JP7684278B2 - スルホニウム塩、光酸発生剤、硬化性組成物およびレジスト組成物 - Google Patents
スルホニウム塩、光酸発生剤、硬化性組成物およびレジスト組成物 Download PDFInfo
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- JP7684278B2 JP7684278B2 JP2022508074A JP2022508074A JP7684278B2 JP 7684278 B2 JP7684278 B2 JP 7684278B2 JP 2022508074 A JP2022508074 A JP 2022508074A JP 2022508074 A JP2022508074 A JP 2022508074A JP 7684278 B2 JP7684278 B2 JP 7684278B2
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C309/00—Sulfonic acids; Halides, esters, or anhydrides thereof
- C07C309/01—Sulfonic acids
- C07C309/02—Sulfonic acids having sulfo groups bound to acyclic carbon atoms
- C07C309/03—Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton
- C07C309/06—Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton containing halogen atoms, or nitro or nitroso groups bound to the carbon skeleton
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C381/00—Compounds containing carbon and sulfur and having functional groups not covered by groups C07C301/00 - C07C337/00
- C07C381/12—Sulfonium compounds
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F5/00—Compounds containing elements of Groups 3 or 13 of the Periodic Table
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F5/00—Compounds containing elements of Groups 3 or 13 of the Periodic Table
- C07F5/02—Boron compounds
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
- C07F7/1804—Compounds having Si-O-C linkages
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F9/00—Compounds containing elements of Groups 5 or 15 of the Periodic Table
- C07F9/02—Phosphorus compounds
- C07F9/28—Phosphorus compounds with one or more P—C bonds
- C07F9/535—Organo-phosphoranes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0042—Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C2603/00—Systems containing at least three condensed rings
- C07C2603/02—Ortho- or ortho- and peri-condensed systems
- C07C2603/04—Ortho- or ortho- and peri-condensed systems containing three rings
- C07C2603/22—Ortho- or ortho- and peri-condensed systems containing three rings containing only six-membered rings
- C07C2603/24—Anthracenes; Hydrogenated anthracenes
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- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Molecular Biology (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020046335 | 2020-03-17 | ||
| JP2020046335 | 2020-03-17 | ||
| PCT/JP2021/000009 WO2021186846A1 (ja) | 2020-03-17 | 2021-01-04 | スルホニウム塩、光酸発生剤、硬化性組成物およびレジスト組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2021186846A1 JPWO2021186846A1 (https=) | 2021-09-23 |
| JP7684278B2 true JP7684278B2 (ja) | 2025-05-27 |
Family
ID=77770775
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022508074A Active JP7684278B2 (ja) | 2020-03-17 | 2021-01-04 | スルホニウム塩、光酸発生剤、硬化性組成物およびレジスト組成物 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US12461444B2 (https=) |
| EP (1) | EP4122915A4 (https=) |
| JP (1) | JP7684278B2 (https=) |
| KR (1) | KR102916118B1 (https=) |
| CN (1) | CN114901638B (https=) |
| WO (1) | WO2021186846A1 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7659419B2 (ja) * | 2020-04-22 | 2025-04-09 | 住友化学株式会社 | カルボン酸塩、カルボン酸発生剤、レジスト組成物及びレジストパターンの製造方法 |
| JP7744148B2 (ja) * | 2020-04-22 | 2025-09-25 | 住友化学株式会社 | 塩、酸発生剤、レジスト組成物及びレジストパターンの製造方法 |
| JP7790991B2 (ja) * | 2021-02-12 | 2025-12-23 | 住友化学株式会社 | 塩、酸発生剤、レジスト組成物及びレジストパターンの製造方法 |
| JP2025113834A (ja) * | 2024-01-23 | 2025-08-04 | 信越化学工業株式会社 | ケイ素含有スルホニウム塩化合物、ケイ素含有レジスト下層膜形成用組成物、及びパターン形成方法 |
| CN120441461A (zh) * | 2025-07-03 | 2025-08-08 | 天津久瑞盛科技有限公司 | 一种二芳基硫醚类光引发剂及其制备方法和应用 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007003507A1 (en) | 2005-07-01 | 2007-01-11 | Ciba Specialty Chemicals Holding Inc. | Sulphonium salt initiators |
| JP2008120700A (ja) | 2006-11-08 | 2008-05-29 | San Apro Kk | スルホニウム塩 |
| WO2011016425A1 (ja) | 2009-08-03 | 2011-02-10 | サンアプロ株式会社 | 光酸発生剤,光硬化性組成物,及びその硬化体 |
| JP2012027290A (ja) | 2010-07-26 | 2012-02-09 | San Apro Kk | 化学増幅型ネガ型フォトレジスト組成物 |
| WO2018003470A1 (ja) | 2016-06-29 | 2018-01-04 | サンアプロ株式会社 | スルホニウム塩、光酸発生剤、光硬化性組成物、及びその硬化体 |
| WO2019225185A1 (ja) | 2018-05-25 | 2019-11-28 | サンアプロ株式会社 | スルホニウム塩、光酸発生剤、硬化性組成物およびレジスト組成物 |
| WO2020145043A1 (ja) | 2019-01-10 | 2020-07-16 | サンアプロ株式会社 | スルホニウム塩、光酸発生剤、硬化性組成物およびレジスト組成物 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1516512A (en) | 1974-05-02 | 1978-07-05 | Gen Electric | Chalcogenium salts |
| JP2742594B2 (ja) | 1988-12-29 | 1998-04-22 | 広栄化学工業株式会社 | 光重合触媒およびそれを含有する硬化性組成物 |
| JPH07329399A (ja) | 1994-06-03 | 1995-12-19 | Ricoh Co Ltd | 画像形成装置 |
| JP3942202B2 (ja) | 1994-12-15 | 2007-07-11 | 日本化薬株式会社 | 光重合開始剤、これを含有するエネルギー線硬化性組成物及びその硬化物 |
| JPH09118663A (ja) | 1995-08-22 | 1997-05-06 | Nippon Soda Co Ltd | 新規スルホニウム塩化合物、重合開始剤、該化合物を含有する硬化性組成物および硬化方法 |
| JPH09183960A (ja) | 1995-12-28 | 1997-07-15 | Toyo Ink Mfg Co Ltd | 感エネルギー線酸発生剤、感エネルギー線酸発生剤組成物および硬化性組成物 |
| JPH09302269A (ja) | 1996-03-11 | 1997-11-25 | Toyo Ink Mfg Co Ltd | 紫外線硬化型樹脂組成物及びこれを含む被覆剤 |
| JPH107680A (ja) | 1996-06-18 | 1998-01-13 | Nippon Kayaku Co Ltd | 光重合開始剤、これを含有するエネルギー線硬化性組成物及びその硬化物 |
| JPH10212286A (ja) | 1997-01-30 | 1998-08-11 | Nippon Kayaku Co Ltd | 光重合開始剤、これを含有するエネルギー線硬化性組成物及びその硬化物 |
| JPH10287643A (ja) | 1997-04-10 | 1998-10-27 | Nippon Kayaku Co Ltd | 新規オニウム塩、光重合開始剤、これを含有するエネルギー線硬化性組成物及びその硬化物 |
| JPH1160996A (ja) | 1997-08-25 | 1999-03-05 | Toyo Ink Mfg Co Ltd | 紫外線硬化型樹脂組成物及びその利用 |
| JPH11279212A (ja) | 1998-02-02 | 1999-10-12 | Nippon Soda Co Ltd | 新規ヨードニウム塩化合物を含有する光硬化性組成物 |
| JP4023086B2 (ja) | 1999-12-27 | 2007-12-19 | 和光純薬工業株式会社 | スルホニウム塩化合物 |
| JP2001348482A (ja) | 2000-06-07 | 2001-12-18 | Shin Etsu Chem Co Ltd | 放射線硬化型シリコーン含有剥離性組成物及び剥離フィルム |
| JP3712960B2 (ja) | 2001-07-12 | 2005-11-02 | 関西ペイント株式会社 | 紫外線硬化型塗料組成物 |
| JP4002176B2 (ja) | 2001-12-27 | 2007-10-31 | 信越化学工業株式会社 | 光酸発生化合物、化学増幅ポジ型レジスト材料及びパターン形成方法 |
| JP2003267968A (ja) | 2002-03-13 | 2003-09-25 | Hodogaya Chem Co Ltd | スルホン酸オニウム塩化合物、該化合物の製造方法、該化合物を用いた感光性樹脂組成物およびこれを用いた感光性材料。 |
| CN101466804B (zh) | 2006-04-13 | 2012-02-22 | 西巴控股有限公司 | 硫鎓盐引发剂 |
| KR101700980B1 (ko) * | 2009-02-20 | 2017-01-31 | 산아프로 가부시키가이샤 | 술포늄염, 광산 발생제 및 감광성 수지 조성물 |
| JP5576139B2 (ja) | 2009-02-20 | 2014-08-20 | サンアプロ株式会社 | スルホニウム塩,光酸発生剤,光硬化性組成物,及びその硬化体 |
| CN104918914A (zh) * | 2012-10-18 | 2015-09-16 | 三亚普罗股份有限公司 | 锍盐、光产酸剂、固化性组合物和抗蚀剂组合物 |
| JP2018024598A (ja) | 2016-08-09 | 2018-02-15 | 東洋合成工業株式会社 | スルホニウム塩、光酸発生剤、それを含む組成物、及び、デバイスの製造方法 |
| JP2025151997A (ja) | 2024-03-28 | 2025-10-09 | 雪印メグミルク株式会社 | 粉乳類 |
-
2021
- 2021-01-04 WO PCT/JP2021/000009 patent/WO2021186846A1/ja not_active Ceased
- 2021-01-04 US US17/789,571 patent/US12461444B2/en active Active
- 2021-01-04 CN CN202180007534.5A patent/CN114901638B/zh active Active
- 2021-01-04 EP EP21771272.8A patent/EP4122915A4/en active Pending
- 2021-01-04 JP JP2022508074A patent/JP7684278B2/ja active Active
- 2021-01-04 KR KR1020227023678A patent/KR102916118B1/ko active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007003507A1 (en) | 2005-07-01 | 2007-01-11 | Ciba Specialty Chemicals Holding Inc. | Sulphonium salt initiators |
| JP2008120700A (ja) | 2006-11-08 | 2008-05-29 | San Apro Kk | スルホニウム塩 |
| WO2011016425A1 (ja) | 2009-08-03 | 2011-02-10 | サンアプロ株式会社 | 光酸発生剤,光硬化性組成物,及びその硬化体 |
| JP2012027290A (ja) | 2010-07-26 | 2012-02-09 | San Apro Kk | 化学増幅型ネガ型フォトレジスト組成物 |
| WO2018003470A1 (ja) | 2016-06-29 | 2018-01-04 | サンアプロ株式会社 | スルホニウム塩、光酸発生剤、光硬化性組成物、及びその硬化体 |
| WO2019225185A1 (ja) | 2018-05-25 | 2019-11-28 | サンアプロ株式会社 | スルホニウム塩、光酸発生剤、硬化性組成物およびレジスト組成物 |
| WO2020145043A1 (ja) | 2019-01-10 | 2020-07-16 | サンアプロ株式会社 | スルホニウム塩、光酸発生剤、硬化性組成物およびレジスト組成物 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114901638A (zh) | 2022-08-12 |
| CN114901638B (zh) | 2024-10-29 |
| JPWO2021186846A1 (https=) | 2021-09-23 |
| EP4122915A1 (en) | 2023-01-25 |
| EP4122915A4 (en) | 2023-09-06 |
| KR20220154085A (ko) | 2022-11-21 |
| KR102916118B1 (ko) | 2026-01-21 |
| WO2021186846A1 (ja) | 2021-09-23 |
| US20230100642A1 (en) | 2023-03-30 |
| US12461444B2 (en) | 2025-11-04 |
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