JP7704777B2 - 混合はんだ粉末を含む高温用途の無鉛はんだペースト - Google Patents

混合はんだ粉末を含む高温用途の無鉛はんだペースト Download PDF

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Publication number
JP7704777B2
JP7704777B2 JP2022566101A JP2022566101A JP7704777B2 JP 7704777 B2 JP7704777 B2 JP 7704777B2 JP 2022566101 A JP2022566101 A JP 2022566101A JP 2022566101 A JP2022566101 A JP 2022566101A JP 7704777 B2 JP7704777 B2 JP 7704777B2
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Prior art keywords
solder
alloy powder
solder alloy
weight
powder
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Japanese (ja)
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JP2023524690A (ja
JP2023524690A5 (https=
Inventor
ザン，ホンウェン
リトウェニック，サミュエル
ワン，フーグアン
ゲング，ジエ
ムツク，フランシス，エム．
リー，ニン－チェン
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インディウム コーポレーション
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/203—Fluxing, i.e. applying flux onto surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams or slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H10W70/417—Bonding materials between chips and die pads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07355—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H10W72/3528—Intermetallic compounds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
JP2022566101A 2020-04-29 2021-04-29 混合はんだ粉末を含む高温用途の無鉛はんだペースト Active JP7704777B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202063017469P 2020-04-29 2020-04-29
US63/017,469 2020-04-29
PCT/US2021/029871 WO2021222548A1 (en) 2020-04-29 2021-04-29 Lead-free solder paste with mixed solder powders for high temperature applications

Publications (3)

Publication Number Publication Date
JP2023524690A JP2023524690A (ja) 2023-06-13
JP2023524690A5 JP2023524690A5 (https=) 2024-02-29
JP7704777B2 true JP7704777B2 (ja) 2025-07-08

Family

ID=76012029

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JP2022566101A Active JP7704777B2 (ja) 2020-04-29 2021-04-29 混合はんだ粉末を含む高温用途の無鉛はんだペースト

Country Status (9)

Country Link
US (1) US11738411B2 (https=)
EP (1) EP4142978B1 (https=)
JP (1) JP7704777B2 (https=)
KR (1) KR102856123B1 (https=)
CN (1) CN115461188B (https=)
MY (1) MY208234A (https=)
PH (1) PH12022553232A1 (https=)
PL (1) PL4142978T3 (https=)
WO (1) WO2021222548A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6912742B1 (ja) * 2020-02-14 2021-08-04 千住金属工業株式会社 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、およびはんだ継手
KR20240019350A (ko) * 2021-06-11 2024-02-14 인듐 코포레이션 혼합 땜납 합금 분말을 갖는 고 신뢰성 무연 땜납 페이스트
CN119457561A (zh) * 2024-10-25 2025-02-18 东南大学 一种无铅焊膏及其焊接方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002001573A (ja) 2000-06-16 2002-01-08 Nippon Handa Kk 無鉛クリームはんだ、およびそれを使用した接着方法
JP2005340267A (ja) 2004-05-24 2005-12-08 Hitachi Ltd 半導体装置
JP2006190850A (ja) 2005-01-07 2006-07-20 Renesas Technology Corp 半導体装置およびその製造方法
WO2008004531A2 (en) 2006-07-05 2008-01-10 Fuji Electric Holdings Co., Ltd. Cream solder and method of soldering electronic part
WO2011027659A1 (ja) 2009-09-03 2011-03-10 株式会社村田製作所 ソルダペースト、それを用いた接合方法、および接合構造
WO2014181883A1 (ja) 2013-05-10 2014-11-13 富士電機株式会社 半導体装置および半導体装置の製造方法
US20150246417A1 (en) 2010-05-03 2015-09-03 Indium Corporation Mixed alloy solder paste
JP6601600B1 (ja) 2018-04-13 2019-11-06 千住金属工業株式会社 ソルダペースト

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3879582B2 (ja) * 2002-04-26 2007-02-14 千住金属工業株式会社 ソルダペースト、電子部品およびステップ・ソルダリング方法
EP2883649B1 (en) * 2012-08-10 2017-04-19 Senju Metal Industry Co., Ltd High-temperature lead-free solder alloy
CN105307812B (zh) * 2013-04-09 2018-03-27 千住金属工业株式会社 焊膏
KR101913994B1 (ko) * 2015-03-10 2018-12-28 인듐 코포레이션 혼합 합금 땜납 페이스트
JP6975708B2 (ja) * 2015-04-28 2021-12-01 オルメット・サーキッツ・インコーポレイテッド 半導体ダイ接着用途のための高金属負荷量の焼結ペースト

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002001573A (ja) 2000-06-16 2002-01-08 Nippon Handa Kk 無鉛クリームはんだ、およびそれを使用した接着方法
JP2005340267A (ja) 2004-05-24 2005-12-08 Hitachi Ltd 半導体装置
JP2006190850A (ja) 2005-01-07 2006-07-20 Renesas Technology Corp 半導体装置およびその製造方法
WO2008004531A2 (en) 2006-07-05 2008-01-10 Fuji Electric Holdings Co., Ltd. Cream solder and method of soldering electronic part
WO2011027659A1 (ja) 2009-09-03 2011-03-10 株式会社村田製作所 ソルダペースト、それを用いた接合方法、および接合構造
US20150246417A1 (en) 2010-05-03 2015-09-03 Indium Corporation Mixed alloy solder paste
WO2014181883A1 (ja) 2013-05-10 2014-11-13 富士電機株式会社 半導体装置および半導体装置の製造方法
JP6601600B1 (ja) 2018-04-13 2019-11-06 千住金属工業株式会社 ソルダペースト

Also Published As

Publication number Publication date
CN115461188B (zh) 2025-01-24
JP2023524690A (ja) 2023-06-13
US20210339344A1 (en) 2021-11-04
CN115461188A (zh) 2022-12-09
PL4142978T3 (pl) 2025-12-22
KR20230015361A (ko) 2023-01-31
US11738411B2 (en) 2023-08-29
KR102856123B1 (ko) 2025-09-04
EP4142978A1 (en) 2023-03-08
PH12022553232A1 (en) 2024-04-22
EP4142978B1 (en) 2025-09-03
EP4142978C0 (en) 2025-09-03
MY208234A (en) 2025-04-25
WO2021222548A1 (en) 2021-11-04

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