JP7693428B2 - 回路モジュール及び電子機器 - Google Patents

回路モジュール及び電子機器 Download PDF

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Publication number
JP7693428B2
JP7693428B2 JP2021115607A JP2021115607A JP7693428B2 JP 7693428 B2 JP7693428 B2 JP 7693428B2 JP 2021115607 A JP2021115607 A JP 2021115607A JP 2021115607 A JP2021115607 A JP 2021115607A JP 7693428 B2 JP7693428 B2 JP 7693428B2
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conductor
circuit module
conductor pattern
substrate
module according
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Japanese (ja)
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JP2023012133A (ja
JP2023012133A5 (https=
Inventor
栄治 八木
浩之 山口
邦彦 内田
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Canon Inc
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Canon Inc
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JP2021115607A 2021-07-13 2021-07-13 回路モジュール及び電子機器 Active JP7693428B2 (ja)

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JP2021115607A JP7693428B2 (ja) 2021-07-13 2021-07-13 回路モジュール及び電子機器

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JP2021115607A JP7693428B2 (ja) 2021-07-13 2021-07-13 回路モジュール及び電子機器

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JP2023012133A JP2023012133A (ja) 2023-01-25
JP2023012133A5 JP2023012133A5 (https=) 2024-07-19
JP7693428B2 true JP7693428B2 (ja) 2025-06-17

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Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001230605A (ja) 2000-02-17 2001-08-24 Toyota Central Res & Dev Lab Inc 高周波伝送線路
JP2006339293A (ja) 2005-05-31 2006-12-14 Sanyo Electric Co Ltd 回路モジュール
JP2013214578A (ja) 2012-03-30 2013-10-17 Ibiden Co Ltd 配線板及びその製造方法
JP2014099507A (ja) 2012-11-14 2014-05-29 Fuji Xerox Co Ltd 多層配線基板
JP2017112330A (ja) 2015-12-18 2017-06-22 ルネサスエレクトロニクス株式会社 半導体装置
JP2017228691A (ja) 2016-06-23 2017-12-28 富士通株式会社 半導体装置及びその製造方法
JP2018093107A (ja) 2016-12-06 2018-06-14 ルネサスエレクトロニクス株式会社 半導体装置
JP2018181967A (ja) 2017-04-07 2018-11-15 キヤノン株式会社 電子機器
JP2019040925A (ja) 2017-08-22 2019-03-14 キヤノン株式会社 プリント回路板、プリント配線板及び電子機器
JP2020088375A (ja) 2018-11-14 2020-06-04 サムソン エレクトロ−メカニックス カンパニーリミテッド． インターポーザ及びこれを含むパッケージ構造物

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3181036B2 (ja) * 1998-05-29 2001-07-03 京セラ株式会社 高周波用パッケージの実装構造

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001230605A (ja) 2000-02-17 2001-08-24 Toyota Central Res & Dev Lab Inc 高周波伝送線路
JP2006339293A (ja) 2005-05-31 2006-12-14 Sanyo Electric Co Ltd 回路モジュール
JP2013214578A (ja) 2012-03-30 2013-10-17 Ibiden Co Ltd 配線板及びその製造方法
JP2014099507A (ja) 2012-11-14 2014-05-29 Fuji Xerox Co Ltd 多層配線基板
JP2017112330A (ja) 2015-12-18 2017-06-22 ルネサスエレクトロニクス株式会社 半導体装置
JP2017228691A (ja) 2016-06-23 2017-12-28 富士通株式会社 半導体装置及びその製造方法
JP2018093107A (ja) 2016-12-06 2018-06-14 ルネサスエレクトロニクス株式会社 半導体装置
JP2018181967A (ja) 2017-04-07 2018-11-15 キヤノン株式会社 電子機器
JP2019040925A (ja) 2017-08-22 2019-03-14 キヤノン株式会社 プリント回路板、プリント配線板及び電子機器
JP2020088375A (ja) 2018-11-14 2020-06-04 サムソン エレクトロ−メカニックス カンパニーリミテッド． インターポーザ及びこれを含むパッケージ構造物

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JP2023012133A (ja) 2023-01-25

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