WO2012167440A1 - 导热散热纳米材料、其制备方法和散热系统 - Google Patents

导热散热纳米材料、其制备方法和散热系统 Download PDF

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WO2012167440A1
WO2012167440A1 PCT/CN2011/075580 CN2011075580W WO2012167440A1 WO 2012167440 A1 WO2012167440 A1 WO 2012167440A1 CN 2011075580 W CN2011075580 W CN 2011075580W WO 2012167440 A1 WO2012167440 A1 WO 2012167440A1
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heat
dissipating
heat dissipation
heat sink
water
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PCT/CN2011/075580
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English (en)
French (fr)
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许竞新
许文华
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绿方有限公司
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Priority to US13/824,454 priority Critical patent/US9091425B2/en
Priority to CA2812838A priority patent/CA2812838C/en
Priority to PCT/CN2011/075580 priority patent/WO2012167440A1/zh
Publication of WO2012167440A1 publication Critical patent/WO2012167440A1/zh

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08Materials not undergoing a change of physical state when used
    • C09K5/14Solid materials, e.g. powdery or granular

Definitions

  • the present invention relates to the field of heat conduction and heat dissipation, and more particularly to a method for preparing a heat-conductive heat-dissipating nano material, a heat-conductive heat-dissipating nano-material obtained by the method, and a heat-dissipating system including the heat-conductive heat-dissipating nano material.
  • LED As a solid-state light source with great development potential, LED has attracted more and more attention due to its long life, firm structure, low power consumption and flexible size.
  • LED luminaires have become cheaper and cheaper, so they have gradually replaced traditional luminaires in various lighting applications.
  • the LED lamp itself generates a relatively large amount of heat during operation. If the heat cannot be dissipated in time, the efficiency or life of each component in the lighting device may be lowered, or some components may malfunction or even melt. Therefore, when designing and implementing LED lighting devices, the effective emission of LED light sources is one of the main considerations.
  • the design of the cooling system of LED lighting equipment mainly includes:
  • Convection or forced convection Increase the number of fins to increase the heat dissipation area, thus enhancing the heat transfer effect of convection.
  • 1 shows a conventional heat sink 1 of an existing LED lamp, and a plurality of fins 2 are disposed at intervals on an outer circumferential surface of the heat sink 1, wherein the fins 2 are made by a lathe process, and the fins are Sheet 2 is black treated to meet the heat dissipation characteristics of black body radiation.
  • This type of heat dissipation increases the size and weight of the LED lighting device, but the heat dissipation capability is still limited, and the production cost and material cost are high.
  • some LED lighting devices apply a layer of thermal silica gel at the interface between the heat conducting plate and the heat sink. Since the silica gel becomes granular after drying, the contact surface between the heat conducting plate and the heat sink cannot be closely adhered to increase the thermal resistance between the contact surfaces, so that the heat transfer capability between the light source and the heat sink interface is greatly reduced, and good heat dissipation cannot be obtained. Effect.
  • the surface of the heat sink is also processed.
  • the treatment usually includes anodizing and blackening.
  • these two methods have not improved the heat dissipation capability of the LED lamp radiator, especially for high-power LED lighting devices.
  • Nanomaterials exhibit many singular physical and chemical properties, such as melting point, electrical conductivity, thermal conductivity, etc., due to surface effects, volume effects, and quantum size effects.
  • the use of nanomaterials as heat-conducting heat-dissipating materials has been reported.
  • the prior art still fails to solve the problem of uniform dispersion of nanoparticles in a solvent, and in particular, the problem that nanoparticles having a particle size of less than 1 nm are uniformly dispersed in a solvent is still one of the problems to be solved.
  • the existing LED lighting device is cumbersome and complicated due to the heat dissipating structure, resulting in a large volume of the lighting device and complicated manufacturing processes. Therefore, there is a need to improve the heat dissipation system of LED lighting devices in the field of lighting.
  • the invention combines nano materials to propose a novel heat dissipation system, which can improve the heat dissipation performance, maintain the lighting device in a stable working state, realize compact and light structure, and has low cost. Summary of the invention
  • the inventors have surprisingly found that both t-butyl acetate (ie CAS #540885) and p-chlorobenzotrifluoride are present.
  • nanoparticles having a particle diameter of less than 1 nm can be uniformly dispersed in a water-soluble solvent such as water, whereby the emulsion obtained has excellent heat conduction and heat dissipation properties.
  • the invention is based on the above findings to propose a new process for preparing a heat-conductive and heat-dissipating nano material, and the heat-dissipating and heat-dissipating nano material prepared by the method can effectively dissipate heat generated inside the LED lighting device. Because the heat dissipation effect is very good, it is not necessary to use a large-sized heat dissipation structure, and even the heat dissipation fins often used in the existing heat dissipation structure can be eliminated, thereby reducing the volume of the entire LED lighting device and making the weight lighter.
  • the present invention provides a method of preparing a thermally conductive heat-dissipating nanomaterial, the method comprising the steps of:
  • the substance having heat conduction and heat dissipation properties may be inorganic or organic.
  • it is selected from ceramics, carbon, paraffin, silica or polymethylsilazane.
  • the complex, tert-butyl acetate and p-chlorobenzotrifluoride are mixed in the following proportions: 20-40% by weight of complex, 35-45% by weight of t-butyl acetate and 25-35 wt% of p-chlorotrimide Fluorotoluene.
  • the amount of water in the process of the invention is from 25 to 75% by weight, based on the total weight of water, the complex, t-butyl acetate and p-chlorobenzotrifluoride.
  • the composite used in the present invention has a particle size of less than 1 nm.
  • the mixture is stirred at normal temperature and normal pressure for 10 to 20 minutes to obtain a desired heat-conductive and heat-dissipating nano material as an emulsion.
  • a second aspect of the invention relates to a thermally conductive, thermally dissipating nanomaterial prepared in accordance with the method of the invention.
  • a third aspect of the present invention provides a heat dissipation system of a lighting device, wherein the heat dissipation system includes a heat conduction plate that is thermally connectable to an illumination source, and a heat sink that is in thermal communication with the heat conduction plate, wherein the heat conduction plate
  • the surface in contact with the heat sink coats the thermally conductive, heat-dissipating nanomaterial prepared according to the method of the present invention, and/or the thermally conductive, heat-dissipating nanomaterial prepared according to the method of the present invention is coated on the outer surface of the heat sink.
  • the thickness of the thermally conductive heat-dissipating nano-material applied to the surface of the heat-conducting plate in contact with the heat sink is 0.3-2 mil (Mi l), on the outer surface of the heat sink The thickness of the coating is 0. 3-2 mils.
  • the heat-conducting plate and the heat-dissipating body are usually pre-treated by blast cleaning before coating.
  • the illumination source is one or more LEDs.
  • the heat sink is not provided with heat dissipation fins or a small amount of heat dissipation fins, and the heat conduction plate and the heat sink are made of metal.
  • the heat-conductive and heat-dissipating nano-material obtained by the present invention differs in thermal conductivity and heat dissipation performance depending on which material having heat conduction and heat dissipation properties is selected.
  • the heat-conducting heat-dissipating material obtained from the composite material of the polymer material and the ceramic material has high thermal conductivity, and is suitable for coating between the heat-conducting plate and the heat sink, and mainly adopts heat conduction mode and supplemented by heat radiation to LED.
  • the heat generated by the light source is transferred to the heat sink.
  • the heat-conducting heat-dissipating material obtained by the composite formed of the polymer and the silica has high radiation capability, and is suitable for coating on the outer surface of the heat sink, and mainly radiates heat to the surrounding air by radiating heat.
  • the heat-conductive heat-dissipating nano material of the present invention has a viscosity and can be naturally cured within half an hour, so that the heat-conducting plate and the heat sink can be firmly bonded together.
  • the main raw material of the heat conductive and heat dissipating material of the present invention is a nano particle, especially a particle having a particle diameter of less than 1 nm, in the presence of tert-butyl acetate and p-chlorobenzotrifluoride as a dispersing agent, it can be rapidly and uniformly dispersed in an aqueous solvent. A uniform emulsion was obtained.
  • the present invention not only solves the problem of uniform dispersion of nanoparticles in a solvent, but also provides an emulsion having excellent heat conduction and/or heat dissipation properties.
  • the emulsion is coated between the heat conducting plate of the LED lamp and the outer surface of the heat sink and the heat sink, and it is found that the coating formed by the emulsion can pass the heat generated by the illumination source through heat conduction and heat convection at a relatively fast speed. It is brought to the surface of the heat sink, and then radiates heat to the surrounding air by heat radiation, so that the heat sink has an active heat dissipation effect.
  • the heat-conductive and heat-dissipating nano material of the invention greatly improves the heat dissipation efficiency of the LED lamp, in some cases it is not even necessary to provide fins on the surface of the heat sink, and the heat sink obtained thereby has a simple structure, light weight and small volume, and Save a lot of raw material costs.
  • the heat-conductive heat-dissipating nanomaterial obtained by the present invention differs in thermal conductivity and heat dissipation performance depending on which material having heat conduction and heat dissipation properties is selected.
  • the coating between the heat conducting plate and the heat sink may be selected from the material of the present invention having good thermal conductivity, such as a heat conductive heat dissipating material obtained by using a composite formed of a polymer material and a ceramic as a raw material.
  • the coating on the surface of the heat sink since the heat is mainly radiated, it is preferable to use a material of the present invention which has a good heat dissipation property, such as a heat-conductive heat-dissipating material obtained by using a composite of a polymer and a silica as a raw material. Thereby, a better heat dissipation effect can be obtained.
  • a material of the present invention which has a good heat dissipation property, such as a heat-conductive heat-dissipating material obtained by using a composite of a polymer and a silica as a raw material.
  • FIG. 1 is a schematic view of a heat sink used in a conventional LED lamp.
  • FIG. 2 is a schematic diagram of a heat dissipation system of an LED lamp in accordance with an embodiment of the present invention.
  • FIG. 3 is a schematic view of a heat sink according to an embodiment of the invention. detailed description
  • the present invention prepares the heat-conductive and heat-dissipating nano-material of the present invention by using a water-soluble polymer ceramic composite having a particle diameter of less than 1 nm and a water-soluble polymer silica composite having a particle diameter of less than 1 nm as a raw material.
  • a commercially available water-soluble polymer ceramic composite having a particle size of less than 1 nm (a water-soluble polymer ceramic composite can be obtained by various commercial means), and t-butyl acetate (ie, CAS #540885) and p-chlorotrifluorotoluene (which are commercially available) are commercially available.
  • CAS #98566 is mixed according to a predetermined ratio, and then placed together in water, stirred at normal temperature and pressure for about 10 to 20 minutes, that is, a uniform viscous emulsion is formed, which is the heat-conductive heat-dissipating nano material of the present invention.
  • the polymer ceramic composite, t-butyl acetate and p-chlorotrifluoromethane were mixed in the following proportions by weight:
  • Polymer ceramic composite 20-40%
  • the amount of water used may be from 25 to 75% by weight, based on the total weight of water and the three substances mentioned above.
  • 30% by weight of the polymer ceramic composite, 35% by weight of t-butyl acetate, and 35 % by weight of p-chlorobenzotrifluoride are mixed and stirred in water to obtain a water-soluble polymer ceramic emulsion.
  • the emulsion was tested and its typical characteristics are as follows:
  • the density measured at 25 ° C is 2.70-2.71 g / cm 3 ;
  • Working temperature is - 40 ° C ⁇ +200 ° C;
  • the thermal conductivity measured according to ASTM D5470 is 8W / Mk
  • the dielectric strength measured according to ASTM D149 is 305 V/mil
  • the volume resistivity measured according to ASTM D257 is 1.65 X 10" ohm-cm;
  • the 2-hour pyrolysis temperature is 400 ° C;
  • the heat dissipation rate ⁇ 4 at 25 ° C is 10%.
  • the water-soluble polymer ceramic of the present invention has a high thermal conductivity, and the thickness thereof can be made thin, for example, about ⁇ .
  • the thickness of the water-soluble polymer ceramic of the present invention is drastically reduced as compared with the conventional heat conductor, which is often on the order of millimeters, and is therefore an excellent heat conductor.
  • the polymer ceramic emulsion prepared according to the above method can be directly coated on the heat conducting plate of the LED lamp, Because of its fluidity, it can enter the gap between the parts and form a thin and dense film after curing. Because the gaps are filled, it is advantageous to increase the heat conduction and heat convection efficiency. Moreover, since the emulsion is viscous, the heat conducting plate can be bonded to the heat sink. After natural air drying (about 20 minutes), it is cured into a thermally conductive coating between the heat conducting plate and the heat sink.
  • the thickness of the water-soluble polymer ceramic thermal conductive coating is preferably 0. 3-2 mil, more preferably 0. 5-1 mil.
  • a water-soluble polymer silica emulsion was prepared in accordance with the above process for preparing a water-soluble polymer ceramic emulsion.
  • a commercially available water-soluble polymer silica composite having a particle diameter of less than 1 nm (a water-soluble polymer silica composite can also be obtained by various commercial means), and tert-butyl acetate (ie, CAS#540885) will be commercially available.
  • p-chlorobenzotrifluoride g ⁇ CAS #98566) are mixed in a predetermined ratio, preferably in the following proportions:
  • Polymer silica composite 20-40%
  • the amount of water used may be from 25 to 75% by weight, based on the total weight of water and the three materials mentioned above.
  • the water-soluble polymer silica emulsion of the present invention is prepared in a ratio of 30% by weight of the polymer silica composite, 35% by weight of t-butyl acetate, and 35% by weight of p-chlorobenzotrifluoride.
  • the emulsion was tested and its typical characteristics are as follows:
  • the temperature resistance measured according to the temperature resistance Heat Stab i l ty method is 980 ° C;
  • the heat dissipation rate ⁇ ⁇ 4 at 25 °C, the heat radiation efficiency is as high as 30-50%, and
  • the water-soluble polymer silica emulsion of the present invention has excellent heat radiation properties, and is particularly suitable as a heat-dissipating coating coated on the outer surface of the heat sink of the LED lamp, and radiates heat to the surroundings by heat radiation. In the air.
  • the water-soluble polymer silica emulsion of the invention has the characteristics of heat insulation, insulation, rust prevention, acid and alkali resistance, friction and the like.
  • the outer surface of the heat sink is 0. 3-2 mils, preferably 0. 5-1 mil. match
  • the water-soluble polymer silica coating was tested and the results were as follows:
  • the coating has a firmness of 5B as determined according to ASTM D3359;
  • the coating impact measured according to ASTM C2794 is ⁇ 10 lbs.
  • the LED lamp 100 includes an LED light source 10, a heat conducting plate 20 for supporting the LED light source 10 and in thermal contact with the LED light source 10, and a heat sink 30.
  • the LED light source 10 may be one or more LED chips, and the heat conducting plate 20 and the heat sink 30 may be made of a metal such as aluminum. These are not the gist of the present invention and will not be described in detail herein.
  • the other structure of the LED lamp is the same as that of the prior art, and will not be described again here.
  • the heat dissipation system of the LED lamp according to the present invention is characterized in that the heat-conductive heat-dissipating nano material of the present invention is applied between the heat-conducting plate 10 and the heat sink 30 and on the outer surface of the heat sink 30.
  • the water-soluble polymer ceramic emulsion prepared above is applied between the heat conducting plate 10 and the heat sink, and the water-soluble polymer silica emulsion prepared above is applied onto the outer surface of the heat sink 30.
  • the adhesion effect of the heat-conductive heat-dissipating material and the prolonged service life are increased, and the coating is applied to the heat-radiating plate and the heat-dissipating blast cleaning.
  • the heat conducting plate 20 and the LED light source 10 are fixed together in thermal communication, and the heat generated by the LED light source 10 is transferred to the heat conducting plate 20, and the polymer ceramic coating 40 of the present invention conducts heat and heat.
  • the convection mode is transmitted to the heat sink 30, and is quickly dissipated by the polymer silica coating 50 on the outer surface of the heat sink.
  • FIG. 3 shows a schematic view of a heat sink 30 employed in the present invention.
  • the outer surface of the heat sink 30 is not provided with heat sink fins, which is different from the prior art.
  • the heat sink 30 has a wall thickness of about 1 mm and is manufactured by a spinning process using a T6063 aluminum alloy. Since the heat sink fins are not provided, the process of spinning, die casting, stamping, forging, etc. can be used instead of the lathe process to manufacture the heat sink, which simplifies the manufacturing process of the heat sink. Moreover, the elimination of the heat sink fins also reduces the weight of the heat sink 30 of the present invention by more than three-quarters. In addition, the heat sink 30 does not need to be anodized and treated with black, which greatly reduces the manufacturing cost.
  • the present invention has compared the heat dissipation performance of the prior art heat sink 1 shown in Fig. 1 and the heat sink 30 of the present invention shown in Fig. 3, and the results are shown in the following table:
  • the heat sink of the present invention is a method in which the water-soluble polymer ceramic emulsion of the present invention is applied between a heat conductive plate and a heat sink, and the water-soluble polymer silica emulsion of the present invention is coated on the outer surface of the heat sink. Tested. It can be seen from the above comparative experiments that the heat sink of the LED lamp of the present invention can be made thinner and lighter, and even without the need of providing heat sink fins, it is at least 40-50%, or even 75% lower than the weight of the conventional heat sink having fins. .
  • the heat-dissipating heat-dissipating material of the present invention is coated between the heat-conducting plate and the heat sink and on the outer surface of the heat sink, and the heat-dissipating ability of the heat sink is at least 20 higher than that of the conventional heat sink having fins -30%.
  • the processing of the heat sink is simplified, and the materials required for manufacturing the heat sink body and the heat sink fins are also reduced, thereby saving material resources and greatly reducing manufacturing costs.
  • heat dissipation fins may be disposed on the outer surface of the heat sink 30 according to actual application requirements, but the number of heat dissipation fins may be small. Setting the heat sink fins further enhances the heat sink's heat dissipation.
  • thermally conductive, thermally dissipating nanomaterials prepared in accordance with the method of the present invention in the heat dissipation system of LED lamps. It should be understood that the thermally conductive heat-dissipating nano material of the present invention can be applied to other heat conduction needs. In the case of heat dissipation, such as a flat-type heat sink with an electronic structure, the heat dissipation effect is also obtained, and the manufacturing process can be simplified and the manufacturing cost can be reduced.

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Abstract

提供一种导热散热纳米材料、其制备方法和散热系统。所述制备方法包括如下步骤:i)将复合物、乙酸叔丁酯和对氯三氟甲苯混合,其中复合物由高分子材料和具有导热散热性能的物质形成,该复合物的粒径为纳米级;ii)将步骤i)得到的混合物放在水中搅泮一段时间,即得到所述导热散热材料。将该导热散热纳米材料用于LED灯的散热系统中,可以简化制造工艺、节约原料,减小散热器的重量和体积。

Description

导热散热纳米材料、 其制备方法和散热系统 技术领域
本发明涉及导热散热领域, 更具体地说, 本发明涉及一种制备导热散热纳 米材料的方法、 由该方法获得的导热散热纳米材料以及包括该导热散热纳米材 料的散热系统。 技术背景
LED作为一种具有巨大发展潜力的固体发光光源, 以其寿命长、 结构牢固、 低功耗和外形尺寸灵活等优点受到人们越来越多的关注。近年来, LED灯具变得 越来越便宜, 因此逐渐取代传统的灯具应用在各种照明领域。 但是, LED灯本身 在工作时的发热量比较大, 若这些热量无法及时地散发出去, 则会降低照明装 置内各个部件的效率或寿命, 或者导致某些部件发生故障甚至熔化。 因此设计 和实施 LED照明装置时, 有效地散发 LED光源产生是主要考虑的因素之一。
众所周知, 热量的传递有三种方式: 对流、 传导和辐射。 目前 LED 照明装 置的散热系统设计主要包括:
1.对流或强制对流: 增加鳍片的数目以增大散热面积, 从而加强对流的传 热效果。 图 1示出了现有 LED灯的一种常用散热器 1, 在该散热器 1的外周面间 隔地设置多块鳍片 2, 其中鳍片 2是利用车床工艺制成的, 并且会对鳍片 2进行 着黑色处理以符合黑体辐射的散热特性。 这种散热方式, 使得 LED 照明装置的 体积增大, 重量增加, 但其散热能力的提高仍然有限, 同时生产成本与材料成 本都很高。
2.选用导热性好的材料, 例如选用导热率为 229w/mk 的纯铝, 导热率为 386w/mk的纯铜。
现时, 有些 LED照明装置在导热板与散热器之间的界面上涂一层散热硅胶。 由于硅胶干燥后变成颗粒状, 造成导热板与散热器之间的接触面无法密合而增 加接触面间的热阻, 致使光源与散热器界面间的传热能力大幅下降, 无法获得 良好散热的效果。
为提高 LED 照明装置的散热能力, 还会对散热器的表面进行处理。 这种处 理通常包括阳极氧化处理和涂黑色处理。 但这两种方法对 LED 灯具散热器的散 热能力改善不大, 尤其对于大功率的 LED照明装置。
纳米技术作为近年一门高新技术, 已在许多领域得到了应用。 纳米材料由 于具有表面效应、 体积效应和量子尺寸效应, 因此表现出许多奇异的物理和化 学特性, 例如熔点、 导电、 导热等等方面。 利用纳米材料作为导热散热材料, 已有很多报导。 但现有技术仍未能解决纳米粒子在溶剂中均匀分散的问题, 尤 其对于粒度小于 lnm的纳米粒子在溶剂中均匀分散的问题, 目前仍然是尚待解 决的难题之一。
现有的 LED照明装置由于散热结构笨重而复杂, 导致照明装置的体积较大, 制造工序繁复。 因此, 有需要对照明领域的 LED照明装置的散热系统作出改进。 本发明结合纳米材料提出了一种新颖的散热系统, 既能提高散热效能, 使照明 装置保持稳定的工作状态, 又能实现结构紧凑和轻巧, 而且成本低。 发明内容
本发明人惊奇地发现, 同时以乙酸叔丁酯(即 CAS#540885)和对氯三氟甲苯
(即 CAS#98566)作为分散剂,能够将粒径小于 lnm的纳米粒子均匀地分散在水溶 性溶剂如水中, 藉此获得的乳液具有优异的导热和散热性能。
本发明正是基于上述发现提出一种制备导热散热纳米材料的新工艺, 利用 该种工艺制备的导热散热纳米材料, 能够使 LED 照明装置内部产生的热量有效 地被快速散除。 因为散热效果非常好, 不必使用较大体积的散热结构, 甚至可 以消除现有散热结构常常采用的散热鳍片, 因此使整个 LED 照明装置的体积减 小, 重量变轻。
为实现上述目的, 本发明提供了一种制备导热散热纳米材料的方法, 所述 方法包括以下步骤:
i) 将由高分子材料与具有导热和散热性能的物质形成的复合物、 乙酸叔丁 酯和对氯三氟甲苯混合, 其中所述复合物的粒径为纳米级; 以及
ϋ) 将步骤 i)得到的混合物放在水中搅拌一段时间, 即得到所述导热散热 材料。
根据本发明, 所述具有导热和散热性能的物质可以是无机物或者有机物, 例如选自陶瓷、 碳、 石蜡、 二氧化硅或聚甲基硅氮垸。
较佳地, 所述复合物、 乙酸叔丁酯和对氯三氟甲苯按以下比例混合: 20-40 重量%复合物、 35-45重量%乙酸叔丁酯和 25-35重量%对氯三氟甲苯。 以水、 所 述复合物、 乙酸叔丁酯和对氯三氟甲苯的总重计, 本发明的方法中水的用量为 25-75重量%。
本发明所用的复合物的粒径小于 lnm。
根据本发明的方法,在步骤 i i)中只需将混合物常温常压搅拌 10至 20分钟, 即可得到所希望的导热散热纳米材料, 为乳液。
本发明第二方面涉及根据本发明的方法制备的导热散热纳米材料。
本发明第三方面提供一种照明装置的散热系统, 所述散热系统包括与照明 光源作可导热连接的导热板、 以及与所述导热板作热学连通的散热器, 其中, 在所述导热板与所述散热器接触的表面涂布根据本发明的方法所制备的导热散 热纳米材料, 和 /或在所述散热器的外表面涂布根据本发明的方法所制备的导热 散热纳米材料。
本发明一优选实施例中, 在所述导热板与所述散热器接触的表面涂抹的导 热散热纳米材料的厚度为 0. 3-2密尔 (Mi l), 在所述散热器的外表面涂布的导热 散热纳米材料的厚度为 0. 3-2密尔。
为了使涂布表面彻底清洁干净, 增加导热散热材料的的粘附效果和延长使 用寿命, 通常在涂布之前分别对所述导热板和所述散热器作喷砂清洁的预处理。
在本发明一实施例中, 所述照明光源为一或多个 LED。
在本发明另一实施例中, 所述散热器不设置散热鳍片或者设置小量散热鳍 片, 所述导热板和所述散热器由金属制成。
取决于选用哪种具有导热和散热性能的物质, 本发明获得的导热散热纳米 材料在导热性能和散热性能上有所不同。 例如, 由高分子材料与陶瓷形成的复 合物为原料获得的导热散热材料具有较高的导热性, 适合涂布在导热板与散热 器之间, 主要以热传导方式并辅以热辐射方式将 LED 光源产生的热量传递到散 热器。 而由高分子与二氧化硅形成的复合物为原料获得的导热散热材料具有较 高的辐射能力, 适合涂布在散热器的外表面上, 主要以辐射热量的方式将热量 散发至周围的空气中。 本发明的导热散热纳米材料具有粘性, 并且在半小时内就能自然固化, 因 此能够使导热板与散热器牢固地粘合在一起。
由于本发明导热散热材料的主要原料是纳米粒子, 尤其是粒径小于 lnm 的 粒子, 在作为分散剂的乙酸叔丁酯和对氯三氟甲苯存在下, 能够快速地均匀分 散在水性溶剂中, 获得了均一乳液。 本发明不但解决了纳米粒子在溶剂中均匀 分散的问题, 而且所获得的乳液具有卓越的导热和 /或散热性能。 将这种乳液涂 布在 LED 灯的导热板与散热器以及散热器的外表面之间, 结果发现该乳液形成 的涂层能够以较快的速度将照明光源产生的热量通过热传导和热对流方式带到 散热器的表面, 再以热辐射方式将热量散发至周围的空气中, 使得散热器具有 主动散热的效果。 因为本发明的导热散热纳米材料大大提高了 LED 灯的散热效 率, 在某些情况下甚至可以不必在散热器表面上设置鳍片, 由此获得的散热器 结构简单, 重量轻, 体积小, 并且节省了大量的原料成本。
如上所述, 取决于选用哪种具有导热和散热性能的物质, 本发明获得的导 热散热纳米材料在导热性能和散热性能上有所不同。 在导热板与散热器之间的 涂层可以选用导热性能较好的本发明材料, 如由高分子材料与陶瓷形成的复合 物为原料获得的导热散热材料。 至于散热器表面的涂层由于主要为辐射散热, 所以较佳地采用散热性能较好的本发明材料, 如高分子与二氧化硅形成的复合 物为原料获得的导热散热材料。 藉此, 可以获得更好的散热效果。
以下将结合附图对本发明的构思、 具体结构及产生的技术效果作进一步说 明, 以充分地了解本发明的目的、 特征和效果。 附图说明
图 1是现有 LED灯采用的一种散热器的示意图。
图 2是根据本发明一实施例的 LED灯的散热系统的示意图。
图 3根据本发明一实施例的一种散热器的示意图。 具体实施方式
作为示例说明, 本发明分别以粒径小于 lnm水溶性高分子陶瓷复合物和粒 径小于 lnm水溶性高分子二氧化硅复合物为原料制备本发明的导热散热纳米材 将购买获得的粒径小于 lnm水溶性高分子陶瓷复合物(水溶性高分子陶瓷复 合物可通过各种商业途径获得),与乙酸叔丁酯(即 CAS#540885)和对氯三氟甲苯 (即 CAS#98566)按照预定的比例混合, 然后一起放在水中, 常温常压下搅拌 10 至 20分钟左右, 即形成均一的粘性乳液, 为本发明的导热散热纳米材料。
以重量计, 按照以下比例将高分子陶瓷复合物、 乙酸叔丁酯和对氯三氟甲 苯混合:
高分子陶瓷复合物: 20-40%,
乙酸叔丁酯: 35-45%
对氯三氟甲苯: 25-35%。
使用的水量可以是 25-75重量%, 以水与上述三种物质的总重计。
按照一实施例, 将 30 重量%高分子陶瓷复合物、 35 重量%乙酸叔丁酯、 35 重量%对氯三氟甲苯混合, 放在水中搅拌, 得到水溶性高分子陶瓷乳液。 对该乳 液进行了测试, 其典型特性如下:
1.在 25°C 根据 Brookfield 7#测试方法测试它的粘度, 结果为 15秒;
2.在 25°C 测定的密度为 2.70-2.71 g / cm3;
3.工作温度为 - 40°C〜+200°C;
4.根据 ASTM D5470测定的导热系数为 8W / Mk;
5.根据 ASTM D149测定的电介质强度为 305V/mil;
6.根据 ASTM D257测定的体积电阻率为 1.65 X 10"ohm- cm;
7.在 200°C@24 hrs下测得的流血率(bleed)可靠性属性为 0.005%;
8.在 200°C@24 hrs下测得的蒸发量可靠性属性为 0.5%;
9. 2小时的裂解温度为 400°C; 以及
10. 在 25°C下散热速度 ΔΤ4热辐射效率达 10%。
由此可见, 本发明的水溶性高分子陶瓷具有较高的导热系数, 再加上其厚 度可以做得很薄, 例如可以做成大约 Ιμπι左右。 与常规导热体的厚度往往为毫 米数量级相比, 本发明的水溶性高分子陶瓷的厚度有了大幅度的降低, 因此是 优异的热传导体。
根据上述方法制备的高分子陶瓷乳液可直接涂布在 LED 灯的导热板上, 由 于其具有流动性, 能够进入各个零件之间的间隙, 固化后形成一层薄薄的致密 膜。 因为填塞了各个间隙, 有利于增大热传导和热对流效率。 而且由于该乳液 具有粘性, 能够将导热板与散热器粘合在一起。 自然风干后(大约 20分钟), 即 固化成为在导热板与散热器之间的导热涂层。
根据本发明, 水溶性高分子陶瓷导热涂层的厚度较佳为 0. 3-2 密尔, 更好 为 0. 5-1密尔。
类似地, 按照上述制备水溶性高分子陶瓷乳液的方法制备水溶性高分子二 氧化硅乳液。 具体地, 将购买获得的粒径小于 lnm水溶性高分子二氧化硅复合 物(水溶性高分子二氧化硅复合物也可通过各种商业途径获得), 与乙酸叔丁酯 (即 CAS#540885)和对氯三氟甲苯(g卩 CAS#98566)按照预定的比例混合, 较佳地 按照以下比例混合:
高分子二氧化硅复合物: 20-40%,
乙酸叔丁酯: 35-45%
对氯三氟甲苯: 25-35%。
然后将上述混合物放在水中, 常温常压下搅拌 10至 20分钟左右, 即形成 均一的粘性乳液。 使用的水量可以是 25-75重量%, 以水与上述三种物质的总重 计。
按照一实施例, 以 30重量%高分子二氧化硅复合物、 35重量%乙酸叔丁酯和 35重量%对氯三氟甲苯的比例配制本发明的水溶性高分子二氧化硅乳液。对该乳 液进行了测试, 其典型特性如下:
1.在 25 °C, 根据 #2 Zahn Cup 测试方法, 它的粘度为 12秒;
2.根据耐温度 Heat Stab i l i ty方法测定的耐温度为 980 ° C;
3.在 25 °C下散热速度 Δ Τ4热辐射效率高达 30-50%, 以及
4. 2小时的裂解温度 1000〜1300。C。
从上述特性可知, 本发明的水溶性高分子二氧化硅乳液具有卓越的热辐射 性能, 特别适合作为散热涂层涂布在 LED 灯的散热器外表面上, 以热辐射方式 将热量散发到周围的空气中。 本发明的水溶性高分子二氧化硅乳液具有绝热、 绝缘、 防锈、 抗酸碱盐、 磨擦等特点。
一般地, 散热器外表面的涂层为 0. 3-2密尔, 较佳地为 0. 5-1密尔。 对上 述水溶性高分子二氧化硅涂层进行了测试, 结果如下:
- 根据 ASTM D3363测定的涂层硬度 Penc i l Hardness为 9H;
- 根据 ASTM D3359测定的涂层牢固度为 5B;
- 根据 ASTM D522测定的涂层扭曲为 18 匪; 以及
- 根据 ASTM C2794测定的涂层撞击为 < 10磅。 现在参看图 2,图中示出了根据本发明一实施例的 LED灯的散热系统的示意 图。 所述 LED灯 100包括 LED光源 10、 用于承托所述 LED光源 10并与所述 LED 光源 10作可导热接触的导热板 20、 以及散热器 30。 所述 LED光源 10可以是一 或多个 LED芯片, 所述导热板 20和散热器 30可以由金属例如铝制造。 这些都 不是本发明的要点, 本处不做详细描述。 LED灯的其他结构与现有技术相同, 此 处也不再赘述。
根据本发明的 LED灯的散热系统, 特征在于在导热板 10与散热器 30之间 以及在散热器 30的外表面上涂布本发明的导热散热纳米材料。 在该实施例中, 在导热板 10与散热器之间涂布上述制备的水溶性高分子陶瓷乳液, 而在散热器 30 的外表面上涂布上述制备的水溶性高分子二氧化硅乳液。 为了使涂布表面彻 底清洁干净, 增加导热散热材料的的粘附效果和延长使用寿命, 在涂布之前往 往对所述导热板和所述散热器作喷砂清洁的预处理。
如图 2所示, 导热板 20与 LED光源 10是以热连通方式固定在一起的, 由 LED光源 10产生的热量传递到导热板 20, 经本发明的高分子陶瓷涂层 40 以热 传导和热对流方式传至散热器 30, 再通过散热器外表面上的高分子二氧化硅涂 层 50被快速地散除开去。
图 3示出了本发明采用的一种散热器 30的示意图。 如图所示, 该散热器 30 的外表面没有设置散热鳍片,这与现有技术是不同的。该散热器 30的壁厚约 lmm, 使用 T6063 铝合金以旋压工艺制造。 由于不设置散热鳍片, 所以制造散热器时 可以采用旋压、 压铸、 冲压、 锻压等工艺来代替车床工艺, 简化了散热器的制 造工序。 再者, 消除了散热鳍片也使得本发明的散热器 30重量减少四分之三以 上。 此外, 散热器 30也无需进行阳极氧化和着黑色等处理, 大大减少了制造成 本。 本发明已经对图 1所示的现有散热器 1和图 3所示的本发明的散热器 30的 散热性能进行了比较, 结果列于下表中:
Figure imgf000010_0001
* 本发明的散热器是在导热板与散热器之间涂布本发明的水溶性高分子陶 瓷乳液以及在散热器的外表面上涂布本发明的水溶性高分子二氧化硅乳液的情 况下进行测试的。 从上述对比实验可见, 本发明的 LED 灯具的散热器可以做得更薄更轻, 甚 至不需设置散热鳍片, 因此比具有鳍片的传统散热器重量至少降低 40-50%, 甚 至 75%。在导热板与散热器之间以及在散热器外表面上涂布了本发明的导热散热 材料, 即使不设置散热鳍片, 但散热器的散热能力比具有鳍片的传统散热器还 至少提升 20-30%。 此外, 散热器的加工工序简化了, 也减少了制造散热器本体 和散热鳍片所需的材料, 因此节约了原料资源, 大大降低了制造成本。
当然, 根据实际应用需要, 也可以在散热器 30的外表面上设置散热鳍片, 但散热鳍片的数目可以很小。 设置散热鳍片可进一步增强散热器的散热效果。
以上描述的是按照本发明的方法制备的导热散热纳米材料在 LED 灯的散热 系统中的应用。 应当明白, 本发明的导热散热纳米材料可应用在其他需要导热 和散热的场合, 例如电子结构的平板型散热器, 同样获得很好的散热效果, 而 且能够简化制造过程, 降低制造成本。
综合以上所述, 本说明书中所述的只是本发明的较佳具体实施例。 凡本技 术领域中技术人员依本发明的构思在现有技术的基础上通过逻辑分析、 推理或 者有限的实验可以得到的技术方案, 皆应在本发明的权利要求保护范围内。

Claims

权 利 要 求
1.一种制备导热散热纳米材料的方法, 其特征在于, 所述方法包括如下步 骤:
i) 将由高分子材料与具有导热和散热性能的物质形成的复合物、 乙酸叔丁 酯和对氯三氟甲苯混合, 其中所述复合物的粒径为纳米级; 以及
ϋ) 将步骤 i)得到的混合物放在水中搅拌一段时间, 即得到所述导热散热 材料。
2.如权利要求 1所述的方法, 其特征在于, 所述具有导热和散热性能的物 质选自陶瓷、 碳、 石蜡、 二氧化硅或聚甲基硅氮垸。
3.如权利要求 1所述的方法, 其特征在于, 所述复合物、 乙酸叔丁酯和对 氯三氟甲苯按以下比例混合: 20-40重量%复合物、 35-45重量%乙酸叔丁酯和 25-35重量%对氯三氟甲苯。
4.如权利要求 1所述的方法, 其特征在于, 以水、 所述复合物、 乙酸叔丁 酯和对氯三氟甲苯的总重计, 所述水的用量为 25-75重量%。
5.如权利要求 1所述的方法, 其特征在于, 所述复合物的粒径小于 lnm。
6.如权利要求 1所述的方法, 其特征在于, 在步骤 i i)中, 常温常压搅拌 10至 20分钟。
7.如权利要求 1所述的方法, 其特征在于, 所述得到的导热散热材料为乳 液。
8.一种如上述权利要求 1至 7中任一项所述的方法制备的导热散热纳米材 料。
9.一种照明装置的散热系统, 所述散热系统包括: 与照明光源作可导热连 接的导热板、 以及与所述导热板作热学连通的散热器, 其特征在于, 在所述导 热板与所述散热器接触的表面涂布如权利要求 8所述的导热散热纳米材料, 和 / 或在所述散热器的外表面涂布如权利要求 8所述的导热散热纳米材料。
10. 如权利要求 9所述的散热系统, 其特征在于, 所述照明光源为一或多 个 LED o
11. 如权利要求 9所述的散热系统, 其特征在于, 在所述导热板与所述散 热器接触的表面涂抹的导热散热材料的厚度为 0. 3-2密尔。
12. 如权利要求 9所述的散热系统, 其特征在于, 在所述散热器的外表面 涂布的导热散热材料的厚度为 0. 3-2密尔。
13. 如权利要求 9所述的散热系统, 其特征在于, 所述散热器不设置散热 鳍片。
14. 如权利要求 9所述的散热系统, 其特征在于, 所述导热板和所述散热 器由金属制成。
15. 如权利要求 9所述的散热系统, 其特征在于, 在涂布所述导热散热材 料之前, 分别对所述导热板和所述散热器作喷砂清洁的预处理。
16. 如权利要求 9所述的散热系统, 其特征在于, 在所述导热板与所述散 热器接触的表面涂布水溶性高分子陶瓷乳液, 和 /或在所述散热器的外表面涂布 水溶性高分子二氧化硅乳液。
PCT/CN2011/075580 2011-06-10 2011-06-10 导热散热纳米材料、其制备方法和散热系统 WO2012167440A1 (zh)

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PCT/CN2011/075580 WO2012167440A1 (zh) 2011-06-10 2011-06-10 导热散热纳米材料、其制备方法和散热系统

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