JP7728246B2 - 基材フィルムおよびワーク加工用シート - Google Patents

基材フィルムおよびワーク加工用シート

Info

Publication number
JP7728246B2
JP7728246B2 JP2022512101A JP2022512101A JP7728246B2 JP 7728246 B2 JP7728246 B2 JP 7728246B2 JP 2022512101 A JP2022512101 A JP 2022512101A JP 2022512101 A JP2022512101 A JP 2022512101A JP 7728246 B2 JP7728246 B2 JP 7728246B2
Authority
JP
Japan
Prior art keywords
substrate film
less
tensile
polyester resin
mpa
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022512101A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2021200619A1 (https=
Inventor
遼 佐々木
直紀 田矢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of JPWO2021200619A1 publication Critical patent/JPWO2021200619A1/ja
Application granted granted Critical
Publication of JP7728246B2 publication Critical patent/JP7728246B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
    • C08G63/12—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
    • C08G63/16—Dicarboxylic acids and dihydroxy compounds
    • C08G63/18—Dicarboxylic acids and dihydroxy compounds the acids or hydroxy compounds containing carbocyclic rings
    • C08G63/199—Acids or hydroxy compounds containing cycloaliphatic rings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Dicing (AREA)
JP2022512101A 2020-03-30 2021-03-26 基材フィルムおよびワーク加工用シート Active JP7728246B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020060612 2020-03-30
JP2020060612 2020-03-30
PCT/JP2021/012780 WO2021200619A1 (ja) 2020-03-30 2021-03-26 基材フィルムおよびワーク加工用シート

Publications (2)

Publication Number Publication Date
JPWO2021200619A1 JPWO2021200619A1 (https=) 2021-10-07
JP7728246B2 true JP7728246B2 (ja) 2025-08-22

Family

ID=77930040

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022512101A Active JP7728246B2 (ja) 2020-03-30 2021-03-26 基材フィルムおよびワーク加工用シート

Country Status (3)

Country Link
JP (1) JP7728246B2 (https=)
KR (1) KR20220159344A (https=)
WO (1) WO2021200619A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030030172A1 (en) 2001-06-15 2003-02-13 Gabrie Hoogland Formed decorative film
WO2009063793A1 (ja) 2007-11-15 2009-05-22 The Furukawa Electric Co., Ltd. 半導体ウエハ加工用粘着テープ
JP2011219563A (ja) 2010-04-06 2011-11-04 Mitsubishi Chemicals Corp 脂環式ポリエステル系樹脂組成物及びその成形体
CN106832823A (zh) 2017-03-20 2017-06-13 江苏裕兴薄膜科技股份有限公司 一种耐高温pet聚酯膜及其制备方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11199840A (ja) 1998-01-16 1999-07-27 Kureha Chem Ind Co Ltd 粘着テープ用基材、粘着テープ及び離型テープ付き粘着テープ
JP3618641B2 (ja) * 2000-06-29 2005-02-09 カネボウ株式会社 ポリエステル樹脂組成物及びその用途
JP4549239B2 (ja) * 2005-06-22 2010-09-22 日東電工株式会社 ダイシング用粘着シート
JP5494132B2 (ja) 2010-03-31 2014-05-14 住友ベークライト株式会社 ダイシングフィルム
JP6278178B2 (ja) * 2013-11-11 2018-02-14 日立化成株式会社 ウエハ加工用テープ
JP6522307B6 (ja) * 2014-10-01 2019-07-17 大和製罐株式会社 ポリエステル樹脂組成物

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030030172A1 (en) 2001-06-15 2003-02-13 Gabrie Hoogland Formed decorative film
WO2009063793A1 (ja) 2007-11-15 2009-05-22 The Furukawa Electric Co., Ltd. 半導体ウエハ加工用粘着テープ
JP2011219563A (ja) 2010-04-06 2011-11-04 Mitsubishi Chemicals Corp 脂環式ポリエステル系樹脂組成物及びその成形体
CN106832823A (zh) 2017-03-20 2017-06-13 江苏裕兴薄膜科技股份有限公司 一种耐高温pet聚酯膜及其制备方法

Also Published As

Publication number Publication date
CN114902378A (zh) 2022-08-12
JPWO2021200619A1 (https=) 2021-10-07
WO2021200619A1 (ja) 2021-10-07
TW202200684A (zh) 2022-01-01
KR20220159344A (ko) 2022-12-02

Similar Documents

Publication Publication Date Title
JP2025182039A (ja) 粘着シート
JP7828765B2 (ja) ワーク加工用シート
JP2021119592A (ja) ワーク加工用シートおよび加工済みワークの製造方法
JP2013199562A (ja) ワーク加工用シート基材およびワーク加工用シート
JP7773973B2 (ja) 粘着シート
JP7717053B2 (ja) 粘着シート
WO2021200616A1 (ja) 粘着シート
JP7728246B2 (ja) 基材フィルムおよびワーク加工用シート
JP7805284B2 (ja) ワーク加工用シート
KR20210149610A (ko) 다이싱 테이프용의 기재 필름 및 다이싱 테이프
CN114902378B (zh) 基材膜及工件加工用片
TWI916357B (zh) 基材膜及工件加工用片
JP7685352B2 (ja) ワーク処理用シートおよび処理済みワーク製造方法
JP7190610B1 (ja) ワーク加工用シート
JP7689003B2 (ja) ワーク加工用シート
JP6301987B2 (ja) ダイシング用粘着テープおよび半導体ウェハのフルカットダイシング方法
JP2024021491A (ja) 基材フィルム
JP2024021488A (ja) 粘着シート
JP7705725B2 (ja) ワーク処理用シートおよび処理済みワーク製造方法
JP7795928B2 (ja) 半導体加工用シート、半導体装置の製造方法、および、半導体加工用シートの使用
JP2023136637A (ja) 基材フィルムおよびワーク加工用シート
TW202323052A (zh) 基材膜及工件加工用片
JP2025133343A (ja) 粘着テープ

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20231227

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20250212

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20250411

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20250715

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20250812

R150 Certificate of patent or registration of utility model

Ref document number: 7728246

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150