JP7649791B2 - 実装方法及び実装装置 - Google Patents

実装方法及び実装装置 Download PDF

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Publication number
JP7649791B2
JP7649791B2 JP2022539947A JP2022539947A JP7649791B2 JP 7649791 B2 JP7649791 B2 JP 7649791B2 JP 2022539947 A JP2022539947 A JP 2022539947A JP 2022539947 A JP2022539947 A JP 2022539947A JP 7649791 B2 JP7649791 B2 JP 7649791B2
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component
mounting
board
detection
height
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Japanese (ja)
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JPWO2022024350A1 (https=
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英俊 川合
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/083—Quality monitoring using results from monitoring devices, e.g. feedback loops

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2022539947A 2020-07-31 2020-07-31 実装方法及び実装装置 Active JP7649791B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/029455 WO2022024350A1 (ja) 2020-07-31 2020-07-31 実装方法及び実装装置

Publications (2)

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JPWO2022024350A1 JPWO2022024350A1 (https=) 2022-02-03
JP7649791B2 true JP7649791B2 (ja) 2025-03-21

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JP2022539947A Active JP7649791B2 (ja) 2020-07-31 2020-07-31 実装方法及び実装装置

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JP (1) JP7649791B2 (https=)
CN (1) CN115769691B (https=)
DE (1) DE112020007469T5 (https=)
WO (1) WO2022024350A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018061146A1 (ja) 2016-09-29 2018-04-05 富士機械製造株式会社 実装装置および実装方法
WO2018179317A1 (ja) 2017-03-31 2018-10-04 株式会社Ｆｕｊｉ 部品実装機及び実装ヘッド
WO2019171481A1 (ja) 2018-03-07 2019-09-12 株式会社Ｆｕｊｉ 部品実装システム

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012104636A (ja) * 2010-11-10 2012-05-31 Panasonic Corp 部品実装装置および部品実装方法
WO2013145228A1 (ja) * 2012-03-29 2013-10-03 富士機械製造株式会社 部品実装機
WO2017013807A1 (ja) * 2015-07-23 2017-01-26 富士機械製造株式会社 部品実装機

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018061146A1 (ja) 2016-09-29 2018-04-05 富士機械製造株式会社 実装装置および実装方法
WO2018179317A1 (ja) 2017-03-31 2018-10-04 株式会社Ｆｕｊｉ 部品実装機及び実装ヘッド
WO2019171481A1 (ja) 2018-03-07 2019-09-12 株式会社Ｆｕｊｉ 部品実装システム

Also Published As

Publication number Publication date
JPWO2022024350A1 (https=) 2022-02-03
CN115769691A (zh) 2023-03-07
CN115769691B (zh) 2025-10-21
DE112020007469T5 (de) 2023-05-11
WO2022024350A1 (ja) 2022-02-03

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