KR20240090925A - 전자 간섭 억제 재료 - Google Patents

전자 간섭 억제 재료 Download PDF

Info

Publication number
KR20240090925A
KR20240090925A KR1020247017321A KR20247017321A KR20240090925A KR 20240090925 A KR20240090925 A KR 20240090925A KR 1020247017321 A KR1020247017321 A KR 1020247017321A KR 20247017321 A KR20247017321 A KR 20247017321A KR 20240090925 A KR20240090925 A KR 20240090925A
Authority
KR
South Korea
Prior art keywords
electromagnetic interference
interference suppression
shell
powdered carbon
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247017321A
Other languages
English (en)
Korean (ko)
Inventor
히로토모 니시하라
시게요시 요시다
켄 우치다
Original Assignee
교세라 가부시키가이샤
고쿠리츠 다이가쿠 호진 도호쿠 다이가쿠
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 교세라 가부시키가이샤, 고쿠리츠 다이가쿠 호진 도호쿠 다이가쿠 filed Critical 교세라 가부시키가이샤
Publication of KR20240090925A publication Critical patent/KR20240090925A/ko
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0031—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields combining different shielding materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B32/00—Carbon; Compounds thereof
    • C01B32/15—Nano-sized carbon materials
    • C01B32/182—Graphene
    • C01B32/184—Preparation
    • C01B32/186—Preparation by chemical vapour deposition [CVD]
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Electromagnetism (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Nanotechnology (AREA)
  • Materials Engineering (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
KR1020247017321A 2021-12-01 2022-11-30 전자 간섭 억제 재료 Pending KR20240090925A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021195681 2021-12-01
JPJP-P-2021-195681 2021-12-01
PCT/JP2022/044122 WO2023100923A1 (ja) 2021-12-01 2022-11-30 電磁干渉抑制材料

Publications (1)

Publication Number Publication Date
KR20240090925A true KR20240090925A (ko) 2024-06-21

Family

ID=86612276

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247017321A Pending KR20240090925A (ko) 2021-12-01 2022-11-30 전자 간섭 억제 재료

Country Status (5)

Country Link
US (1) US12532442B2 (https=)
JP (1) JP7678438B2 (https=)
KR (1) KR20240090925A (https=)
CN (1) CN118303145A (https=)
WO (1) WO2023100923A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025052516A1 (ja) * 2023-09-04 2025-03-13 株式会社レゾナック 樹脂組成物、電子部品装置及び樹脂組成物の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001068889A (ja) 1999-08-30 2001-03-16 Daido Steel Co Ltd 電磁波シールド材
JP2005057093A (ja) 2003-08-05 2005-03-03 Kitagawa Ind Co Ltd 電波吸収体、および電波吸収体の製造方法
JP2012209515A (ja) 2011-03-30 2012-10-25 Nitto Denko Corp 電磁波吸収体及び電磁波吸収体の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0228399A (ja) 1988-07-18 1990-01-30 Shinwa Internatl Kk 電波吸収材及びその製造方法
US6972097B2 (en) * 1995-07-20 2005-12-06 Nec Tokin Corporation Composite magnetic material and electromagnetic interference suppressor member using the same
JP2000294978A (ja) * 1999-04-08 2000-10-20 Sekisui Chem Co Ltd 不燃性電波・音波吸収体
JP2004043705A (ja) * 2002-07-15 2004-02-12 Hitachi Cable Ltd 電磁波吸収組成物及びそれを用いて形成した成型品
JP5095136B2 (ja) 2006-06-20 2012-12-12 京セラケミカル株式会社 半導体封止用樹脂組成物の製造方法
WO2010109561A1 (ja) * 2009-03-27 2010-09-30 株式会社 東芝 コアシェル型磁性材料、コアシェル型磁性材料の製造方法、デバイス装置、およびアンテナ装置
TW201601915A (zh) * 2014-07-07 2016-01-16 聯茂電子股份有限公司 電磁波干擾遮蔽薄膜
JP7407393B2 (ja) 2019-11-25 2024-01-04 東海カーボン株式会社 多孔質炭素材料の製造方法
JP7446127B2 (ja) * 2020-02-21 2024-03-08 ポリプラスチックス株式会社 樹脂組成物及び該樹脂組成物からなる成形品

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001068889A (ja) 1999-08-30 2001-03-16 Daido Steel Co Ltd 電磁波シールド材
JP2005057093A (ja) 2003-08-05 2005-03-03 Kitagawa Ind Co Ltd 電波吸収体、および電波吸収体の製造方法
JP2012209515A (ja) 2011-03-30 2012-10-25 Nitto Denko Corp 電磁波吸収体及び電磁波吸収体の製造方法

Also Published As

Publication number Publication date
JPWO2023100923A1 (https=) 2023-06-08
CN118303145A (zh) 2024-07-05
US20250031355A1 (en) 2025-01-23
US12532442B2 (en) 2026-01-20
WO2023100923A1 (ja) 2023-06-08
JP7678438B2 (ja) 2025-05-16

Similar Documents

Publication Publication Date Title
Zachariah et al. Hybrid materials for electromagnetic shielding: A review
Bhattacharjee et al. Recent trends in multi-layered architectures towards screening electromagnetic radiation: challenges and perspectives
KR102575899B1 (ko) 전자파 흡수 재료 및 전자파 흡수체
CN101163828B (zh) 碳纤维复合片材、其传热体用途及其中所使用的沥青类碳纤维毡用片
WO2007046412A1 (ja) 電磁波吸収体
Yang et al. A review of the use of graphene-based materials in electromagnetic-shielding
KR20080030064A (ko) 전자파 흡수체
KR20060120269A (ko) ＧＨｚ 대역 전자 부품용 수지 조성물 및 ＧＨｚ 대역 전자부품
CN114437396A (zh) 一种夹层结构电磁屏蔽复合泡沫及其制备方法
JP2025116071A (ja) 電磁波遮蔽用積層シート
Oraby et al. Electromagnetic interference shielding of thermally exfoliated graphene/polyurethane composite foams
JP7678438B2 (ja) 電磁干渉抑制材料
CN101322197A (zh) 含有纤维状纳米碳的导通部件和使用该导通部件的接点装置
Wu et al. Sustainably sourced epoxy thermal management composites with simultaneously improved thermal conductivity, dielectric properties and fire safety
JP5519489B2 (ja) 無機質中空粉体の製造方法及びそれ用いた樹脂組成物
David et al. Porous carbon materials and their composites for electromagnetic interference (EMI) shielding: the state-of-the-art of technologies
JP7777315B2 (ja) 新規複合材料、複合材料の製造方法、及びコンポジット
JP7850402B2 (ja) 電磁干渉抑制材料
KR20190124653A (ko) 방열 전자파 차폐용 복합 시트의 제조 방법
Ribadeneyra et al. Emi shielding composites based on magnetic nanoparticles and nanocarbons
KR20230156791A (ko) 질화붕소 분말 및 수지 조성물
Youh et al. A carbonyl iron/carbon fiber material for electromagnetic wave absorption
Shaer et al. Advanced Carbon Materials Derived from Polybenzoxazines: A Review. Polymers 2021, 13, 3775
González Sánchez et al. Modulating the electromagnetic shielding mechanisms by thermal treatment of high porosity graphene aerogels
Crespo Ribadeneyra EMI shielding composites based on magnetic nanoparticles and nanocarbons

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

D21 Rejection of application intended

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D21-EXM-PE0902 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13 Pre-grant limitation requested

Free format text: ST27 STATUS EVENT CODE: A-2-3-E10-E13-LIM-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11 Amendment of application requested

Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P11-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000