JP7693228B2 - 液状コンプレッションモールド材 - Google Patents

液状コンプレッションモールド材 Download PDF

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Publication number
JP7693228B2
JP7693228B2 JP2022532340A JP2022532340A JP7693228B2 JP 7693228 B2 JP7693228 B2 JP 7693228B2 JP 2022532340 A JP2022532340 A JP 2022532340A JP 2022532340 A JP2022532340 A JP 2022532340A JP 7693228 B2 JP7693228 B2 JP 7693228B2
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JP
Japan
Prior art keywords
component
compression molding
lcm
lcm material
diglycidyl ether
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JP2022532340A
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English (en)
Japanese (ja)
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JPWO2021261064A5 (https=
JPWO2021261064A1 (https=
Inventor
真 鈴木
剛 上村
洋介 酒井
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Namics Corp
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Namics Corp
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Publication of JPWO2021261064A1 publication Critical patent/JPWO2021261064A1/ja
Publication of JPWO2021261064A5 publication Critical patent/JPWO2021261064A5/ja
Priority to JP2025089793A priority Critical patent/JP2025124779A/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/003—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor characterised by the choice of material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • C08G59/1444—Monoalcohols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2063/00—Use of EP, i.e. epoxy resins or derivatives thereof, as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/0094—Condition, form or state of moulded material or of the material to be shaped having particular viscosity
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Emergency Medicine (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2022532340A 2020-06-23 2021-04-20 液状コンプレッションモールド材 Active JP7693228B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025089793A JP2025124779A (ja) 2020-06-23 2025-05-29 液状コンプレッションモールド材

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020107776 2020-06-23
JP2020107776 2020-06-23
PCT/JP2021/016031 WO2021261064A1 (ja) 2020-06-23 2021-04-20 液状コンプレッションモールド材

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025089793A Division JP2025124779A (ja) 2020-06-23 2025-05-29 液状コンプレッションモールド材

Publications (3)

Publication Number Publication Date
JPWO2021261064A1 JPWO2021261064A1 (https=) 2021-12-30
JPWO2021261064A5 JPWO2021261064A5 (https=) 2024-03-18
JP7693228B2 true JP7693228B2 (ja) 2025-06-17

Family

ID=79282392

Family Applications (2)

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JP2022532340A Active JP7693228B2 (ja) 2020-06-23 2021-04-20 液状コンプレッションモールド材
JP2025089793A Pending JP2025124779A (ja) 2020-06-23 2025-05-29 液状コンプレッションモールド材

Family Applications After (1)

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JP2025089793A Pending JP2025124779A (ja) 2020-06-23 2025-05-29 液状コンプレッションモールド材

Country Status (6)

Country Link
US (1) US20230203236A1 (https=)
JP (2) JP7693228B2 (https=)
KR (1) KR20230028272A (https=)
CN (1) CN115668484A (https=)
TW (1) TWI883181B (https=)
WO (1) WO2021261064A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024134951A1 (ja) * 2022-12-23 2024-06-27 ナミックス株式会社 エポキシ樹脂組成物、硬化物、及び半導体装置
JP2024141554A (ja) * 2023-03-29 2024-10-10 信越化学工業株式会社 エポキシ樹脂組成物
WO2025109864A1 (ja) * 2023-11-24 2025-05-30 ナミックス株式会社 半導体装置の製造方法及び封止体
JP7671555B1 (ja) * 2023-11-24 2025-05-02 ナミックス株式会社 半導体装置の製造方法及び封止体
JP7606797B1 (ja) * 2024-03-26 2024-12-26 ナミックス株式会社 液状コンプレッションモールド材、電子部品、半導体装置および電子部品の製造方法
WO2025203722A1 (ja) * 2024-03-26 2025-10-02 ナミックス株式会社 液状コンプレッションモールド材、電子部品、半導体装置および電子部品の製造方法
WO2026009778A1 (ja) * 2024-07-03 2026-01-08 ナミックス株式会社 エポキシ樹脂組成物、硬化物、半導体装置、及び半導体装置の製造方法
WO2026009780A1 (ja) * 2024-07-03 2026-01-08 ナミックス株式会社 エポキシ樹脂組成物、硬化物、半導体装置、及び半導体装置の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004087852A (ja) 2002-08-27 2004-03-18 Matsushita Electric Works Ltd 半導体装置の製造方法及び半導体装置
WO2018221682A1 (ja) 2017-05-31 2018-12-06 日立化成株式会社 圧縮成型用液状樹脂組成物及び電子部品装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01188519A (ja) * 1988-01-22 1989-07-27 Toshiba Corp エポキシ樹脂組成物及びそれを用いた樹脂封止型半導体装置
JP3430150B2 (ja) * 2000-12-18 2003-07-28 日東電工株式会社 光半導体素子封止用エポキシ樹脂組成物の製造方法
JP2011089025A (ja) * 2009-10-22 2011-05-06 Kyocera Chemical Corp 一液性エポキシ樹脂組成物、及びそれを用いてなるウエハレベルチップサイズパッケージ用半導体装置の製造方法
JP6196138B2 (ja) 2013-11-29 2017-09-13 ナミックス株式会社 半導体封止剤および半導体装置
JP6233441B2 (ja) * 2016-04-15 2017-11-22 日立化成株式会社 液状エポキシ樹脂組成物及び電子部品装置
KR102725565B1 (ko) * 2016-10-14 2024-11-05 가부시끼가이샤 레조낙 밀봉용 수지 조성물, 전자 부품 장치 및 전자 부품 장치의 제조 방법
JP6829462B2 (ja) * 2017-02-21 2021-02-10 ナミックス株式会社 液状エポキシ樹脂封止材
PT3620481T (pt) 2017-05-31 2024-04-08 Namics Corp Composição de resina líquida para selagem e dispositivo de componentes eletrónicos

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004087852A (ja) 2002-08-27 2004-03-18 Matsushita Electric Works Ltd 半導体装置の製造方法及び半導体装置
WO2018221682A1 (ja) 2017-05-31 2018-12-06 日立化成株式会社 圧縮成型用液状樹脂組成物及び電子部品装置

Also Published As

Publication number Publication date
US20230203236A1 (en) 2023-06-29
KR20230028272A (ko) 2023-02-28
WO2021261064A1 (ja) 2021-12-30
TW202210547A (zh) 2022-03-16
JP2025124779A (ja) 2025-08-26
TWI883181B (zh) 2025-05-11
JPWO2021261064A1 (https=) 2021-12-30
CN115668484A (zh) 2023-01-31

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