JPWO2023100923A1 - - Google Patents

Info

Publication number
JPWO2023100923A1
JPWO2023100923A1 JP2023565045A JP2023565045A JPWO2023100923A1 JP WO2023100923 A1 JPWO2023100923 A1 JP WO2023100923A1 JP 2023565045 A JP2023565045 A JP 2023565045A JP 2023565045 A JP2023565045 A JP 2023565045A JP WO2023100923 A1 JPWO2023100923 A1 JP WO2023100923A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023565045A
Other languages
Japanese (ja)
Other versions
JP7678438B2 (ja
JPWO2023100923A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023100923A1 publication Critical patent/JPWO2023100923A1/ja
Publication of JPWO2023100923A5 publication Critical patent/JPWO2023100923A5/ja
Application granted granted Critical
Publication of JP7678438B2 publication Critical patent/JP7678438B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0031—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields combining different shielding materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B32/00—Carbon; Compounds thereof
    • C01B32/15—Nano-sized carbon materials
    • C01B32/182—Graphene
    • C01B32/184—Preparation
    • C01B32/186—Preparation by chemical vapour deposition [CVD]
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Electromagnetism (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Nanotechnology (AREA)
  • Materials Engineering (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP2023565045A 2021-12-01 2022-11-30 電磁干渉抑制材料 Active JP7678438B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021195681 2021-12-01
JP2021195681 2021-12-01
PCT/JP2022/044122 WO2023100923A1 (ja) 2021-12-01 2022-11-30 電磁干渉抑制材料

Publications (3)

Publication Number Publication Date
JPWO2023100923A1 true JPWO2023100923A1 (https=) 2023-06-08
JPWO2023100923A5 JPWO2023100923A5 (https=) 2024-08-07
JP7678438B2 JP7678438B2 (ja) 2025-05-16

Family

ID=86612276

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023565045A Active JP7678438B2 (ja) 2021-12-01 2022-11-30 電磁干渉抑制材料

Country Status (5)

Country Link
US (1) US12532442B2 (https=)
JP (1) JP7678438B2 (https=)
KR (1) KR20240090925A (https=)
CN (1) CN118303145A (https=)
WO (1) WO2023100923A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025052516A1 (ja) * 2023-09-04 2025-03-13 株式会社レゾナック 樹脂組成物、電子部品装置及び樹脂組成物の製造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0228399A (ja) * 1988-07-18 1990-01-30 Shinwa Internatl Kk 電波吸収材及びその製造方法
JP2000294978A (ja) * 1999-04-08 2000-10-20 Sekisui Chem Co Ltd 不燃性電波・音波吸収体
JP2004043705A (ja) * 2002-07-15 2004-02-12 Hitachi Cable Ltd 電磁波吸収組成物及びそれを用いて形成した成型品
JP2008001757A (ja) * 2006-06-20 2008-01-10 Kyocera Chemical Corp 半導体封止用樹脂組成物及び樹脂封止型半導体装置
JP2021084819A (ja) * 2019-11-25 2021-06-03 東海カーボン株式会社 多孔質炭素材料の製造方法
WO2021166343A1 (ja) * 2020-02-21 2021-08-26 ポリプラスチックス株式会社 樹脂組成物及び該樹脂組成物からなる成形品

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6972097B2 (en) * 1995-07-20 2005-12-06 Nec Tokin Corporation Composite magnetic material and electromagnetic interference suppressor member using the same
JP2001068889A (ja) 1999-08-30 2001-03-16 Daido Steel Co Ltd 電磁波シールド材
JP4113812B2 (ja) 2003-08-05 2008-07-09 北川工業株式会社 電波吸収体、および電波吸収体の製造方法
WO2010109561A1 (ja) * 2009-03-27 2010-09-30 株式会社 東芝 コアシェル型磁性材料、コアシェル型磁性材料の製造方法、デバイス装置、およびアンテナ装置
JP5831921B2 (ja) 2011-03-30 2015-12-09 日東電工株式会社 電磁波吸収体及び電磁波吸収体の製造方法
TW201601915A (zh) * 2014-07-07 2016-01-16 聯茂電子股份有限公司 電磁波干擾遮蔽薄膜

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0228399A (ja) * 1988-07-18 1990-01-30 Shinwa Internatl Kk 電波吸収材及びその製造方法
JP2000294978A (ja) * 1999-04-08 2000-10-20 Sekisui Chem Co Ltd 不燃性電波・音波吸収体
JP2004043705A (ja) * 2002-07-15 2004-02-12 Hitachi Cable Ltd 電磁波吸収組成物及びそれを用いて形成した成型品
JP2008001757A (ja) * 2006-06-20 2008-01-10 Kyocera Chemical Corp 半導体封止用樹脂組成物及び樹脂封止型半導体装置
JP2021084819A (ja) * 2019-11-25 2021-06-03 東海カーボン株式会社 多孔質炭素材料の製造方法
WO2021166343A1 (ja) * 2020-02-21 2021-08-26 ポリプラスチックス株式会社 樹脂組成物及び該樹脂組成物からなる成形品

Also Published As

Publication number Publication date
KR20240090925A (ko) 2024-06-21
CN118303145A (zh) 2024-07-05
US20250031355A1 (en) 2025-01-23
US12532442B2 (en) 2026-01-20
WO2023100923A1 (ja) 2023-06-08
JP7678438B2 (ja) 2025-05-16

Similar Documents

Publication Publication Date Title
BR112023012656A2 (https=)
BR112021014123A2 (https=)
BR112023009656A2 (https=)
BR112022009896A2 (https=)
BR112021017747A2 (https=)
BR112022024743A2 (https=)
BR112022026905A2 (https=)
JPWO2023100923A1 (https=)
BR112023011738A2 (https=)
BR112023004146A2 (https=)
BR112023006729A2 (https=)
BR102021018859A2 (https=)
BR102021015500A2 (https=)
CH718816A4 (https=)
BR112023016292A2 (https=)
BR112023011610A2 (https=)
BR112023011539A2 (https=)
BR112023008976A2 (https=)
BR102021020147A2 (https=)
BR102021018926A2 (https=)
BR102021018167A2 (https=)
BR102021017576A2 (https=)
BR102021016837A2 (https=)
BR102021016551A2 (https=)
BR102021016375A2 (https=)

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240523

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240523

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240524

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20241210

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20250210

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20250325

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20250417

R150 Certificate of patent or registration of utility model

Ref document number: 7678438

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150