JPWO2023100923A5 - - Google Patents

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Publication number
JPWO2023100923A5
JPWO2023100923A5 JP2023565045A JP2023565045A JPWO2023100923A5 JP WO2023100923 A5 JPWO2023100923 A5 JP WO2023100923A5 JP 2023565045 A JP2023565045 A JP 2023565045A JP 2023565045 A JP2023565045 A JP 2023565045A JP WO2023100923 A5 JPWO2023100923 A5 JP WO2023100923A5
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JP
Japan
Prior art keywords
electromagnetic interference
shell
material according
powdered carbon
interference suppressing
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Application number
JP2023565045A
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English (en)
Japanese (ja)
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JPWO2023100923A1 (https=
JP7678438B2 (ja
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Priority claimed from PCT/JP2022/044122 external-priority patent/WO2023100923A1/ja
Publication of JPWO2023100923A1 publication Critical patent/JPWO2023100923A1/ja
Publication of JPWO2023100923A5 publication Critical patent/JPWO2023100923A5/ja
Application granted granted Critical
Publication of JP7678438B2 publication Critical patent/JP7678438B2/ja
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JP2023565045A 2021-12-01 2022-11-30 電磁干渉抑制材料 Active JP7678438B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021195681 2021-12-01
JP2021195681 2021-12-01
PCT/JP2022/044122 WO2023100923A1 (ja) 2021-12-01 2022-11-30 電磁干渉抑制材料

Publications (3)

Publication Number Publication Date
JPWO2023100923A1 JPWO2023100923A1 (https=) 2023-06-08
JPWO2023100923A5 true JPWO2023100923A5 (https=) 2024-08-07
JP7678438B2 JP7678438B2 (ja) 2025-05-16

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ID=86612276

Family Applications (1)

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JP2023565045A Active JP7678438B2 (ja) 2021-12-01 2022-11-30 電磁干渉抑制材料

Country Status (5)

Country Link
US (1) US12532442B2 (https=)
JP (1) JP7678438B2 (https=)
KR (1) KR20240090925A (https=)
CN (1) CN118303145A (https=)
WO (1) WO2023100923A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025052516A1 (ja) * 2023-09-04 2025-03-13 株式会社レゾナック 樹脂組成物、電子部品装置及び樹脂組成物の製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0228399A (ja) 1988-07-18 1990-01-30 Shinwa Internatl Kk 電波吸収材及びその製造方法
US6972097B2 (en) * 1995-07-20 2005-12-06 Nec Tokin Corporation Composite magnetic material and electromagnetic interference suppressor member using the same
JP2000294978A (ja) * 1999-04-08 2000-10-20 Sekisui Chem Co Ltd 不燃性電波・音波吸収体
JP2001068889A (ja) 1999-08-30 2001-03-16 Daido Steel Co Ltd 電磁波シールド材
JP2004043705A (ja) * 2002-07-15 2004-02-12 Hitachi Cable Ltd 電磁波吸収組成物及びそれを用いて形成した成型品
JP4113812B2 (ja) 2003-08-05 2008-07-09 北川工業株式会社 電波吸収体、および電波吸収体の製造方法
JP5095136B2 (ja) 2006-06-20 2012-12-12 京セラケミカル株式会社 半導体封止用樹脂組成物の製造方法
WO2010109561A1 (ja) * 2009-03-27 2010-09-30 株式会社 東芝 コアシェル型磁性材料、コアシェル型磁性材料の製造方法、デバイス装置、およびアンテナ装置
JP5831921B2 (ja) 2011-03-30 2015-12-09 日東電工株式会社 電磁波吸収体及び電磁波吸収体の製造方法
TW201601915A (zh) * 2014-07-07 2016-01-16 聯茂電子股份有限公司 電磁波干擾遮蔽薄膜
JP7407393B2 (ja) 2019-11-25 2024-01-04 東海カーボン株式会社 多孔質炭素材料の製造方法
JP7446127B2 (ja) * 2020-02-21 2024-03-08 ポリプラスチックス株式会社 樹脂組成物及び該樹脂組成物からなる成形品

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