JP7678438B2 - 電磁干渉抑制材料 - Google Patents

電磁干渉抑制材料 Download PDF

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Publication number
JP7678438B2
JP7678438B2 JP2023565045A JP2023565045A JP7678438B2 JP 7678438 B2 JP7678438 B2 JP 7678438B2 JP 2023565045 A JP2023565045 A JP 2023565045A JP 2023565045 A JP2023565045 A JP 2023565045A JP 7678438 B2 JP7678438 B2 JP 7678438B2
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JP
Japan
Prior art keywords
electromagnetic interference
interference suppression
shell
powdered carbon
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023565045A
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English (en)
Japanese (ja)
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JPWO2023100923A1 (https=
JPWO2023100923A5 (https=
Inventor
洋知 西原
栄吉 吉田
健 内田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tohoku University NUC
Kyocera Corp
Original Assignee
Tohoku University NUC
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Tohoku University NUC, Kyocera Corp filed Critical Tohoku University NUC
Publication of JPWO2023100923A1 publication Critical patent/JPWO2023100923A1/ja
Publication of JPWO2023100923A5 publication Critical patent/JPWO2023100923A5/ja
Application granted granted Critical
Publication of JP7678438B2 publication Critical patent/JP7678438B2/ja
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0031—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields combining different shielding materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B32/00—Carbon; Compounds thereof
    • C01B32/15—Nano-sized carbon materials
    • C01B32/182—Graphene
    • C01B32/184—Preparation
    • C01B32/186—Preparation by chemical vapour deposition [CVD]
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Electromagnetism (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Nanotechnology (AREA)
  • Materials Engineering (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP2023565045A 2021-12-01 2022-11-30 電磁干渉抑制材料 Active JP7678438B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021195681 2021-12-01
JP2021195681 2021-12-01
PCT/JP2022/044122 WO2023100923A1 (ja) 2021-12-01 2022-11-30 電磁干渉抑制材料

Publications (3)

Publication Number Publication Date
JPWO2023100923A1 JPWO2023100923A1 (https=) 2023-06-08
JPWO2023100923A5 JPWO2023100923A5 (https=) 2024-08-07
JP7678438B2 true JP7678438B2 (ja) 2025-05-16

Family

ID=86612276

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023565045A Active JP7678438B2 (ja) 2021-12-01 2022-11-30 電磁干渉抑制材料

Country Status (5)

Country Link
US (1) US12532442B2 (https=)
JP (1) JP7678438B2 (https=)
KR (1) KR20240090925A (https=)
CN (1) CN118303145A (https=)
WO (1) WO2023100923A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025052516A1 (ja) * 2023-09-04 2025-03-13 株式会社レゾナック 樹脂組成物、電子部品装置及び樹脂組成物の製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000294978A (ja) 1999-04-08 2000-10-20 Sekisui Chem Co Ltd 不燃性電波・音波吸収体
JP2004043705A (ja) 2002-07-15 2004-02-12 Hitachi Cable Ltd 電磁波吸収組成物及びそれを用いて形成した成型品
JP2008001757A (ja) 2006-06-20 2008-01-10 Kyocera Chemical Corp 半導体封止用樹脂組成物及び樹脂封止型半導体装置
JP2021084819A (ja) 2019-11-25 2021-06-03 東海カーボン株式会社 多孔質炭素材料の製造方法
WO2021166343A1 (ja) 2020-02-21 2021-08-26 ポリプラスチックス株式会社 樹脂組成物及び該樹脂組成物からなる成形品

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0228399A (ja) 1988-07-18 1990-01-30 Shinwa Internatl Kk 電波吸収材及びその製造方法
US6972097B2 (en) * 1995-07-20 2005-12-06 Nec Tokin Corporation Composite magnetic material and electromagnetic interference suppressor member using the same
JP2001068889A (ja) 1999-08-30 2001-03-16 Daido Steel Co Ltd 電磁波シールド材
JP4113812B2 (ja) 2003-08-05 2008-07-09 北川工業株式会社 電波吸収体、および電波吸収体の製造方法
WO2010109561A1 (ja) * 2009-03-27 2010-09-30 株式会社 東芝 コアシェル型磁性材料、コアシェル型磁性材料の製造方法、デバイス装置、およびアンテナ装置
JP5831921B2 (ja) 2011-03-30 2015-12-09 日東電工株式会社 電磁波吸収体及び電磁波吸収体の製造方法
TW201601915A (zh) * 2014-07-07 2016-01-16 聯茂電子股份有限公司 電磁波干擾遮蔽薄膜

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000294978A (ja) 1999-04-08 2000-10-20 Sekisui Chem Co Ltd 不燃性電波・音波吸収体
JP2004043705A (ja) 2002-07-15 2004-02-12 Hitachi Cable Ltd 電磁波吸収組成物及びそれを用いて形成した成型品
JP2008001757A (ja) 2006-06-20 2008-01-10 Kyocera Chemical Corp 半導体封止用樹脂組成物及び樹脂封止型半導体装置
JP2021084819A (ja) 2019-11-25 2021-06-03 東海カーボン株式会社 多孔質炭素材料の製造方法
WO2021166343A1 (ja) 2020-02-21 2021-08-26 ポリプラスチックス株式会社 樹脂組成物及び該樹脂組成物からなる成形品

Also Published As

Publication number Publication date
KR20240090925A (ko) 2024-06-21
JPWO2023100923A1 (https=) 2023-06-08
CN118303145A (zh) 2024-07-05
US20250031355A1 (en) 2025-01-23
US12532442B2 (en) 2026-01-20
WO2023100923A1 (ja) 2023-06-08

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