JPWO2023248831A1 - - Google Patents
Info
- Publication number
- JPWO2023248831A1 JPWO2023248831A1 JP2024528805A JP2024528805A JPWO2023248831A1 JP WO2023248831 A1 JPWO2023248831 A1 JP WO2023248831A1 JP 2024528805 A JP2024528805 A JP 2024528805A JP 2024528805 A JP2024528805 A JP 2024528805A JP WO2023248831 A1 JPWO2023248831 A1 JP WO2023248831A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0283—Stretchable printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0158—Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022098928 | 2022-06-20 | ||
| JP2022098928 | 2022-06-20 | ||
| PCT/JP2023/021507 WO2023248831A1 (ja) | 2022-06-20 | 2023-06-09 | 伸縮性配線基板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023248831A1 true JPWO2023248831A1 (https=) | 2023-12-28 |
| JPWO2023248831A5 JPWO2023248831A5 (https=) | 2025-02-06 |
| JP7632755B2 JP7632755B2 (ja) | 2025-02-19 |
Family
ID=89379680
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024528805A Active JP7632755B2 (ja) | 2022-06-20 | 2023-06-09 | 伸縮性配線基板 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20250106986A1 (https=) |
| JP (1) | JP7632755B2 (https=) |
| WO (1) | WO2023248831A1 (https=) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001106984A (ja) * | 1999-10-01 | 2001-04-17 | Nitto Denko Corp | 局所変位検知用粘着フィルムまたはシート |
| JP2017177342A (ja) * | 2016-03-28 | 2017-10-05 | 大阪ガスケミカル株式会社 | 多層光学フィルム及びその製造方法 |
| WO2019045108A1 (ja) * | 2017-09-04 | 2019-03-07 | パナソニックＩｐマネジメント株式会社 | 伸縮性回路基板、及び、それを用いたパッチデバイス |
| JP2020155563A (ja) * | 2019-03-20 | 2020-09-24 | 大日本印刷株式会社 | 配線基板 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5567057B2 (ja) * | 2012-04-02 | 2014-08-06 | 川崎重工業株式会社 | コンクリート微小ひび割れセンサ |
-
2023
- 2023-06-09 WO PCT/JP2023/021507 patent/WO2023248831A1/ja not_active Ceased
- 2023-06-09 JP JP2024528805A patent/JP7632755B2/ja active Active
-
2024
- 2024-12-09 US US18/973,337 patent/US20250106986A1/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001106984A (ja) * | 1999-10-01 | 2001-04-17 | Nitto Denko Corp | 局所変位検知用粘着フィルムまたはシート |
| JP2017177342A (ja) * | 2016-03-28 | 2017-10-05 | 大阪ガスケミカル株式会社 | 多層光学フィルム及びその製造方法 |
| WO2019045108A1 (ja) * | 2017-09-04 | 2019-03-07 | パナソニックＩｐマネジメント株式会社 | 伸縮性回路基板、及び、それを用いたパッチデバイス |
| JP2020155563A (ja) * | 2019-03-20 | 2020-09-24 | 大日本印刷株式会社 | 配線基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023248831A1 (ja) | 2023-12-28 |
| US20250106986A1 (en) | 2025-03-27 |
| JP7632755B2 (ja) | 2025-02-19 |
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