JP7634674B2 - 回路装置 - Google Patents

回路装置 Download PDF

Info

Publication number
JP7634674B2
JP7634674B2 JP2023530340A JP2023530340A JP7634674B2 JP 7634674 B2 JP7634674 B2 JP 7634674B2 JP 2023530340 A JP2023530340 A JP 2023530340A JP 2023530340 A JP2023530340 A JP 2023530340A JP 7634674 B2 JP7634674 B2 JP 7634674B2
Authority
JP
Japan
Prior art keywords
partition plate
circuit device
circuit
partition
heat transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023530340A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2022270353A5 (https=
JPWO2022270353A1 (https=
Inventor
芳道 齊藤
義一 角田
健太 藤井
隆 熊谷
智仁 福田
雄二 白形
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of JPWO2022270353A1 publication Critical patent/JPWO2022270353A1/ja
Publication of JPWO2022270353A5 publication Critical patent/JPWO2022270353A5/ja
Application granted granted Critical
Publication of JP7634674B2 publication Critical patent/JP7634674B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/184—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components inserted in holes through the PCBs and wherein terminals of the components are connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/08—Cooling arrangements; Heating arrangements; Ventilating arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/32—Wound capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1147—Sealing or impregnating, e.g. of pores

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2023530340A 2021-06-22 2022-06-14 回路装置 Active JP7634674B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021103423 2021-06-22
JP2021103423 2021-06-22
PCT/JP2022/023770 WO2022270353A1 (ja) 2021-06-22 2022-06-14 回路装置

Publications (3)

Publication Number Publication Date
JPWO2022270353A1 JPWO2022270353A1 (https=) 2022-12-29
JPWO2022270353A5 JPWO2022270353A5 (https=) 2024-02-13
JP7634674B2 true JP7634674B2 (ja) 2025-02-21

Family

ID=84544331

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023530340A Active JP7634674B2 (ja) 2021-06-22 2022-06-14 回路装置

Country Status (3)

Country Link
US (1) US20240244754A1 (https=)
JP (1) JP7634674B2 (https=)
WO (1) WO2022270353A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000195748A (ja) 1998-12-25 2000-07-14 Matsushita Electric Ind Co Ltd コンデンサ
JP2014116400A (ja) 2012-12-07 2014-06-26 Toyota Motor Corp コンデンサモジュール
WO2016117441A1 (ja) 2015-01-22 2016-07-28 カルソニックカンセイ株式会社 コンデンサ構造
JP2019179856A (ja) 2018-03-30 2019-10-17 日本ケミコン株式会社 蓄電デバイスモジュール及び蓄電デバイスホルダー

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3778383B2 (ja) * 1996-10-11 2006-05-24 本田技研工業株式会社 コンデンサ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000195748A (ja) 1998-12-25 2000-07-14 Matsushita Electric Ind Co Ltd コンデンサ
JP2014116400A (ja) 2012-12-07 2014-06-26 Toyota Motor Corp コンデンサモジュール
WO2016117441A1 (ja) 2015-01-22 2016-07-28 カルソニックカンセイ株式会社 コンデンサ構造
JP2019179856A (ja) 2018-03-30 2019-10-17 日本ケミコン株式会社 蓄電デバイスモジュール及び蓄電デバイスホルダー

Also Published As

Publication number Publication date
US20240244754A1 (en) 2024-07-18
JPWO2022270353A1 (https=) 2022-12-29
WO2022270353A1 (ja) 2022-12-29

Similar Documents

Publication Publication Date Title
US6765285B2 (en) Power semiconductor device with high radiating efficiency
US8164904B2 (en) Electronic component module
US6724631B2 (en) Power converter package with enhanced thermal management
US3359461A (en) Modular circuit package
JP7154428B2 (ja) 電力変換装置および電力変換装置の製造方法
US4441140A (en) Printed circuit board holder
JP5469270B1 (ja) 電子機器
US20180047497A1 (en) Noise filter
JP2020178406A (ja) 電力変換装置
US11439017B2 (en) Voltage regulator module
EP3637445A1 (en) Voltage regulator module
KR20060121671A (ko) 전력 모듈 패키지 구조체
JP6999777B1 (ja) 電力変換装置
US12183498B2 (en) Power conversion device
JP7634673B2 (ja) 回路装置
JP2012190955A (ja) 射出成型基板
JP7809235B2 (ja) 電力変換装置
JPS5893264A (ja) デバイスの冷却装置
JP7634674B2 (ja) 回路装置
JP6979997B2 (ja) 電力用半導体装置
JP2022119028A (ja) コンデンサ
JP7588731B2 (ja) 電力変換装置及び電力変換装置の製造方法
JPH06507044A (ja) 液冷式装置内の発熱器の配列構造
US12255121B2 (en) Power semiconductor cooling assembly
US11337299B2 (en) Dissipating heat from an electronic assembly using forced convection, and method for dissipating heat from an electronic assembly

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20231107

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20231107

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20250114

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20250210

R150 Certificate of patent or registration of utility model

Ref document number: 7634674

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150