JP7632755B2 - 伸縮性配線基板 - Google Patents

伸縮性配線基板 Download PDF

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Publication number
JP7632755B2
JP7632755B2 JP2024528805A JP2024528805A JP7632755B2 JP 7632755 B2 JP7632755 B2 JP 7632755B2 JP 2024528805 A JP2024528805 A JP 2024528805A JP 2024528805 A JP2024528805 A JP 2024528805A JP 7632755 B2 JP7632755 B2 JP 7632755B2
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JP
Japan
Prior art keywords
elastic
film member
stretchable
wiring board
length direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
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JP2024528805A
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English (en)
Japanese (ja)
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JPWO2023248831A5 (https=
JPWO2023248831A1 (https=
Inventor
勇人 勝
孝義 小幡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
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Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of JPWO2023248831A1 publication Critical patent/JPWO2023248831A1/ja
Publication of JPWO2023248831A5 publication Critical patent/JPWO2023248831A5/ja
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0158—Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
JP2024528805A 2022-06-20 2023-06-09 伸縮性配線基板 Active JP7632755B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022098928 2022-06-20
JP2022098928 2022-06-20
PCT/JP2023/021507 WO2023248831A1 (ja) 2022-06-20 2023-06-09 伸縮性配線基板

Publications (3)

Publication Number Publication Date
JPWO2023248831A1 JPWO2023248831A1 (https=) 2023-12-28
JPWO2023248831A5 JPWO2023248831A5 (https=) 2025-02-06
JP7632755B2 true JP7632755B2 (ja) 2025-02-19

Family

ID=89379680

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024528805A Active JP7632755B2 (ja) 2022-06-20 2023-06-09 伸縮性配線基板

Country Status (3)

Country Link
US (1) US20250106986A1 (https=)
JP (1) JP7632755B2 (https=)
WO (1) WO2023248831A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001106984A (ja) 1999-10-01 2001-04-17 Nitto Denko Corp 局所変位検知用粘着フィルムまたはシート
JP2017177342A (ja) 2016-03-28 2017-10-05 大阪ガスケミカル株式会社 多層光学フィルム及びその製造方法
WO2019045108A1 (ja) 2017-09-04 2019-03-07 パナソニックＩｐマネジメント株式会社 伸縮性回路基板、及び、それを用いたパッチデバイス
JP2020155563A (ja) 2019-03-20 2020-09-24 大日本印刷株式会社 配線基板

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5567057B2 (ja) * 2012-04-02 2014-08-06 川崎重工業株式会社 コンクリート微小ひび割れセンサ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001106984A (ja) 1999-10-01 2001-04-17 Nitto Denko Corp 局所変位検知用粘着フィルムまたはシート
JP2017177342A (ja) 2016-03-28 2017-10-05 大阪ガスケミカル株式会社 多層光学フィルム及びその製造方法
WO2019045108A1 (ja) 2017-09-04 2019-03-07 パナソニックＩｐマネジメント株式会社 伸縮性回路基板、及び、それを用いたパッチデバイス
JP2020155563A (ja) 2019-03-20 2020-09-24 大日本印刷株式会社 配線基板

Also Published As

Publication number Publication date
WO2023248831A1 (ja) 2023-12-28
US20250106986A1 (en) 2025-03-27
JPWO2023248831A1 (https=) 2023-12-28

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