JPWO2022009990A1 - - Google Patents
Info
- Publication number
- JPWO2022009990A1 JPWO2022009990A1 JP2022535406A JP2022535406A JPWO2022009990A1 JP WO2022009990 A1 JPWO2022009990 A1 JP WO2022009990A1 JP 2022535406 A JP2022535406 A JP 2022535406A JP 2022535406 A JP2022535406 A JP 2022535406A JP WO2022009990 A1 JPWO2022009990 A1 JP WO2022009990A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020118713 | 2020-07-09 | ||
| JP2020118713 | 2020-07-09 | ||
| PCT/JP2021/026014 WO2022009990A1 (ja) | 2020-07-09 | 2021-07-09 | 研磨用組成物及び研磨方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022009990A1 true JPWO2022009990A1 (https=) | 2022-01-13 |
| JP7671756B2 JP7671756B2 (ja) | 2025-05-02 |
Family
ID=79552564
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022535406A Active JP7671756B2 (ja) | 2020-07-09 | 2021-07-09 | 研磨用組成物及び研磨方法 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7671756B2 (https=) |
| WO (1) | WO2022009990A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7801444B2 (ja) * | 2021-10-27 | 2026-01-16 | インテグリス・インコーポレーテッド | 多結晶結晶材料の研磨 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60155359A (ja) * | 1984-01-20 | 1985-08-15 | Sumitomo Special Metals Co Ltd | セラミツクス材料の無孔化研摩方法 |
| JPH09131662A (ja) * | 1995-11-10 | 1997-05-20 | Fuji Elelctrochem Co Ltd | セラミックスの研磨方法 |
| JP2003117806A (ja) * | 2001-10-10 | 2003-04-23 | Kobe Steel Ltd | 多結晶セラミックスの鏡面研磨方法 |
| JP2020029472A (ja) * | 2018-08-20 | 2020-02-27 | 株式会社ダイセル | 多結晶ｙａｇ研磨用スラリー組成物 |
-
2021
- 2021-07-09 JP JP2022535406A patent/JP7671756B2/ja active Active
- 2021-07-09 WO PCT/JP2021/026014 patent/WO2022009990A1/ja not_active Ceased
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60155359A (ja) * | 1984-01-20 | 1985-08-15 | Sumitomo Special Metals Co Ltd | セラミツクス材料の無孔化研摩方法 |
| JPH09131662A (ja) * | 1995-11-10 | 1997-05-20 | Fuji Elelctrochem Co Ltd | セラミックスの研磨方法 |
| JP2003117806A (ja) * | 2001-10-10 | 2003-04-23 | Kobe Steel Ltd | 多結晶セラミックスの鏡面研磨方法 |
| JP2020029472A (ja) * | 2018-08-20 | 2020-02-27 | 株式会社ダイセル | 多結晶ｙａｇ研磨用スラリー組成物 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202214815A (zh) | 2022-04-16 |
| WO2022009990A1 (ja) | 2022-01-13 |
| JP7671756B2 (ja) | 2025-05-02 |
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