JP7671756B2 - 研磨用組成物及び研磨方法 - Google Patents

研磨用組成物及び研磨方法 Download PDF

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Publication number
JP7671756B2
JP7671756B2 JP2022535406A JP2022535406A JP7671756B2 JP 7671756 B2 JP7671756 B2 JP 7671756B2 JP 2022535406 A JP2022535406 A JP 2022535406A JP 2022535406 A JP2022535406 A JP 2022535406A JP 7671756 B2 JP7671756 B2 JP 7671756B2
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Japan
Prior art keywords
polishing
acid
polished
abrasive grains
polishing composition
Prior art date
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JP2022535406A
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English (en)
Japanese (ja)
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JPWO2022009990A1 (https=
Inventor
俊美 水谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujimi Inc
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Fujimi Inc
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Publication of JPWO2022009990A1 publication Critical patent/JPWO2022009990A1/ja
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2022535406A 2020-07-09 2021-07-09 研磨用組成物及び研磨方法 Active JP7671756B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020118713 2020-07-09
JP2020118713 2020-07-09
PCT/JP2021/026014 WO2022009990A1 (ja) 2020-07-09 2021-07-09 研磨用組成物及び研磨方法

Publications (2)

Publication Number Publication Date
JPWO2022009990A1 JPWO2022009990A1 (https=) 2022-01-13
JP7671756B2 true JP7671756B2 (ja) 2025-05-02

Family

ID=79552564

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022535406A Active JP7671756B2 (ja) 2020-07-09 2021-07-09 研磨用組成物及び研磨方法

Country Status (2)

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JP (1) JP7671756B2 (https=)
WO (1) WO2022009990A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7801444B2 (ja) * 2021-10-27 2026-01-16 インテグリス・インコーポレーテッド 多結晶結晶材料の研磨

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003117806A (ja) 2001-10-10 2003-04-23 Kobe Steel Ltd 多結晶セラミックスの鏡面研磨方法
JP2020029472A (ja) 2018-08-20 2020-02-27 株式会社ダイセル 多結晶ｙａｇ研磨用スラリー組成物

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60155359A (ja) * 1984-01-20 1985-08-15 Sumitomo Special Metals Co Ltd セラミツクス材料の無孔化研摩方法
JPH09131662A (ja) * 1995-11-10 1997-05-20 Fuji Elelctrochem Co Ltd セラミックスの研磨方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003117806A (ja) 2001-10-10 2003-04-23 Kobe Steel Ltd 多結晶セラミックスの鏡面研磨方法
JP2020029472A (ja) 2018-08-20 2020-02-27 株式会社ダイセル 多結晶ｙａｇ研磨用スラリー組成物

Also Published As

Publication number Publication date
TW202214815A (zh) 2022-04-16
JPWO2022009990A1 (https=) 2022-01-13
WO2022009990A1 (ja) 2022-01-13

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