JP7695886B2 - レーザ加工装置 - Google Patents

レーザ加工装置 Download PDF

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Publication number
JP7695886B2
JP7695886B2 JP2021556090A JP2021556090A JP7695886B2 JP 7695886 B2 JP7695886 B2 JP 7695886B2 JP 2021556090 A JP2021556090 A JP 2021556090A JP 2021556090 A JP2021556090 A JP 2021556090A JP 7695886 B2 JP7695886 B2 JP 7695886B2
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Japan
Prior art keywords
light
laser
processing
wavelength
workpiece
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JP2021556090A
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English (en)
Japanese (ja)
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JPWO2021095699A1 (https=
JPWO2021095699A5 (https=
Inventor
真治 吉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nuvoton Technology Corp Japan
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Nuvoton Technology Corp Japan
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Publication of JPWO2021095699A5 publication Critical patent/JPWO2021095699A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
    • G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B23K26/24—Seam welding
    • B23K26/244—Overlap seam welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/32—Bonding taking account of the properties of the material involved
    • B23K26/323—Bonding taking account of the properties of the material involved involving parts made of dissimilar metallic material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/06—Illumination; Optics
    • G01N2201/061—Sources
    • G01N2201/06113—Coherent sources; lasers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/06—Illumination; Optics
    • G01N2201/062—LED's

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Biochemistry (AREA)
  • Analytical Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Laser Beam Processing (AREA)
JP2021556090A 2019-11-13 2020-11-09 レーザ加工装置 Active JP7695886B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019205117 2019-11-13
JP2019205117 2019-11-13
PCT/JP2020/041786 WO2021095699A1 (ja) 2019-11-13 2020-11-09 レーザ加工装置

Publications (3)

Publication Number Publication Date
JPWO2021095699A1 JPWO2021095699A1 (https=) 2021-05-20
JPWO2021095699A5 JPWO2021095699A5 (https=) 2022-07-12
JP7695886B2 true JP7695886B2 (ja) 2025-06-19

Family

ID=75912956

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021556090A Active JP7695886B2 (ja) 2019-11-13 2020-11-09 レーザ加工装置

Country Status (3)

Country Link
US (1) US20220266379A1 (https=)
JP (1) JP7695886B2 (https=)
WO (1) WO2021095699A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230127791A1 (en) * 2021-10-22 2023-04-27 Embry-Riddle Aeronautical University, Inc. Laser machining and related control for additive manufacturing
US20230377313A1 (en) * 2022-05-18 2023-11-23 Hitachi, Ltd. State detection apparatus
JP2024002820A (ja) * 2022-06-24 2024-01-11 株式会社タマリ工業 レーザ溶接装置
WO2024105852A1 (ja) * 2022-11-17 2024-05-23 株式会社ニコン 加工システム
IT202200026064A1 (it) * 2022-12-20 2024-06-20 Adige Spa Procedimento di lavorazione laser di un materiale metallico basato sulla determinazione automatica del materiale o dei parametri di lavorazione
DE102023135197A1 (de) * 2023-12-14 2025-06-18 TRUMPF Laser SE DWM in SSL zur Parallelisierung
WO2026027464A1 (en) * 2024-07-31 2026-02-05 Atop S.P.A. Laser welding station and method for welding together elements of metal manufactured products

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004058140A (ja) 2002-07-31 2004-02-26 Matsushita Electric Ind Co Ltd レーザスポット溶接方法及びレーザスポット溶接装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5272309A (en) * 1990-08-01 1993-12-21 Microelectronics And Computer Technology Corporation Bonding metal members with multiple laser beams
US6940592B2 (en) * 2001-10-09 2005-09-06 Applied Materials, Inc. Calibration as well as measurement on the same workpiece during fabrication
WO2005029016A2 (en) * 2003-03-13 2005-03-31 University Of Florida Material identification employing a grating spectrometer
EP1618984B1 (de) * 2004-07-08 2006-09-06 TRUMPF Laser GmbH + Co. KG Laserschweissverfahren und -vorrichtung
US8822875B2 (en) * 2010-09-25 2014-09-02 Queen's University At Kingston Methods and systems for coherent imaging and feedback control for modification of materials
JP5252026B2 (ja) * 2011-05-10 2013-07-31 パナソニック株式会社 レーザ溶接装置及びレーザ溶接方法
EP2567773B1 (de) * 2011-09-08 2017-04-19 TRUMPF Werkzeugmaschinen GmbH + Co. KG Verfahren zum überprüfen der nahtqualität während eines laserschweissprozesses
EP3110592B1 (en) * 2014-02-28 2020-01-15 IPG Photonics Corporation Multple-laser distinct wavelengths and pulse durations processing
DE102014212682A1 (de) * 2014-07-01 2016-01-07 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Verfahren und Vorrichtung zum Bestimmen einer Werkstoffart und/oder einer Oberflächenbeschaffenheit eines Werkstücks
JP6373714B2 (ja) * 2014-10-14 2018-08-15 株式会社アマダホールディングス ダイレクトダイオードレーザ加工装置及びその出力監視方法
JP6294378B2 (ja) * 2016-03-30 2018-03-14 ファナック株式会社 前加工制御部を備えるレーザ加工装置及びレーザ加工方法
JP7076951B2 (ja) * 2017-05-23 2022-05-30 株式会社ディスコ 反射率検出装置
JP6717790B2 (ja) * 2017-09-14 2020-07-08 ファナック株式会社 レーザ加工中に光学系の汚染レベルに応じて焦点シフトを調整するレーザ加工装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004058140A (ja) 2002-07-31 2004-02-26 Matsushita Electric Ind Co Ltd レーザスポット溶接方法及びレーザスポット溶接装置

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Publication number Publication date
US20220266379A1 (en) 2022-08-25
JPWO2021095699A1 (https=) 2021-05-20
WO2021095699A1 (ja) 2021-05-20

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