JP7635997B2 - 気密コネクタおよびその製造方法 - Google Patents
気密コネクタおよびその製造方法 Download PDFInfo
- Publication number
- JP7635997B2 JP7635997B2 JP2021565588A JP2021565588A JP7635997B2 JP 7635997 B2 JP7635997 B2 JP 7635997B2 JP 2021565588 A JP2021565588 A JP 2021565588A JP 2021565588 A JP2021565588 A JP 2021565588A JP 7635997 B2 JP7635997 B2 JP 7635997B2
- Authority
- JP
- Japan
- Prior art keywords
- space
- hole
- skinless
- connector
- connector base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
- H01R9/16—Fastening of connecting parts to base or case; Insulating connecting parts from base or case
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019227495 | 2019-12-17 | ||
| JP2019227495 | 2019-12-17 | ||
| PCT/JP2020/046736 WO2021125164A1 (ja) | 2019-12-17 | 2020-12-15 | 気密コネクタおよびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2021125164A1 JPWO2021125164A1 (https=) | 2021-06-24 |
| JP7635997B2 true JP7635997B2 (ja) | 2025-02-26 |
Family
ID=76478786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021565588A Active JP7635997B2 (ja) | 2019-12-17 | 2020-12-15 | 気密コネクタおよびその製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7635997B2 (https=) |
| WO (1) | WO2021125164A1 (https=) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003318531A (ja) | 2002-04-23 | 2003-11-07 | Matsushita Electric Works Ltd | 成形回路基板の製造方法 |
| JP2004087246A (ja) | 2002-08-26 | 2004-03-18 | Kyocera Corp | 電流導入端子 |
| JP2008034724A (ja) | 2006-07-31 | 2008-02-14 | Shin Etsu Polymer Co Ltd | 低誘電配線板の製造方法 |
| JP2014093121A (ja) | 2012-10-31 | 2014-05-19 | Tyco Electronics Japan Kk | コネクタ |
| JP2014207145A (ja) | 2013-04-12 | 2014-10-30 | タイコエレクトロニクスジャパン合同会社 | 平板状コネクタおよび隔壁実装構造 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2415372A1 (fr) * | 1978-01-18 | 1979-08-17 | Accumulateurs Fixes | Dispositif de traversee etanche d'une paroi par une connexion electrique |
| JPS5758702Y2 (https=) * | 1978-07-07 | 1982-12-15 | ||
| JPS614368U (ja) * | 1984-06-15 | 1986-01-11 | 株式会社東芝 | 接続装置 |
| US4913673A (en) * | 1988-07-29 | 1990-04-03 | Amp Incorporated | Hermetically sealed connector |
| JP2687149B2 (ja) * | 1988-10-15 | 1997-12-08 | 三共化成株式会社 | 金属膜と絶縁体とインサート部材の接続方法 |
-
2020
- 2020-12-15 WO PCT/JP2020/046736 patent/WO2021125164A1/ja not_active Ceased
- 2020-12-15 JP JP2021565588A patent/JP7635997B2/ja active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003318531A (ja) | 2002-04-23 | 2003-11-07 | Matsushita Electric Works Ltd | 成形回路基板の製造方法 |
| JP2004087246A (ja) | 2002-08-26 | 2004-03-18 | Kyocera Corp | 電流導入端子 |
| JP2008034724A (ja) | 2006-07-31 | 2008-02-14 | Shin Etsu Polymer Co Ltd | 低誘電配線板の製造方法 |
| JP2014093121A (ja) | 2012-10-31 | 2014-05-19 | Tyco Electronics Japan Kk | コネクタ |
| JP2014207145A (ja) | 2013-04-12 | 2014-10-30 | タイコエレクトロニクスジャパン合同会社 | 平板状コネクタおよび隔壁実装構造 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2021125164A1 (https=) | 2021-06-24 |
| CN114830442A (zh) | 2022-07-29 |
| WO2021125164A1 (ja) | 2021-06-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10237971B2 (en) | Wiring board assembly and method for producing same | |
| CN100413684C (zh) | 电路保护复合物 | |
| WO2000003572A1 (en) | Printed wiring board and method for producing the same | |
| JP2017055044A (ja) | リードフレーム | |
| EP0601375B1 (en) | Method for forming electrical interconnections in laminated vias | |
| JP7635997B2 (ja) | 気密コネクタおよびその製造方法 | |
| CN114830442B (zh) | 气密连接器及其制造方法 | |
| JP3498937B2 (ja) | 樹脂基板およびその製造方法 | |
| CN102438397B (zh) | 电路载体以及用于制造电路载体的方法 | |
| JP2011042818A (ja) | 三次元成形回路部品の製造方法 | |
| JP7706757B2 (ja) | 成形体およびその製造方法 | |
| JPH03120892A (ja) | 多層プリント配線板及びその製造方法 | |
| JP7625270B2 (ja) | 気密コネクタ | |
| JPH0779191B2 (ja) | 立体配線板の製造方法 | |
| JP5426325B2 (ja) | 成形回路部品 | |
| JPH11307904A (ja) | 成形回路部品およびその製造方法 | |
| JP2992165B2 (ja) | 配線板の製造方法 | |
| JP4575723B2 (ja) | 立体回路板の製造方法及び立体回路板 | |
| JPH08148809A (ja) | 回路形成方法及び導電回路形成部品 | |
| JP3706165B2 (ja) | ニッケル金属膜を用いたレーザーによる回路形成方法及び導電回路形成部品 | |
| CN108040419B (zh) | 一种表面增材结合3d-smt的电子产品壳体制备方法 | |
| TW202509283A (zh) | 於鐵氧體表面進行雷雕化鍍之製備方法及其雷雕化鍍鐵氧體結構 | |
| JPH08167769A (ja) | レーザーによる回路形成方法及び導電回路形成部品 | |
| JPH05191003A (ja) | 成形品 | |
| JPH09321427A (ja) | 射出成形プリント配線板の製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20231212 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20240806 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20241004 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20250107 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20250205 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 7635997 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |