JPWO2021095699A5 - - Google Patents

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JPWO2021095699A5
JPWO2021095699A5 JP2021556090A JP2021556090A JPWO2021095699A5 JP WO2021095699 A5 JPWO2021095699 A5 JP WO2021095699A5 JP 2021556090 A JP2021556090 A JP 2021556090A JP 2021556090 A JP2021556090 A JP 2021556090A JP WO2021095699 A5 JPWO2021095699 A5 JP WO2021095699A5
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Japan
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laser
light
wavelength
processing
signal light
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JP2021556090A
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Japanese (ja)
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JP7695886B2 (ja
JPWO2021095699A1 (https=
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Priority claimed from PCT/JP2020/041786 external-priority patent/WO2021095699A1/ja
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JP2021556090A 2019-11-13 2020-11-09 レーザ加工装置 Active JP7695886B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019205117 2019-11-13
JP2019205117 2019-11-13
PCT/JP2020/041786 WO2021095699A1 (ja) 2019-11-13 2020-11-09 レーザ加工装置

Publications (3)

Publication Number Publication Date
JPWO2021095699A1 JPWO2021095699A1 (https=) 2021-05-20
JPWO2021095699A5 true JPWO2021095699A5 (https=) 2022-07-12
JP7695886B2 JP7695886B2 (ja) 2025-06-19

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JP2021556090A Active JP7695886B2 (ja) 2019-11-13 2020-11-09 レーザ加工装置

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US (1) US20220266379A1 (https=)
JP (1) JP7695886B2 (https=)
WO (1) WO2021095699A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230127791A1 (en) * 2021-10-22 2023-04-27 Embry-Riddle Aeronautical University, Inc. Laser machining and related control for additive manufacturing
US20230377313A1 (en) * 2022-05-18 2023-11-23 Hitachi, Ltd. State detection apparatus
JP2024002820A (ja) * 2022-06-24 2024-01-11 株式会社タマリ工業 レーザ溶接装置
WO2024105852A1 (ja) * 2022-11-17 2024-05-23 株式会社ニコン 加工システム
IT202200026064A1 (it) * 2022-12-20 2024-06-20 Adige Spa Procedimento di lavorazione laser di un materiale metallico basato sulla determinazione automatica del materiale o dei parametri di lavorazione
DE102023135197A1 (de) * 2023-12-14 2025-06-18 TRUMPF Laser SE DWM in SSL zur Parallelisierung
WO2026027464A1 (en) * 2024-07-31 2026-02-05 Atop S.P.A. Laser welding station and method for welding together elements of metal manufactured products

Family Cites Families (14)

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Publication number Priority date Publication date Assignee Title
US5272309A (en) * 1990-08-01 1993-12-21 Microelectronics And Computer Technology Corporation Bonding metal members with multiple laser beams
US6940592B2 (en) * 2001-10-09 2005-09-06 Applied Materials, Inc. Calibration as well as measurement on the same workpiece during fabrication
JP4098024B2 (ja) * 2002-07-31 2008-06-11 松下電器産業株式会社 レーザスポット溶接方法
WO2005029016A2 (en) * 2003-03-13 2005-03-31 University Of Florida Material identification employing a grating spectrometer
EP1618984B1 (de) * 2004-07-08 2006-09-06 TRUMPF Laser GmbH + Co. KG Laserschweissverfahren und -vorrichtung
US8822875B2 (en) * 2010-09-25 2014-09-02 Queen's University At Kingston Methods and systems for coherent imaging and feedback control for modification of materials
JP5252026B2 (ja) * 2011-05-10 2013-07-31 パナソニック株式会社 レーザ溶接装置及びレーザ溶接方法
EP2567773B1 (de) * 2011-09-08 2017-04-19 TRUMPF Werkzeugmaschinen GmbH + Co. KG Verfahren zum überprüfen der nahtqualität während eines laserschweissprozesses
EP3110592B1 (en) * 2014-02-28 2020-01-15 IPG Photonics Corporation Multple-laser distinct wavelengths and pulse durations processing
DE102014212682A1 (de) * 2014-07-01 2016-01-07 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Verfahren und Vorrichtung zum Bestimmen einer Werkstoffart und/oder einer Oberflächenbeschaffenheit eines Werkstücks
JP6373714B2 (ja) * 2014-10-14 2018-08-15 株式会社アマダホールディングス ダイレクトダイオードレーザ加工装置及びその出力監視方法
JP6294378B2 (ja) * 2016-03-30 2018-03-14 ファナック株式会社 前加工制御部を備えるレーザ加工装置及びレーザ加工方法
JP7076951B2 (ja) * 2017-05-23 2022-05-30 株式会社ディスコ 反射率検出装置
JP6717790B2 (ja) * 2017-09-14 2020-07-08 ファナック株式会社 レーザ加工中に光学系の汚染レベルに応じて焦点シフトを調整するレーザ加工装置

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