JPWO2022190729A1 - - Google Patents

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Publication number
JPWO2022190729A1
JPWO2022190729A1 JP2023505218A JP2023505218A JPWO2022190729A1 JP WO2022190729 A1 JPWO2022190729 A1 JP WO2022190729A1 JP 2023505218 A JP2023505218 A JP 2023505218A JP 2023505218 A JP2023505218 A JP 2023505218A JP WO2022190729 A1 JPWO2022190729 A1 JP WO2022190729A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023505218A
Other languages
Japanese (ja)
Other versions
JP7734182B2 (ja
JPWO2022190729A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022190729A1 publication Critical patent/JPWO2022190729A1/ja
Publication of JPWO2022190729A5 publication Critical patent/JPWO2022190729A5/ja
Application granted granted Critical
Publication of JP7734182B2 publication Critical patent/JP7734182B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/50Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B06GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06BMETHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0611Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements in a pile
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00Piezoelectric transducers; Electrostrictive transducers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/05Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/07Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/704Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/85Piezoelectric or electrostrictive active materials
    • H10N30/852Composite materials, e.g. having 1-3 or 2-2 type connectivity
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/87Electrodes or interconnections, e.g. leads or terminals
    • H10N30/871Single-layered electrodes of multilayer piezoelectric or electrostrictive devices, e.g. internal electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/87Electrodes or interconnections, e.g. leads or terminals
    • H10N30/875Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/88Mounts; Supports; Enclosures; Casings
    • H10N30/883Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B06GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06BMETHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B2201/00Indexing scheme associated with B06B1/0207 for details covered by B06B1/0207 but not provided for in any of its subgroups
    • B06B2201/50Application to a particular transducer type
    • B06B2201/55Piezoelectric transducer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
  • Ceramic Engineering (AREA)
  • Laminated Bodies (AREA)
JP2023505218A 2021-03-12 2022-02-04 積層圧電素子 Active JP7734182B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2021040070 2021-03-12
JP2021040070 2021-03-12
JP2021079134 2021-05-07
JP2021079134 2021-05-07
JP2021112010 2021-07-06
JP2021112010 2021-07-06
PCT/JP2022/004356 WO2022190729A1 (ja) 2021-03-12 2022-02-04 積層圧電素子

Publications (3)

Publication Number Publication Date
JPWO2022190729A1 true JPWO2022190729A1 (https=) 2022-09-15
JPWO2022190729A5 JPWO2022190729A5 (https=) 2023-12-07
JP7734182B2 JP7734182B2 (ja) 2025-09-04

Family

ID=83227904

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023505218A Active JP7734182B2 (ja) 2021-03-12 2022-02-04 積層圧電素子

Country Status (6)

Country Link
US (1) US20230413674A1 (https=)
EP (1) EP4306225A1 (https=)
JP (1) JP7734182B2 (https=)
KR (1) KR20230133920A (https=)
TW (1) TW202236705A (https=)
WO (1) WO2022190729A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017018313A1 (ja) * 2015-07-27 2017-02-02 富士フイルム株式会社 電気音響変換フィルムおよびその製造方法、ならびに、電気音響変換器、フレキシブルディスプレイ、声帯マイクロフォンおよび楽器用センサー
WO2020095812A1 (ja) * 2018-11-08 2020-05-14 富士フイルム株式会社 積層圧電素子および電気音響変換器
WO2020261963A1 (ja) * 2019-06-28 2020-12-30 富士フイルム株式会社 高分子複合圧電体および圧電フィルム

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7548013B2 (en) * 2006-03-14 2009-06-16 Piezotech, Llc High temperature piezo buzzer
JP5599858B2 (ja) 2011-09-30 2014-10-01 富士フイルム株式会社 電気音響変換フィルム、フレキシブルディスプレイ、声帯マイクロフォンおよび楽器用センサー

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017018313A1 (ja) * 2015-07-27 2017-02-02 富士フイルム株式会社 電気音響変換フィルムおよびその製造方法、ならびに、電気音響変換器、フレキシブルディスプレイ、声帯マイクロフォンおよび楽器用センサー
WO2020095812A1 (ja) * 2018-11-08 2020-05-14 富士フイルム株式会社 積層圧電素子および電気音響変換器
WO2020261963A1 (ja) * 2019-06-28 2020-12-30 富士フイルム株式会社 高分子複合圧電体および圧電フィルム

Also Published As

Publication number Publication date
WO2022190729A1 (ja) 2022-09-15
KR20230133920A (ko) 2023-09-19
JP7734182B2 (ja) 2025-09-04
TW202236705A (zh) 2022-09-16
EP4306225A1 (en) 2024-01-17
US20230413674A1 (en) 2023-12-21

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