JP7661868B2 - 半導体モジュール - Google Patents

半導体モジュール Download PDF

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Publication number
JP7661868B2
JP7661868B2 JP2021187168A JP2021187168A JP7661868B2 JP 7661868 B2 JP7661868 B2 JP 7661868B2 JP 2021187168 A JP2021187168 A JP 2021187168A JP 2021187168 A JP2021187168 A JP 2021187168A JP 7661868 B2 JP7661868 B2 JP 7661868B2
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JP
Japan
Prior art keywords
wiring member
signal
bonding
power
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021187168A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023074294A (ja
JP2023074294A5 (https=
Inventor
啓年 草間
徳大 井上
秀奈 永井
啓太 福谷
泰至 古川
崇秀 加藤
俊介 荒井
亮太 三輪
翔一朗 大前
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to JP2021187168A priority Critical patent/JP7661868B2/ja
Priority to CN202280076019.7A priority patent/CN118302859A/zh
Priority to PCT/JP2022/041140 priority patent/WO2023090165A1/ja
Publication of JP2023074294A publication Critical patent/JP2023074294A/ja
Publication of JP2023074294A5 publication Critical patent/JP2023074294A5/ja
Priority to US18/631,633 priority patent/US20240274511A1/en
Priority to JP2025061460A priority patent/JP2025102927A/ja
Application granted granted Critical
Publication of JP7661868B2 publication Critical patent/JP7661868B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/464—Additional interconnections in combination with leadframes
    • H10W70/467—Multilayered additional interconnections
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/42—Conversion of DC power input into AC power output without possibility of reversal
    • H02M7/44—Conversion of DC power input into AC power output without possibility of reversal by static converters
    • H02M7/48—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/464—Additional interconnections in combination with leadframes
    • H10W70/466—Tape carriers or flat leads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/464—Additional interconnections in combination with leadframes
    • H10W70/468—Circuit boards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Inverter Devices (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2021187168A 2021-11-17 2021-11-17 半導体モジュール Active JP7661868B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2021187168A JP7661868B2 (ja) 2021-11-17 2021-11-17 半導体モジュール
CN202280076019.7A CN118302859A (zh) 2021-11-17 2022-11-04 半导体模块
PCT/JP2022/041140 WO2023090165A1 (ja) 2021-11-17 2022-11-04 半導体モジュール
US18/631,633 US20240274511A1 (en) 2021-11-17 2024-04-10 Semiconductor module
JP2025061460A JP2025102927A (ja) 2021-11-17 2025-04-02 半導体モジュール

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021187168A JP7661868B2 (ja) 2021-11-17 2021-11-17 半導体モジュール

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025061460A Division JP2025102927A (ja) 2021-11-17 2025-04-02 半導体モジュール

Publications (3)

Publication Number Publication Date
JP2023074294A JP2023074294A (ja) 2023-05-29
JP2023074294A5 JP2023074294A5 (https=) 2023-11-01
JP7661868B2 true JP7661868B2 (ja) 2025-04-15

Family

ID=86396847

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2021187168A Active JP7661868B2 (ja) 2021-11-17 2021-11-17 半導体モジュール
JP2025061460A Pending JP2025102927A (ja) 2021-11-17 2025-04-02 半導体モジュール

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025061460A Pending JP2025102927A (ja) 2021-11-17 2025-04-02 半導体モジュール

Country Status (4)

Country Link
US (1) US20240274511A1 (https=)
JP (2) JP7661868B2 (https=)
CN (1) CN118302859A (https=)
WO (1) WO2023090165A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240243031A1 (en) * 2023-01-13 2024-07-18 Wolfspeed, Inc. Thermal Enhanced Power Semiconductor Package
WO2025052628A1 (ja) * 2023-09-07 2025-03-13 三菱電機株式会社 半導体装置、半導体装置の製造方法および電力変換装置
US20260040964A1 (en) * 2024-07-31 2026-02-05 Texas Instruments Incorporated Semiconductor package including a molded interconnect

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000294604A (ja) 1999-04-07 2000-10-20 Nec Corp テープキャリアパッケージ
WO2020079970A1 (ja) 2018-10-15 2020-04-23 株式会社デンソー 半導体装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0289852U (https=) * 1988-12-27 1990-07-17
JPH0425144A (ja) * 1990-05-21 1992-01-28 Shinko Electric Ind Co Ltd ３層ｔａｂ用テープを用いた半導体装置及び３層ｔａｂ用テープの製造方法
JPH04214646A (ja) * 1990-12-13 1992-08-05 Matsushita Electric Ind Co Ltd 放射線検出器の実装方法
JPH0730051A (ja) * 1993-07-09 1995-01-31 Fujitsu Ltd 半導体装置
JPH09129815A (ja) * 1995-11-07 1997-05-16 Hitachi Ltd 半導体装置の製造方法およびその製造方法に用いるリードフレーム
JPH1116942A (ja) * 1997-06-24 1999-01-22 Hitachi Ltd 半導体装置，その製造に用いられるチップ搭載テープキャリア，アウターリードボンディング方法ならびにアウターリードボンダ
JP2007281378A (ja) * 2006-04-11 2007-10-25 Sharp Corp フレキシブル配線基板および電子部品
JP2021027241A (ja) * 2019-08-07 2021-02-22 株式会社デンソー 半導体装置
JP2021034701A (ja) * 2019-08-29 2021-03-01 株式会社デンソー 半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000294604A (ja) 1999-04-07 2000-10-20 Nec Corp テープキャリアパッケージ
WO2020079970A1 (ja) 2018-10-15 2020-04-23 株式会社デンソー 半導体装置

Also Published As

Publication number Publication date
JP2023074294A (ja) 2023-05-29
JP2025102927A (ja) 2025-07-08
CN118302859A (zh) 2024-07-05
WO2023090165A1 (ja) 2023-05-25
US20240274511A1 (en) 2024-08-15

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