JP7653672B2 - チップ抵抗器 - Google Patents

チップ抵抗器 Download PDF

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Publication number
JP7653672B2
JP7653672B2 JP2022568265A JP2022568265A JP7653672B2 JP 7653672 B2 JP7653672 B2 JP 7653672B2 JP 2022568265 A JP2022568265 A JP 2022568265A JP 2022568265 A JP2022568265 A JP 2022568265A JP 7653672 B2 JP7653672 B2 JP 7653672B2
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JP
Japan
Prior art keywords
protective film
silicone rubber
resistor
rubber particles
range
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022568265A
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English (en)
Japanese (ja)
Other versions
JPWO2022124263A1 (enExample
Inventor
孝志 大林
純子 小野崎
浩克 伊藤
恭佑 磯野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Panasonic Intellectual Property Management Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Intellectual Property Management Co Ltd filed Critical Panasonic Intellectual Property Management Co Ltd
Publication of JPWO2022124263A1 publication Critical patent/JPWO2022124263A1/ja
Application granted granted Critical
Publication of JP7653672B2 publication Critical patent/JP7653672B2/ja
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Anticipated expiration legal-status Critical

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C09D163/04—Epoxynovolacs
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/65—Additives macromolecular
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/66—Additives characterised by particle size
    • C09D7/69—Particle size larger than 1000 nm
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
    • H01C1/028—Housing; Enclosing; Embedding; Filling the housing or enclosure the resistive element being embedded in insulation with outer enclosing sheath
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/02—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Nanotechnology (AREA)
  • Electromagnetism (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Details Of Resistors (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Non-Adjustable Resistors (AREA)
JP2022568265A 2020-12-07 2021-12-06 チップ抵抗器 Active JP7653672B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020202863 2020-12-07
JP2020202863 2020-12-07
PCT/JP2021/044708 WO2022124263A1 (ja) 2020-12-07 2021-12-06 チップ抵抗器

Publications (2)

Publication Number Publication Date
JPWO2022124263A1 JPWO2022124263A1 (enExample) 2022-06-16
JP7653672B2 true JP7653672B2 (ja) 2025-03-31

Family

ID=81973260

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022568265A Active JP7653672B2 (ja) 2020-12-07 2021-12-06 チップ抵抗器

Country Status (4)

Country Link
US (1) US20240161948A1 (enExample)
JP (1) JP7653672B2 (enExample)
CN (1) CN116508117A (enExample)
WO (1) WO2022124263A1 (enExample)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004010877A (ja) 2002-06-12 2004-01-15 Nippon Kayaku Co Ltd 結晶性エポキシ樹脂、及びその製法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62270617A (ja) * 1986-05-20 1987-11-25 Mitsui Toatsu Chem Inc 半導体封止用樹脂組成物
JPS62273222A (ja) * 1986-05-21 1987-11-27 Mitsui Toatsu Chem Inc 半導体封止用樹脂組成物
JPH082885B2 (ja) * 1987-09-14 1996-01-17 東都化成株式会社 新規エポキシ化合物
JPH0697324A (ja) * 1992-09-11 1994-04-08 Mitsui Toatsu Chem Inc 樹脂封止型半導体装置
JPH06295801A (ja) * 1993-02-10 1994-10-21 Rohm Co Ltd チップ抵抗器及びその製造方法
JP3421134B2 (ja) * 1994-06-16 2003-06-30 株式会社龍森 シリカとシリコーンゴムを含む組成物及びその製造法
JPH10144508A (ja) * 1996-11-07 1998-05-29 Rohm Co Ltd チップ抵抗器におけるレーザトリミング方法
JPH10189832A (ja) * 1996-12-20 1998-07-21 Nitto Denko Corp エポキシ樹脂組成物およびそれを用いた半導体装置
JPH10289802A (ja) * 1997-04-16 1998-10-27 Matsushita Electric Ind Co Ltd 抵抗器
US6740411B2 (en) * 2001-02-21 2004-05-25 Ngk Spark Plug Co. Ltd. Embedding resin, wiring substrate using same and process for producing wiring substrate using same
JP4839041B2 (ja) * 2005-08-29 2011-12-14 東レ・ダウコーニング株式会社 絶縁性液状ダイボンディング剤および半導体装置
JP5314874B2 (ja) * 2007-10-05 2013-10-16 ナミックス株式会社 保護膜層用封止剤
JP5357697B2 (ja) * 2009-10-26 2013-12-04 ナミックス株式会社 チップ抵抗器または圧電発音体の保護膜用樹脂組成物
JP6948224B2 (ja) * 2017-10-25 2021-10-13 ペルノックス株式会社 絶縁組成物、及びチップ抵抗器の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004010877A (ja) 2002-06-12 2004-01-15 Nippon Kayaku Co Ltd 結晶性エポキシ樹脂、及びその製法

Also Published As

Publication number Publication date
WO2022124263A1 (ja) 2022-06-16
JPWO2022124263A1 (enExample) 2022-06-16
CN116508117A (zh) 2023-07-28
US20240161948A1 (en) 2024-05-16

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