WO2012167440A1 - 导热散热纳米材料、其制备方法和散热系统 - Google Patents
导热散热纳米材料、其制备方法和散热系统 Download PDFInfo
- Publication number
- WO2012167440A1 WO2012167440A1 PCT/CN2011/075580 CN2011075580W WO2012167440A1 WO 2012167440 A1 WO2012167440 A1 WO 2012167440A1 CN 2011075580 W CN2011075580 W CN 2011075580W WO 2012167440 A1 WO2012167440 A1 WO 2012167440A1
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- WO
- WIPO (PCT)
- Prior art keywords
- heat
- dissipating
- heat dissipation
- heat sink
- water
- Prior art date
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
Definitions
- the present invention relates to the field of heat conduction and heat dissipation, and more particularly to a method for preparing a heat-conductive heat-dissipating nano material, a heat-conductive heat-dissipating nano-material obtained by the method, and a heat-dissipating system including the heat-conductive heat-dissipating nano material.
- LED As a solid-state light source with great development potential, LED has attracted more and more attention due to its long life, firm structure, low power consumption and flexible size.
- LED luminaires have become cheaper and cheaper, so they have gradually replaced traditional luminaires in various lighting applications.
- the LED lamp itself generates a relatively large amount of heat during operation. If the heat cannot be dissipated in time, the efficiency or life of each component in the lighting device may be lowered, or some components may malfunction or even melt. Therefore, when designing and implementing LED lighting devices, the effective emission of LED light sources is one of the main considerations.
- the design of the cooling system of LED lighting equipment mainly includes:
- Convection or forced convection Increase the number of fins to increase the heat dissipation area, thus enhancing the heat transfer effect of convection.
- 1 shows a conventional heat sink 1 of an existing LED lamp, and a plurality of fins 2 are disposed at intervals on an outer circumferential surface of the heat sink 1, wherein the fins 2 are made by a lathe process, and the fins are Sheet 2 is black treated to meet the heat dissipation characteristics of black body radiation.
- This type of heat dissipation increases the size and weight of the LED lighting device, but the heat dissipation capability is still limited, and the production cost and material cost are high.
- some LED lighting devices apply a layer of thermal silica gel at the interface between the heat conducting plate and the heat sink. Since the silica gel becomes granular after drying, the contact surface between the heat conducting plate and the heat sink cannot be closely adhered to increase the thermal resistance between the contact surfaces, so that the heat transfer capability between the light source and the heat sink interface is greatly reduced, and good heat dissipation cannot be obtained. Effect.
- the surface of the heat sink is also processed.
- the treatment usually includes anodizing and blackening.
- these two methods have not improved the heat dissipation capability of the LED lamp radiator, especially for high-power LED lighting devices.
- Nanomaterials exhibit many singular physical and chemical properties, such as melting point, electrical conductivity, thermal conductivity, etc., due to surface effects, volume effects, and quantum size effects.
- the use of nanomaterials as heat-conducting heat-dissipating materials has been reported.
- the prior art still fails to solve the problem of uniform dispersion of nanoparticles in a solvent, and in particular, the problem that nanoparticles having a particle size of less than 1 nm are uniformly dispersed in a solvent is still one of the problems to be solved.
- the existing LED lighting device is cumbersome and complicated due to the heat dissipating structure, resulting in a large volume of the lighting device and complicated manufacturing processes. Therefore, there is a need to improve the heat dissipation system of LED lighting devices in the field of lighting.
- the invention combines nano materials to propose a novel heat dissipation system, which can improve the heat dissipation performance, maintain the lighting device in a stable working state, realize compact and light structure, and has low cost. Summary of the invention
- the inventors have surprisingly found that both t-butyl acetate (ie CAS #540885) and p-chlorobenzotrifluoride are present.
- nanoparticles having a particle diameter of less than 1 nm can be uniformly dispersed in a water-soluble solvent such as water, whereby the emulsion obtained has excellent heat conduction and heat dissipation properties.
- the invention is based on the above findings to propose a new process for preparing a heat-conductive and heat-dissipating nano material, and the heat-dissipating and heat-dissipating nano material prepared by the method can effectively dissipate heat generated inside the LED lighting device. Because the heat dissipation effect is very good, it is not necessary to use a large-sized heat dissipation structure, and even the heat dissipation fins often used in the existing heat dissipation structure can be eliminated, thereby reducing the volume of the entire LED lighting device and making the weight lighter.
- the present invention provides a method of preparing a thermally conductive heat-dissipating nanomaterial, the method comprising the steps of:
- the substance having heat conduction and heat dissipation properties may be inorganic or organic.
- it is selected from ceramics, carbon, paraffin, silica or polymethylsilazane.
- the complex, tert-butyl acetate and p-chlorobenzotrifluoride are mixed in the following proportions: 20-40% by weight of complex, 35-45% by weight of t-butyl acetate and 25-35 wt% of p-chlorotrimide Fluorotoluene.
- the amount of water in the process of the invention is from 25 to 75% by weight, based on the total weight of water, the complex, t-butyl acetate and p-chlorobenzotrifluoride.
- the composite used in the present invention has a particle size of less than 1 nm.
- the mixture is stirred at normal temperature and normal pressure for 10 to 20 minutes to obtain a desired heat-conductive and heat-dissipating nano material as an emulsion.
- a second aspect of the invention relates to a thermally conductive, thermally dissipating nanomaterial prepared in accordance with the method of the invention.
- a third aspect of the present invention provides a heat dissipation system of a lighting device, wherein the heat dissipation system includes a heat conduction plate that is thermally connectable to an illumination source, and a heat sink that is in thermal communication with the heat conduction plate, wherein the heat conduction plate
- the surface in contact with the heat sink coats the thermally conductive, heat-dissipating nanomaterial prepared according to the method of the present invention, and/or the thermally conductive, heat-dissipating nanomaterial prepared according to the method of the present invention is coated on the outer surface of the heat sink.
- the thickness of the thermally conductive heat-dissipating nano-material applied to the surface of the heat-conducting plate in contact with the heat sink is 0.3-2 mil (Mi l), on the outer surface of the heat sink The thickness of the coating is 0. 3-2 mils.
- the heat-conducting plate and the heat-dissipating body are usually pre-treated by blast cleaning before coating.
- the illumination source is one or more LEDs.
- the heat sink is not provided with heat dissipation fins or a small amount of heat dissipation fins, and the heat conduction plate and the heat sink are made of metal.
- the heat-conductive and heat-dissipating nano-material obtained by the present invention differs in thermal conductivity and heat dissipation performance depending on which material having heat conduction and heat dissipation properties is selected.
- the heat-conducting heat-dissipating material obtained from the composite material of the polymer material and the ceramic material has high thermal conductivity, and is suitable for coating between the heat-conducting plate and the heat sink, and mainly adopts heat conduction mode and supplemented by heat radiation to LED.
- the heat generated by the light source is transferred to the heat sink.
- the heat-conducting heat-dissipating material obtained by the composite formed of the polymer and the silica has high radiation capability, and is suitable for coating on the outer surface of the heat sink, and mainly radiates heat to the surrounding air by radiating heat.
- the heat-conductive heat-dissipating nano material of the present invention has a viscosity and can be naturally cured within half an hour, so that the heat-conducting plate and the heat sink can be firmly bonded together.
- the main raw material of the heat conductive and heat dissipating material of the present invention is a nano particle, especially a particle having a particle diameter of less than 1 nm, in the presence of tert-butyl acetate and p-chlorobenzotrifluoride as a dispersing agent, it can be rapidly and uniformly dispersed in an aqueous solvent. A uniform emulsion was obtained.
- the present invention not only solves the problem of uniform dispersion of nanoparticles in a solvent, but also provides an emulsion having excellent heat conduction and/or heat dissipation properties.
- the emulsion is coated between the heat conducting plate of the LED lamp and the outer surface of the heat sink and the heat sink, and it is found that the coating formed by the emulsion can pass the heat generated by the illumination source through heat conduction and heat convection at a relatively fast speed. It is brought to the surface of the heat sink, and then radiates heat to the surrounding air by heat radiation, so that the heat sink has an active heat dissipation effect.
- the heat-conductive and heat-dissipating nano material of the invention greatly improves the heat dissipation efficiency of the LED lamp, in some cases it is not even necessary to provide fins on the surface of the heat sink, and the heat sink obtained thereby has a simple structure, light weight and small volume, and Save a lot of raw material costs.
- the heat-conductive heat-dissipating nanomaterial obtained by the present invention differs in thermal conductivity and heat dissipation performance depending on which material having heat conduction and heat dissipation properties is selected.
- the coating between the heat conducting plate and the heat sink may be selected from the material of the present invention having good thermal conductivity, such as a heat conductive heat dissipating material obtained by using a composite formed of a polymer material and a ceramic as a raw material.
- the coating on the surface of the heat sink since the heat is mainly radiated, it is preferable to use a material of the present invention which has a good heat dissipation property, such as a heat-conductive heat-dissipating material obtained by using a composite of a polymer and a silica as a raw material. Thereby, a better heat dissipation effect can be obtained.
- a material of the present invention which has a good heat dissipation property, such as a heat-conductive heat-dissipating material obtained by using a composite of a polymer and a silica as a raw material.
- FIG. 1 is a schematic view of a heat sink used in a conventional LED lamp.
- FIG. 2 is a schematic diagram of a heat dissipation system of an LED lamp in accordance with an embodiment of the present invention.
- FIG. 3 is a schematic view of a heat sink according to an embodiment of the invention. detailed description
- the present invention prepares the heat-conductive and heat-dissipating nano-material of the present invention by using a water-soluble polymer ceramic composite having a particle diameter of less than 1 nm and a water-soluble polymer silica composite having a particle diameter of less than 1 nm as a raw material.
- a commercially available water-soluble polymer ceramic composite having a particle size of less than 1 nm (a water-soluble polymer ceramic composite can be obtained by various commercial means), and t-butyl acetate (ie, CAS #540885) and p-chlorotrifluorotoluene (which are commercially available) are commercially available.
- CAS #98566 is mixed according to a predetermined ratio, and then placed together in water, stirred at normal temperature and pressure for about 10 to 20 minutes, that is, a uniform viscous emulsion is formed, which is the heat-conductive heat-dissipating nano material of the present invention.
- the polymer ceramic composite, t-butyl acetate and p-chlorotrifluoromethane were mixed in the following proportions by weight:
- Polymer ceramic composite 20-40%
- the amount of water used may be from 25 to 75% by weight, based on the total weight of water and the three substances mentioned above.
- 30% by weight of the polymer ceramic composite, 35% by weight of t-butyl acetate, and 35 % by weight of p-chlorobenzotrifluoride are mixed and stirred in water to obtain a water-soluble polymer ceramic emulsion.
- the emulsion was tested and its typical characteristics are as follows:
- the density measured at 25 ° C is 2.70-2.71 g / cm 3 ;
- Working temperature is - 40 ° C ⁇ +200 ° C;
- the thermal conductivity measured according to ASTM D5470 is 8W / Mk
- the dielectric strength measured according to ASTM D149 is 305 V/mil
- the volume resistivity measured according to ASTM D257 is 1.65 X 10" ohm-cm;
- the 2-hour pyrolysis temperature is 400 ° C;
- the heat dissipation rate ⁇ 4 at 25 ° C is 10%.
- the water-soluble polymer ceramic of the present invention has a high thermal conductivity, and the thickness thereof can be made thin, for example, about ⁇ .
- the thickness of the water-soluble polymer ceramic of the present invention is drastically reduced as compared with the conventional heat conductor, which is often on the order of millimeters, and is therefore an excellent heat conductor.
- the polymer ceramic emulsion prepared according to the above method can be directly coated on the heat conducting plate of the LED lamp, Because of its fluidity, it can enter the gap between the parts and form a thin and dense film after curing. Because the gaps are filled, it is advantageous to increase the heat conduction and heat convection efficiency. Moreover, since the emulsion is viscous, the heat conducting plate can be bonded to the heat sink. After natural air drying (about 20 minutes), it is cured into a thermally conductive coating between the heat conducting plate and the heat sink.
- the thickness of the water-soluble polymer ceramic thermal conductive coating is preferably 0. 3-2 mil, more preferably 0. 5-1 mil.
- a water-soluble polymer silica emulsion was prepared in accordance with the above process for preparing a water-soluble polymer ceramic emulsion.
- a commercially available water-soluble polymer silica composite having a particle diameter of less than 1 nm (a water-soluble polymer silica composite can also be obtained by various commercial means), and tert-butyl acetate (ie, CAS#540885) will be commercially available.
- p-chlorobenzotrifluoride g ⁇ CAS #98566) are mixed in a predetermined ratio, preferably in the following proportions:
- Polymer silica composite 20-40%
- the amount of water used may be from 25 to 75% by weight, based on the total weight of water and the three materials mentioned above.
- the water-soluble polymer silica emulsion of the present invention is prepared in a ratio of 30% by weight of the polymer silica composite, 35% by weight of t-butyl acetate, and 35% by weight of p-chlorobenzotrifluoride.
- the emulsion was tested and its typical characteristics are as follows:
- the temperature resistance measured according to the temperature resistance Heat Stab i l ty method is 980 ° C;
- the heat dissipation rate ⁇ ⁇ 4 at 25 °C, the heat radiation efficiency is as high as 30-50%, and
- the water-soluble polymer silica emulsion of the present invention has excellent heat radiation properties, and is particularly suitable as a heat-dissipating coating coated on the outer surface of the heat sink of the LED lamp, and radiates heat to the surroundings by heat radiation. In the air.
- the water-soluble polymer silica emulsion of the invention has the characteristics of heat insulation, insulation, rust prevention, acid and alkali resistance, friction and the like.
- the outer surface of the heat sink is 0. 3-2 mils, preferably 0. 5-1 mil. match
- the water-soluble polymer silica coating was tested and the results were as follows:
- the coating has a firmness of 5B as determined according to ASTM D3359;
- the coating impact measured according to ASTM C2794 is ⁇ 10 lbs.
- the LED lamp 100 includes an LED light source 10, a heat conducting plate 20 for supporting the LED light source 10 and in thermal contact with the LED light source 10, and a heat sink 30.
- the LED light source 10 may be one or more LED chips, and the heat conducting plate 20 and the heat sink 30 may be made of a metal such as aluminum. These are not the gist of the present invention and will not be described in detail herein.
- the other structure of the LED lamp is the same as that of the prior art, and will not be described again here.
- the heat dissipation system of the LED lamp according to the present invention is characterized in that the heat-conductive heat-dissipating nano material of the present invention is applied between the heat-conducting plate 10 and the heat sink 30 and on the outer surface of the heat sink 30.
- the water-soluble polymer ceramic emulsion prepared above is applied between the heat conducting plate 10 and the heat sink, and the water-soluble polymer silica emulsion prepared above is applied onto the outer surface of the heat sink 30.
- the adhesion effect of the heat-conductive heat-dissipating material and the prolonged service life are increased, and the coating is applied to the heat-radiating plate and the heat-dissipating blast cleaning.
- the heat conducting plate 20 and the LED light source 10 are fixed together in thermal communication, and the heat generated by the LED light source 10 is transferred to the heat conducting plate 20, and the polymer ceramic coating 40 of the present invention conducts heat and heat.
- the convection mode is transmitted to the heat sink 30, and is quickly dissipated by the polymer silica coating 50 on the outer surface of the heat sink.
- FIG. 3 shows a schematic view of a heat sink 30 employed in the present invention.
- the outer surface of the heat sink 30 is not provided with heat sink fins, which is different from the prior art.
- the heat sink 30 has a wall thickness of about 1 mm and is manufactured by a spinning process using a T6063 aluminum alloy. Since the heat sink fins are not provided, the process of spinning, die casting, stamping, forging, etc. can be used instead of the lathe process to manufacture the heat sink, which simplifies the manufacturing process of the heat sink. Moreover, the elimination of the heat sink fins also reduces the weight of the heat sink 30 of the present invention by more than three-quarters. In addition, the heat sink 30 does not need to be anodized and treated with black, which greatly reduces the manufacturing cost.
- the present invention has compared the heat dissipation performance of the prior art heat sink 1 shown in Fig. 1 and the heat sink 30 of the present invention shown in Fig. 3, and the results are shown in the following table:
- the heat sink of the present invention is a method in which the water-soluble polymer ceramic emulsion of the present invention is applied between a heat conductive plate and a heat sink, and the water-soluble polymer silica emulsion of the present invention is coated on the outer surface of the heat sink. Tested. It can be seen from the above comparative experiments that the heat sink of the LED lamp of the present invention can be made thinner and lighter, and even without the need of providing heat sink fins, it is at least 40-50%, or even 75% lower than the weight of the conventional heat sink having fins. .
- the heat-dissipating heat-dissipating material of the present invention is coated between the heat-conducting plate and the heat sink and on the outer surface of the heat sink, and the heat-dissipating ability of the heat sink is at least 20 higher than that of the conventional heat sink having fins -30%.
- the processing of the heat sink is simplified, and the materials required for manufacturing the heat sink body and the heat sink fins are also reduced, thereby saving material resources and greatly reducing manufacturing costs.
- heat dissipation fins may be disposed on the outer surface of the heat sink 30 according to actual application requirements, but the number of heat dissipation fins may be small. Setting the heat sink fins further enhances the heat sink's heat dissipation.
- thermally conductive, thermally dissipating nanomaterials prepared in accordance with the method of the present invention in the heat dissipation system of LED lamps. It should be understood that the thermally conductive heat-dissipating nano material of the present invention can be applied to other heat conduction needs. In the case of heat dissipation, such as a flat-type heat sink with an electronic structure, the heat dissipation effect is also obtained, and the manufacturing process can be simplified and the manufacturing cost can be reduced.
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- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
Abstract
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Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/824,454 US9091425B2 (en) | 2011-06-10 | 2011-06-10 | Heat-conducting and heat-dissipating nano-materials, preparing method thereof and heat-dissipating system |
CA2812838A CA2812838C (en) | 2011-06-10 | 2011-06-10 | Heat-conducting and heat-dissipating nano-material, method for preparation thereof and heat-dissipating system |
PCT/CN2011/075580 WO2012167440A1 (zh) | 2011-06-10 | 2011-06-10 | 导热散热纳米材料、其制备方法和散热系统 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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PCT/CN2011/075580 WO2012167440A1 (zh) | 2011-06-10 | 2011-06-10 | 导热散热纳米材料、其制备方法和散热系统 |
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WO2012167440A1 true WO2012167440A1 (zh) | 2012-12-13 |
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PCT/CN2011/075580 WO2012167440A1 (zh) | 2011-06-10 | 2011-06-10 | 导热散热纳米材料、其制备方法和散热系统 |
Country Status (3)
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US (1) | US9091425B2 (zh) |
CA (1) | CA2812838C (zh) |
WO (1) | WO2012167440A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108517690A (zh) * | 2018-04-10 | 2018-09-11 | 宁波全亮照明科技有限公司 | 一种新型led纳米散热材料 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10429908B2 (en) | 2016-03-28 | 2019-10-01 | Microsoft Technology Licensing, Llc | Black body radiation in a computing device |
US9767978B1 (en) * | 2016-05-17 | 2017-09-19 | Eaton Corporation | Medium voltage breaker conductor with an electrically efficient contour |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201513856U (zh) * | 2009-06-19 | 2010-06-23 | 江苏名家汇电器有限公司 | 一种基于导热纳米粒子的大功率led灯具 |
CN201589116U (zh) * | 2010-01-29 | 2010-09-22 | 郑州天阳新能源科技有限公司 | 一种新型led日光灯 |
CN201621662U (zh) * | 2010-01-19 | 2010-11-03 | 实铼股份有限公司 | Led散热结构 |
AU2009202013B2 (en) * | 2009-05-22 | 2011-11-03 | Wen-Sung Hu | Thermal Dispersing Structure for LED or SMD LED lights |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
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US6777026B2 (en) * | 2002-10-07 | 2004-08-17 | Lord Corporation | Flexible emissive coatings for elastomer substrates |
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2011
- 2011-06-10 US US13/824,454 patent/US9091425B2/en not_active Expired - Fee Related
- 2011-06-10 CA CA2812838A patent/CA2812838C/en not_active Expired - Fee Related
- 2011-06-10 WO PCT/CN2011/075580 patent/WO2012167440A1/zh active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU2009202013B2 (en) * | 2009-05-22 | 2011-11-03 | Wen-Sung Hu | Thermal Dispersing Structure for LED or SMD LED lights |
CN201513856U (zh) * | 2009-06-19 | 2010-06-23 | 江苏名家汇电器有限公司 | 一种基于导热纳米粒子的大功率led灯具 |
CN201621662U (zh) * | 2010-01-19 | 2010-11-03 | 实铼股份有限公司 | Led散热结构 |
CN201589116U (zh) * | 2010-01-29 | 2010-09-22 | 郑州天阳新能源科技有限公司 | 一种新型led日光灯 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108517690A (zh) * | 2018-04-10 | 2018-09-11 | 宁波全亮照明科技有限公司 | 一种新型led纳米散热材料 |
Also Published As
Publication number | Publication date |
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US20140152167A1 (en) | 2014-06-05 |
CA2812838A1 (en) | 2012-12-13 |
CA2812838C (en) | 2016-05-10 |
US9091425B2 (en) | 2015-07-28 |
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