JPWO2021200619A1 - - Google Patents
Info
- Publication number
- JPWO2021200619A1 JPWO2021200619A1 JP2022512101A JP2022512101A JPWO2021200619A1 JP WO2021200619 A1 JPWO2021200619 A1 JP WO2021200619A1 JP 2022512101 A JP2022512101 A JP 2022512101A JP 2022512101 A JP2022512101 A JP 2022512101A JP WO2021200619 A1 JPWO2021200619 A1 JP WO2021200619A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/255—Polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
- C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
- C08G63/12—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
- C08G63/16—Dicarboxylic acids and dihydroxy compounds
- C08G63/18—Dicarboxylic acids and dihydroxy compounds the acids or hydroxy compounds containing carbocyclic rings
- C08G63/199—Acids or hydroxy compounds containing cycloaliphatic rings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
- H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
- H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Dicing (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020060612 | 2020-03-30 | ||
| JP2020060612 | 2020-03-30 | ||
| PCT/JP2021/012780 WO2021200619A1 (ja) | 2020-03-30 | 2021-03-26 | 基材フィルムおよびワーク加工用シート |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2021200619A1 true JPWO2021200619A1 (https=) | 2021-10-07 |
| JP7728246B2 JP7728246B2 (ja) | 2025-08-22 |
Family
ID=77930040
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022512101A Active JP7728246B2 (ja) | 2020-03-30 | 2021-03-26 | 基材フィルムおよびワーク加工用シート |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7728246B2 (https=) |
| KR (1) | KR20220159344A (https=) |
| WO (1) | WO2021200619A1 (https=) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002012749A (ja) * | 2000-06-29 | 2002-01-15 | Kanebo Ltd | ポリエステル樹脂組成物及びその用途 |
| US20030030172A1 (en) * | 2001-06-15 | 2003-02-13 | Gabrie Hoogland | Formed decorative film |
| JP2007005436A (ja) * | 2005-06-22 | 2007-01-11 | Nitto Denko Corp | ダイシング用粘着シート |
| WO2009063793A1 (ja) * | 2007-11-15 | 2009-05-22 | The Furukawa Electric Co., Ltd. | 半導体ウエハ加工用粘着テープ |
| JP2011219563A (ja) * | 2010-04-06 | 2011-11-04 | Mitsubishi Chemicals Corp | 脂環式ポリエステル系樹脂組成物及びその成形体 |
| JP2015095514A (ja) * | 2013-11-11 | 2015-05-18 | 日立化成株式会社 | ウエハ加工用テープ |
| JP2016069600A (ja) * | 2014-10-01 | 2016-05-09 | 大和製罐株式会社 | ポリエステル樹脂組成物 |
| CN106832823A (zh) * | 2017-03-20 | 2017-06-13 | 江苏裕兴薄膜科技股份有限公司 | 一种耐高温pet聚酯膜及其制备方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11199840A (ja) | 1998-01-16 | 1999-07-27 | Kureha Chem Ind Co Ltd | 粘着テープ用基材、粘着テープ及び離型テープ付き粘着テープ |
| JP5494132B2 (ja) | 2010-03-31 | 2014-05-14 | 住友ベークライト株式会社 | ダイシングフィルム |
-
2021
- 2021-03-26 WO PCT/JP2021/012780 patent/WO2021200619A1/ja not_active Ceased
- 2021-03-26 JP JP2022512101A patent/JP7728246B2/ja active Active
- 2021-03-26 KR KR1020227017622A patent/KR20220159344A/ko not_active Ceased
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002012749A (ja) * | 2000-06-29 | 2002-01-15 | Kanebo Ltd | ポリエステル樹脂組成物及びその用途 |
| US20030030172A1 (en) * | 2001-06-15 | 2003-02-13 | Gabrie Hoogland | Formed decorative film |
| JP2007005436A (ja) * | 2005-06-22 | 2007-01-11 | Nitto Denko Corp | ダイシング用粘着シート |
| WO2009063793A1 (ja) * | 2007-11-15 | 2009-05-22 | The Furukawa Electric Co., Ltd. | 半導体ウエハ加工用粘着テープ |
| JP2011219563A (ja) * | 2010-04-06 | 2011-11-04 | Mitsubishi Chemicals Corp | 脂環式ポリエステル系樹脂組成物及びその成形体 |
| JP2015095514A (ja) * | 2013-11-11 | 2015-05-18 | 日立化成株式会社 | ウエハ加工用テープ |
| JP2016069600A (ja) * | 2014-10-01 | 2016-05-09 | 大和製罐株式会社 | ポリエステル樹脂組成物 |
| CN106832823A (zh) * | 2017-03-20 | 2017-06-13 | 江苏裕兴薄膜科技股份有限公司 | 一种耐高温pet聚酯膜及其制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7728246B2 (ja) | 2025-08-22 |
| CN114902378A (zh) | 2022-08-12 |
| WO2021200619A1 (ja) | 2021-10-07 |
| TW202200684A (zh) | 2022-01-01 |
| KR20220159344A (ko) | 2022-12-02 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20231227 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20250212 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250411 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20250715 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20250812 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 7728246 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |