JP7708183B2 - 熱伝導膜およびこれを用いた放熱構造体 - Google Patents

熱伝導膜およびこれを用いた放熱構造体

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Publication number
JP7708183B2
JP7708183B2 JP2023523811A JP2023523811A JP7708183B2 JP 7708183 B2 JP7708183 B2 JP 7708183B2 JP 2023523811 A JP2023523811 A JP 2023523811A JP 2023523811 A JP2023523811 A JP 2023523811A JP 7708183 B2 JP7708183 B2 JP 7708183B2
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Prior art keywords
thermally conductive
conductive film
carbon material
flake
heat
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JP2023523811A
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Japanese (ja)
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JPWO2022249338A5 (https=
JPWO2022249338A1 (https=
Inventor
哲郎 内藤
佳子 塚田
貴子 金子
淳彦 矢島
一幸 白鳥
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Nissan Motor Co Ltd
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Nissan Motor Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/02—Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C08J5/0405—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres
    • C08J5/042—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres with carbon fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C08J5/045—Reinforcing macromolecular compounds with loose or coherent fibrous material with vegetable or animal fibrous material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/044—Forming conductive coatings; Forming coatings having anti-static properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8583—Means for heat extraction or cooling not being in contact with the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/257—Arrangements for cooling characterised by their materials having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2309/00—Characterised by the use of homopolymers or copolymers of conjugated diene hydrocarbons
    • C08J2309/06—Copolymers with styrene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C08K3/042—Graphene or derivatives, e.g. graphene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2023523811A 2021-05-26 2021-05-26 熱伝導膜およびこれを用いた放熱構造体 Active JP7708183B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/020008 WO2022249338A1 (ja) 2021-05-26 2021-05-26 熱伝導膜およびこれを用いた放熱構造体

Publications (3)

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JPWO2022249338A1 JPWO2022249338A1 (https=) 2022-12-01
JPWO2022249338A5 JPWO2022249338A5 (https=) 2024-05-02
JP7708183B2 true JP7708183B2 (ja) 2025-07-15

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JP2023523811A Active JP7708183B2 (ja) 2021-05-26 2021-05-26 熱伝導膜およびこれを用いた放熱構造体

Country Status (5)

Country Link
US (1) US12595979B2 (https=)
EP (1) EP4349888A4 (https=)
JP (1) JP7708183B2 (https=)
CN (1) CN117396542A (https=)
WO (1) WO2022249338A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013099089A1 (ja) 2011-12-27 2013-07-04 パナソニック株式会社 異方性熱伝導組成物およびその成形品
JP2015170660A (ja) 2014-03-05 2015-09-28 加川　清二 高熱伝導率の放熱シート及びその製造方法
JP2019137577A (ja) 2018-02-09 2019-08-22 大日本印刷株式会社 層状材料分散体、及びその製造方法、層状材料積層体の製造方法、並びに層状材料積層体
WO2020194972A1 (ja) 2019-03-22 2020-10-01 帝人株式会社 絶縁シート

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102433105B (zh) * 2006-11-01 2014-07-30 日立化成株式会社 导热片、其制造方法以及使用了导热片的散热装置
US9363932B2 (en) 2012-06-11 2016-06-07 Nanotek Instruments, Inc. Integrated graphene film heat spreader for display devices
US10566482B2 (en) * 2013-01-31 2020-02-18 Global Graphene Group, Inc. Inorganic coating-protected unitary graphene material for concentrated photovoltaic applications
JP5994751B2 (ja) * 2013-08-09 2016-09-21 スターライト工業株式会社 熱伝導性樹脂成形物の連続成形方法
JP5490957B1 (ja) 2013-10-25 2014-05-14 清二 加川 放熱フィルム、並びにその製造方法及び装置
JP6445966B2 (ja) 2014-02-24 2018-12-26 積水化学工業株式会社 炭素材料、樹脂複合材料及びそれらの製造方法
JP6368910B2 (ja) 2014-05-16 2018-08-08 パナソニックＩｐマネジメント株式会社 熱伝導体
WO2016035680A1 (ja) * 2014-09-01 2016-03-10 株式会社カネカ 自動車用ｌｅｄランプヒートシンク
WO2017033461A1 (ja) 2015-08-24 2017-03-02 日本ゼオン株式会社 熱伝導シート及びその製造方法
JP6366627B2 (ja) * 2016-03-25 2018-08-01 デクセリアルズ株式会社 電磁波吸収熱伝導シート、電磁波吸収熱伝導シートの製造方法及び半導体装置
JP6750019B2 (ja) 2016-08-08 2020-09-02 積水化学工業株式会社 熱伝導シート及びその製造方法
CN109863117B (zh) 2016-10-19 2023-04-18 创业发展联盟技术有限公司 石墨/石墨烯复合材料、集热体、传热体、散热体及散热系统
JP6981001B2 (ja) * 2016-12-09 2021-12-15 昭和電工マテリアルズ株式会社 熱伝導シート及び熱伝導シートを用いた放熱装置
CN109416183B (zh) * 2016-12-27 2020-08-04 惠而浦公司 固态烹饪用微波炉中的纳米冷却
JP7353288B2 (ja) 2018-02-20 2023-09-29 ティコナ・エルエルシー 熱伝導性ポリマー組成物
US12046536B2 (en) * 2019-04-30 2024-07-23 Intel Corporation Integrated heat spreader with enhanced vapor chamber for multichip packages
JP7710156B2 (ja) 2019-12-26 2025-07-18 パナソニックＩｐマネジメント株式会社 膜電極接合体および燃料電池
WO2023074652A1 (ja) 2021-11-01 2023-05-04 東レ株式会社 組成物および塗料

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013099089A1 (ja) 2011-12-27 2013-07-04 パナソニック株式会社 異方性熱伝導組成物およびその成形品
JP2015170660A (ja) 2014-03-05 2015-09-28 加川　清二 高熱伝導率の放熱シート及びその製造方法
JP2019137577A (ja) 2018-02-09 2019-08-22 大日本印刷株式会社 層状材料分散体、及びその製造方法、層状材料積層体の製造方法、並びに層状材料積層体
WO2020194972A1 (ja) 2019-03-22 2020-10-01 帝人株式会社 絶縁シート

Also Published As

Publication number Publication date
US20240230252A1 (en) 2024-07-11
EP4349888A1 (en) 2024-04-10
WO2022249338A1 (ja) 2022-12-01
CN117396542A (zh) 2024-01-12
JPWO2022249338A1 (https=) 2022-12-01
EP4349888A4 (en) 2024-06-19
US12595979B2 (en) 2026-04-07

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