TW202304653A - 磨合（break in）處理裝置、及磨合處理方法 - Google Patents

磨合（break in）處理裝置、及磨合處理方法 Download PDF

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Publication number
TW202304653A
TW202304653A TW111126663A TW111126663A TW202304653A TW 202304653 A TW202304653 A TW 202304653A TW 111126663 A TW111126663 A TW 111126663A TW 111126663 A TW111126663 A TW 111126663A TW 202304653 A TW202304653 A TW 202304653A
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TW
Taiwan
Prior art keywords
running
elastic film
pressure
pressurized fluid
aforementioned
Prior art date
Application number
TW111126663A
Other languages
English (en)
Chinese (zh)
Inventor
鍋谷治
赤澤賢一
Original Assignee
日商荏原製作所股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商荏原製作所股份有限公司 filed Critical 日商荏原製作所股份有限公司
Publication of TW202304653A publication Critical patent/TW202304653A/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
TW111126663A 2021-07-21 2022-07-15 磨合（break in）處理裝置、及磨合處理方法 TW202304653A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-120861 2021-07-21
JP2021120861A JP7638815B2 (ja) 2021-07-21 2021-07-21 ブレークイン処理装置、およびブレークイン処理方法

Publications (1)

Publication Number Publication Date
TW202304653A true TW202304653A (zh) 2023-02-01

Family

ID=84976931

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111126663A TW202304653A (zh) 2021-07-21 2022-07-15 磨合（break in）處理裝置、及磨合處理方法

Country Status (5)

Country Link
US (2) US12337438B2 (enExample)
JP (1) JP7638815B2 (enExample)
KR (1) KR20230014652A (enExample)
CN (1) CN115674009A (enExample)
TW (1) TW202304653A (enExample)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5868896A (en) * 1996-11-06 1999-02-09 Micron Technology, Inc. Chemical-mechanical planarization machine and method for uniformly planarizing semiconductor wafers
US6435956B1 (en) * 1999-02-02 2002-08-20 Ebara Corporation Wafer holder and polishing device
JP3438874B2 (ja) * 2000-10-23 2003-08-18 株式会社東京精密 ウェーハ研磨装置のキャリブレーション用治具及びキャリブレーション装置
KR100421445B1 (ko) 2001-09-28 2004-03-09 삼성전자주식회사 연마 헤드 조립 방법 및 연마 헤드 조립 시의 공기 누설검사장치
JP2003142438A (ja) 2001-11-07 2003-05-16 Sony Corp 研磨ヘッドの製造方法
US6712670B2 (en) * 2001-12-27 2004-03-30 Lam Research Corporation Method and apparatus for applying downward force on wafer during CMP
JP3645227B2 (ja) * 2002-03-18 2005-05-11 株式会社半導体先端テクノロジーズ 研磨装置および研磨方法
US7089782B2 (en) 2003-01-09 2006-08-15 Applied Materials, Inc. Polishing head test station
JP6344950B2 (ja) * 2014-03-31 2018-06-20 株式会社荏原製作所 研磨装置及び研磨方法
JP6990980B2 (ja) * 2017-03-31 2022-01-12 株式会社荏原製作所 基板処理装置
JP6917966B2 (ja) * 2017-10-25 2021-08-11 株式会社荏原製作所 弾性膜のストレッチ動作プログラム、弾性膜のストレッチ動作方法、および研磨装置
KR20210066147A (ko) 2019-11-28 2021-06-07 주식회사 씨티에스 씨엠피 해드 검사 장치

Also Published As

Publication number Publication date
US20230026543A1 (en) 2023-01-26
CN115674009A (zh) 2023-02-03
US20250289088A1 (en) 2025-09-18
JP2023016507A (ja) 2023-02-02
JP7638815B2 (ja) 2025-03-04
US12337438B2 (en) 2025-06-24
KR20230014652A (ko) 2023-01-30

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