JP7638815B2 - ブレークイン処理装置、およびブレークイン処理方法 - Google Patents

ブレークイン処理装置、およびブレークイン処理方法 Download PDF

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Publication number
JP7638815B2
JP7638815B2 JP2021120861A JP2021120861A JP7638815B2 JP 7638815 B2 JP7638815 B2 JP 7638815B2 JP 2021120861 A JP2021120861 A JP 2021120861A JP 2021120861 A JP2021120861 A JP 2021120861A JP 7638815 B2 JP7638815 B2 JP 7638815B2
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Japan
Prior art keywords
elastic membrane
break
pressure
pressurized fluid
pressure chamber
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JP2021120861A
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English (en)
Japanese (ja)
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JP2023016507A5 (enExample
JP2023016507A (ja
Inventor
治 鍋谷
賢一 赤澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
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Ebara Corp
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Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2021120861A priority Critical patent/JP7638815B2/ja
Priority to US17/812,738 priority patent/US12337438B2/en
Priority to TW111126663A priority patent/TW202304653A/zh
Priority to KR1020220088853A priority patent/KR20230014652A/ko
Priority to CN202210846351.9A priority patent/CN115674009A/zh
Publication of JP2023016507A publication Critical patent/JP2023016507A/ja
Publication of JP2023016507A5 publication Critical patent/JP2023016507A5/ja
Application granted granted Critical
Publication of JP7638815B2 publication Critical patent/JP7638815B2/ja
Priority to US19/226,539 priority patent/US20250289088A1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
JP2021120861A 2021-07-21 2021-07-21 ブレークイン処理装置、およびブレークイン処理方法 Active JP7638815B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2021120861A JP7638815B2 (ja) 2021-07-21 2021-07-21 ブレークイン処理装置、およびブレークイン処理方法
TW111126663A TW202304653A (zh) 2021-07-21 2022-07-15 磨合（break in）處理裝置、及磨合處理方法
US17/812,738 US12337438B2 (en) 2021-07-21 2022-07-15 Break-in processing apparatus and break-in processing method
CN202210846351.9A CN115674009A (zh) 2021-07-21 2022-07-19 磨合处理装置及磨合处理方法
KR1020220088853A KR20230014652A (ko) 2021-07-21 2022-07-19 브레이크 인 처리 장치 및 브레이크 인 처리 방법
US19/226,539 US20250289088A1 (en) 2021-07-21 2025-06-03 Break-in processing apparatus and break-in processing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021120861A JP7638815B2 (ja) 2021-07-21 2021-07-21 ブレークイン処理装置、およびブレークイン処理方法

Publications (3)

Publication Number Publication Date
JP2023016507A JP2023016507A (ja) 2023-02-02
JP2023016507A5 JP2023016507A5 (enExample) 2024-03-14
JP7638815B2 true JP7638815B2 (ja) 2025-03-04

Family

ID=84976931

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021120861A Active JP7638815B2 (ja) 2021-07-21 2021-07-21 ブレークイン処理装置、およびブレークイン処理方法

Country Status (5)

Country Link
US (2) US12337438B2 (enExample)
JP (1) JP7638815B2 (enExample)
KR (1) KR20230014652A (enExample)
CN (1) CN115674009A (enExample)
TW (1) TW202304653A (enExample)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002134446A (ja) 2000-10-23 2002-05-10 Tokyo Seimitsu Co Ltd ウェーハ研磨装置のキャリブレーション用治具及びキャリブレーション装置
JP2019077028A (ja) 2017-10-25 2019-05-23 株式会社荏原製作所 弾性膜のストレッチ動作プログラム、弾性膜のストレッチ動作方法、および研磨装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5868896A (en) * 1996-11-06 1999-02-09 Micron Technology, Inc. Chemical-mechanical planarization machine and method for uniformly planarizing semiconductor wafers
JP4033632B2 (ja) * 1999-02-02 2008-01-16 株式会社荏原製作所 基板把持装置及び研磨装置
KR100421445B1 (ko) 2001-09-28 2004-03-09 삼성전자주식회사 연마 헤드 조립 방법 및 연마 헤드 조립 시의 공기 누설검사장치
JP2003142438A (ja) 2001-11-07 2003-05-16 Sony Corp 研磨ヘッドの製造方法
US6712670B2 (en) * 2001-12-27 2004-03-30 Lam Research Corporation Method and apparatus for applying downward force on wafer during CMP
JP3645227B2 (ja) * 2002-03-18 2005-05-11 株式会社半導体先端テクノロジーズ 研磨装置および研磨方法
US7089782B2 (en) 2003-01-09 2006-08-15 Applied Materials, Inc. Polishing head test station
JP6344950B2 (ja) * 2014-03-31 2018-06-20 株式会社荏原製作所 研磨装置及び研磨方法
JP6990980B2 (ja) * 2017-03-31 2022-01-12 株式会社荏原製作所 基板処理装置
KR20210066147A (ko) 2019-11-28 2021-06-07 주식회사 씨티에스 씨엠피 해드 검사 장치

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002134446A (ja) 2000-10-23 2002-05-10 Tokyo Seimitsu Co Ltd ウェーハ研磨装置のキャリブレーション用治具及びキャリブレーション装置
JP2019077028A (ja) 2017-10-25 2019-05-23 株式会社荏原製作所 弾性膜のストレッチ動作プログラム、弾性膜のストレッチ動作方法、および研磨装置

Also Published As

Publication number Publication date
US20230026543A1 (en) 2023-01-26
CN115674009A (zh) 2023-02-03
US12337438B2 (en) 2025-06-24
US20250289088A1 (en) 2025-09-18
KR20230014652A (ko) 2023-01-30
TW202304653A (zh) 2023-02-01
JP2023016507A (ja) 2023-02-02

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