TWI883181B - 液狀壓縮成型材 - Google Patents

液狀壓縮成型材 Download PDF

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Publication number
TWI883181B
TWI883181B TW110114175A TW110114175A TWI883181B TW I883181 B TWI883181 B TW I883181B TW 110114175 A TW110114175 A TW 110114175A TW 110114175 A TW110114175 A TW 110114175A TW I883181 B TWI883181 B TW I883181B
Authority
TW
Taiwan
Prior art keywords
component
compression molding
lcm
lcm material
molding material
Prior art date
Application number
TW110114175A
Other languages
English (en)
Chinese (zh)
Other versions
TW202210547A (zh
Inventor
Makoto Suzuki
上村剛
酒井洋介
Original Assignee
日商納美仕有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商納美仕有限公司 filed Critical 日商納美仕有限公司
Publication of TW202210547A publication Critical patent/TW202210547A/zh
Application granted granted Critical
Publication of TWI883181B publication Critical patent/TWI883181B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/003—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor characterised by the choice of material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • C08G59/1444—Monoalcohols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2063/00—Use of EP, i.e. epoxy resins or derivatives thereof, as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/0094—Condition, form or state of moulded material or of the material to be shaped having particular viscosity
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Emergency Medicine (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
TW110114175A 2020-06-23 2021-04-20 液狀壓縮成型材 TWI883181B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-107776 2020-06-23
JP2020107776 2020-06-23

Publications (2)

Publication Number Publication Date
TW202210547A TW202210547A (zh) 2022-03-16
TWI883181B true TWI883181B (zh) 2025-05-11

Family

ID=79282392

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110114175A TWI883181B (zh) 2020-06-23 2021-04-20 液狀壓縮成型材

Country Status (6)

Country Link
US (1) US20230203236A1 (https=)
JP (2) JP7693228B2 (https=)
KR (1) KR20230028272A (https=)
CN (1) CN115668484A (https=)
TW (1) TWI883181B (https=)
WO (1) WO2021261064A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20250125937A (ko) * 2022-12-23 2025-08-22 나믹스 가부시끼가이샤 에폭시 수지 조성물, 경화물, 및 반도체 장치
JP2024141554A (ja) * 2023-03-29 2024-10-10 信越化学工業株式会社 エポキシ樹脂組成物
JP7671555B1 (ja) * 2023-11-24 2025-05-02 ナミックス株式会社 半導体装置の製造方法及び封止体
WO2025109864A1 (ja) * 2023-11-24 2025-05-30 ナミックス株式会社 半導体装置の製造方法及び封止体
WO2025203722A1 (ja) * 2024-03-26 2025-10-02 ナミックス株式会社 液状コンプレッションモールド材、電子部品、半導体装置および電子部品の製造方法
JP7606797B1 (ja) * 2024-03-26 2024-12-26 ナミックス株式会社 液状コンプレッションモールド材、電子部品、半導体装置および電子部品の製造方法
WO2026009780A1 (ja) * 2024-07-03 2026-01-08 ナミックス株式会社 エポキシ樹脂組成物、硬化物、半導体装置、及び半導体装置の製造方法
WO2026009778A1 (ja) * 2024-07-03 2026-01-08 ナミックス株式会社 エポキシ樹脂組成物、硬化物、半導体装置、及び半導体装置の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004087852A (ja) * 2002-08-27 2004-03-18 Matsushita Electric Works Ltd 半導体装置の製造方法及び半導体装置
CN110770275A (zh) * 2017-05-31 2020-02-07 日立化成株式会社 压缩成型用液状树脂组合物及电子部件装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01188519A (ja) * 1988-01-22 1989-07-27 Toshiba Corp エポキシ樹脂組成物及びそれを用いた樹脂封止型半導体装置
JP3430150B2 (ja) * 2000-12-18 2003-07-28 日東電工株式会社 光半導体素子封止用エポキシ樹脂組成物の製造方法
JP2011089025A (ja) * 2009-10-22 2011-05-06 Kyocera Chemical Corp 一液性エポキシ樹脂組成物、及びそれを用いてなるウエハレベルチップサイズパッケージ用半導体装置の製造方法
JP6196138B2 (ja) 2013-11-29 2017-09-13 ナミックス株式会社 半導体封止剤および半導体装置
JP6233441B2 (ja) * 2016-04-15 2017-11-22 日立化成株式会社 液状エポキシ樹脂組成物及び電子部品装置
JP7231821B2 (ja) * 2016-10-14 2023-03-02 株式会社レゾナック 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法
JP6829462B2 (ja) * 2017-02-21 2021-02-10 ナミックス株式会社 液状エポキシ樹脂封止材
EP3620481B1 (en) 2017-05-31 2024-03-27 Resonac Corporation Liquid resin composition for sealing and electronic component apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004087852A (ja) * 2002-08-27 2004-03-18 Matsushita Electric Works Ltd 半導体装置の製造方法及び半導体装置
CN110770275A (zh) * 2017-05-31 2020-02-07 日立化成株式会社 压缩成型用液状树脂组合物及电子部件装置

Also Published As

Publication number Publication date
JP7693228B2 (ja) 2025-06-17
KR20230028272A (ko) 2023-02-28
WO2021261064A1 (ja) 2021-12-30
CN115668484A (zh) 2023-01-31
JP2025124779A (ja) 2025-08-26
TW202210547A (zh) 2022-03-16
US20230203236A1 (en) 2023-06-29
JPWO2021261064A1 (https=) 2021-12-30

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