TW202236705A - 積層壓電元件 - Google Patents

積層壓電元件 Download PDF

Info

Publication number
TW202236705A
TW202236705A TW111105733A TW111105733A TW202236705A TW 202236705 A TW202236705 A TW 202236705A TW 111105733 A TW111105733 A TW 111105733A TW 111105733 A TW111105733 A TW 111105733A TW 202236705 A TW202236705 A TW 202236705A
Authority
TW
Taiwan
Prior art keywords
piezoelectric
layer
piezoelectric element
electrode layer
film
Prior art date
Application number
TW111105733A
Other languages
English (en)
Chinese (zh)
Inventor
三好哲
香川裕介
Original Assignee
日商富士軟片股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商富士軟片股份有限公司 filed Critical 日商富士軟片股份有限公司
Publication of TW202236705A publication Critical patent/TW202236705A/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0611—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements in a pile
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/852—Composite materials, e.g. having 1-3 or 2-2 type connectivity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/871—Single-layered electrodes of multilayer piezoelectric or electrostrictive devices, e.g. internal electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings
    • H10N30/883—Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B2201/00—Indexing scheme associated with B06B1/0207 for details covered by B06B1/0207 but not provided for in any of its subgroups
    • B06B2201/50—Application to a particular transducer type
    • B06B2201/55—Piezoelectric transducer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
  • Ceramic Engineering (AREA)
  • Laminated Bodies (AREA)
TW111105733A 2021-03-12 2022-02-17 積層壓電元件 TW202236705A (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2021-040070 2021-03-12
JP2021040070 2021-03-12
JP2021079134 2021-05-07
JP2021-079134 2021-05-07
JP2021-112010 2021-07-06
JP2021112010 2021-07-06

Publications (1)

Publication Number Publication Date
TW202236705A true TW202236705A (zh) 2022-09-16

Family

ID=83227904

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111105733A TW202236705A (zh) 2021-03-12 2022-02-17 積層壓電元件

Country Status (6)

Country Link
US (1) US20230413674A1 (https=)
EP (1) EP4306225A1 (https=)
JP (1) JP7734182B2 (https=)
KR (1) KR20230133920A (https=)
TW (1) TW202236705A (https=)
WO (1) WO2022190729A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7548013B2 (en) * 2006-03-14 2009-06-16 Piezotech, Llc High temperature piezo buzzer
JP5599858B2 (ja) 2011-09-30 2014-10-01 富士フイルム株式会社 電気音響変換フィルム、フレキシブルディスプレイ、声帯マイクロフォンおよび楽器用センサー
JP6431984B2 (ja) * 2015-07-27 2018-11-28 富士フイルム株式会社 電気音響変換フィルムおよびその製造方法、ならびに、電気音響変換器、フレキシブルディスプレイ、声帯マイクロフォンおよび楽器用センサー
WO2020095812A1 (ja) * 2018-11-08 2020-05-14 富士フイルム株式会社 積層圧電素子および電気音響変換器
KR102617510B1 (ko) * 2019-06-28 2023-12-22 후지필름 가부시키가이샤 고분자 복합 압전체 및 압전 필름

Also Published As

Publication number Publication date
WO2022190729A1 (ja) 2022-09-15
KR20230133920A (ko) 2023-09-19
JP7734182B2 (ja) 2025-09-04
JPWO2022190729A1 (https=) 2022-09-15
EP4306225A1 (en) 2024-01-17
US20230413674A1 (en) 2023-12-21

Similar Documents

Publication Publication Date Title
US12323763B2 (en) Laminated piezoelectric element and electroacoustic transducer
JP7390390B2 (ja) 圧電フィルムおよび圧電フィルムの製造方法
CN113508605B (zh) 电声换能器
US12075211B2 (en) Laminated piezoelectric element and electroacoustic transducer
TW202137591A (zh) 積層壓電元件
TW202103501A (zh) 電聲轉換薄膜及電聲轉換器
CN115700063A (zh) 压电元件
US20230026623A1 (en) Laminated piezoelectric element and electroacoustic transducer
JP7286790B2 (ja) 圧電素子
CN116965059A (zh) 层叠压电元件
TW202236705A (zh) 積層壓電元件
TW202236704A (zh) 壓電薄膜
US20240407266A1 (en) Piezoelectric element and electroacoustic transducer
US20220271215A1 (en) Laminated piezoelectric element
CN118743331A (zh) 压电元件及电声换能器
WO2023248696A1 (ja) 圧電フィルム、圧電素子および電気音響変換器、ならびに、圧電フィルムの製造方法
CN117981356A (zh) 压电元件及压电扬声器