社 電気音響変換フィルムおよびその製造方法、ならびに、電気音響変換器、フレキシブルディスプレイ、声帯マイクロフォンおよび楽器用センサー
WO2020095812A1 (ja) 2018-11-08 2020-05-14 富士フイルム株式会社 積層圧電素子および電気音響変換器
WO2020261963A1 (ja) 2019-06-28 2020-12-30 富士フイルム株式会社 高分子複合圧電体および圧電フィルム

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7548013B2 (en) * 2006-03-14 2009-06-16 Piezotech, Llc High temperature piezo buzzer
JP5599858B2 (ja) 2011-09-30 2014-10-01 富士フイルム株式会社 電気音響変換フィルム、フレキシブルディスプレイ、声帯マイクロフォンおよび楽器用センサー

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017018313A1 (ja) 2015-07-27 2017-02-02 富士フイルム株式会社 電気音響変換フィルムおよびその製造方法、ならびに、電気音響変換器、フレキシブルディスプレイ、声帯マイクロフォンおよび楽器用センサー
WO2020095812A1 (ja) 2018-11-08 2020-05-14 富士フイルム株式会社 積層圧電素子および電気音響変換器
WO2020261963A1 (ja) 2019-06-28 2020-12-30 富士フイルム株式会社 高分子複合圧電体および圧電フィルム

Also Published As

Publication number Publication date
WO2022190729A1 (ja) 2022-09-15
KR20230133920A (ko) 2023-09-19
JPWO2022190729A1 (https=) 2022-09-15
TW202236705A (zh) 2022-09-16
EP4306225A1 (en) 2024-01-17
US20230413674A1 (en) 2023-12-21

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