JP7657297B2 - 部品供給装置 - Google Patents

部品供給装置 Download PDF

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Publication number
JP7657297B2
JP7657297B2 JP2023520623A JP2023520623A JP7657297B2 JP 7657297 B2 JP7657297 B2 JP 7657297B2 JP 2023520623 A JP2023520623 A JP 2023520623A JP 2023520623 A JP2023520623 A JP 2023520623A JP 7657297 B2 JP7657297 B2 JP 7657297B2
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Japan
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component
transport
groove
conveying
air
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JP2023520623A
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Japanese (ja)
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JPWO2022239105A1 (https=
Inventor
崇 宮島
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Individual
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02Feeding of components

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Feeding Of Articles To Conveyors (AREA)
JP2023520623A 2021-05-11 2021-05-11 部品供給装置 Active JP7657297B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/017864 WO2022239105A1 (ja) 2021-05-11 2021-05-11 部品供給装置、および部品の供給方法

Publications (2)

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JPWO2022239105A1 JPWO2022239105A1 (https=) 2022-11-17
JP7657297B2 true JP7657297B2 (ja) 2025-04-04

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ID=84028504

Family Applications (1)

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JP2023520623A Active JP7657297B2 (ja) 2021-05-11 2021-05-11 部品供給装置

Country Status (3)

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JP (1) JP7657297B2 (https=)
CN (1) CN117204131A (https=)
WO (1) WO2022239105A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025203569A1 (ja) * 2024-03-29 2025-10-02 株式会社Fuji バルクフィーダ

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002052588A1 (fr) 2000-12-25 2002-07-04 Hitachi, Ltd. Dispositif semi-conducteur et ses procede et appareil de fabrication
WO2019138480A1 (ja) 2018-01-11 2019-07-18 株式会社Fuji 部品供給装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01176625U (https=) * 1988-06-03 1989-12-15
JP3461629B2 (ja) * 1995-08-21 2003-10-27 松下電器産業株式会社 部品供給装置
CN102811601B (zh) * 2011-06-01 2015-07-08 日本利特尔株式会社 工件插入装置和工件插入方法
KR20180098537A (ko) * 2015-12-28 2018-09-04 구라시키 보세키 가부시키가이샤 물품공급방법 및 장치

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002052588A1 (fr) 2000-12-25 2002-07-04 Hitachi, Ltd. Dispositif semi-conducteur et ses procede et appareil de fabrication
WO2019138480A1 (ja) 2018-01-11 2019-07-18 株式会社Fuji 部品供給装置

Also Published As

Publication number Publication date
JPWO2022239105A1 (https=) 2022-11-17
WO2022239105A1 (ja) 2022-11-17
CN117204131A (zh) 2023-12-08

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