JP7622905B2 - 伸縮デバイス - Google Patents
伸縮デバイス Download PDFInfo
- Publication number
- JP7622905B2 JP7622905B2 JP2024523047A JP2024523047A JP7622905B2 JP 7622905 B2 JP7622905 B2 JP 7622905B2 JP 2024523047 A JP2024523047 A JP 2024523047A JP 2024523047 A JP2024523047 A JP 2024523047A JP 7622905 B2 JP7622905 B2 JP 7622905B2
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- stretchable
- insulating layer
- stretchable device
- polarity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 claims description 83
- 239000000463 material Substances 0.000 claims description 48
- 239000004020 conductor Substances 0.000 claims description 47
- 239000010410 layer Substances 0.000 description 97
- 238000013508 migration Methods 0.000 description 50
- 230000005012 migration Effects 0.000 description 50
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 18
- 229910052709 silver Inorganic materials 0.000 description 18
- 239000004332 silver Substances 0.000 description 18
- 239000011241 protective layer Substances 0.000 description 13
- 229920005989 resin Polymers 0.000 description 13
- 239000011347 resin Substances 0.000 description 13
- 238000004519 manufacturing process Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 12
- 238000007639 printing Methods 0.000 description 11
- 230000002829 reductive effect Effects 0.000 description 11
- 230000005684 electric field Effects 0.000 description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
- 229910052799 carbon Inorganic materials 0.000 description 6
- 239000000499 gel Substances 0.000 description 6
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 6
- 150000001768 cations Chemical class 0.000 description 5
- 150000002500 ions Chemical class 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000004433 Thermoplastic polyurethane Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
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- 229910052751 metal Inorganic materials 0.000 description 3
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- 238000007650 screen-printing Methods 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000036961 partial effect Effects 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000004909 Moisturizer Substances 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
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- 230000008602 contraction Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000000017 hydrogel Substances 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
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- 150000002739 metals Chemical class 0.000 description 1
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- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0283—Stretchable printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0311—Metallic part with specific elastic properties, e.g. bent piece of metal as electrical contact
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0391—Using different types of conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/10886—Other details
- H05K2201/10909—Materials of terminal, e.g. of leads or electrodes of components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Measurement And Recording Of Electrical Phenomena And Electrical Characteristics Of The Living Body (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022086226 | 2022-05-26 | ||
| JP2022086226 | 2022-05-26 | ||
| PCT/JP2023/018134 WO2023228798A1 (ja) | 2022-05-26 | 2023-05-15 | 伸縮デバイス |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023228798A1 JPWO2023228798A1 (https=) | 2023-11-30 |
| JPWO2023228798A5 JPWO2023228798A5 (https=) | 2025-01-24 |
| JP7622905B2 true JP7622905B2 (ja) | 2025-01-28 |
Family
ID=88919208
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024523047A Active JP7622905B2 (ja) | 2022-05-26 | 2023-05-15 | 伸縮デバイス |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20250089159A1 (https=) |
| JP (1) | JP7622905B2 (https=) |
| WO (1) | WO2023228798A1 (https=) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003209338A (ja) | 2002-01-11 | 2003-07-25 | Alps Electric Co Ltd | プリント配線基板の製造方法 |
| JP2005123419A (ja) | 2003-10-17 | 2005-05-12 | Tohoku Pioneer Corp | 配線基板、配線パターンの形成方法、有機elパネル |
| US20110272181A1 (en) | 2010-05-07 | 2011-11-10 | Samsung Electronics Co., Ltd. | Multilayer Stretchable Cable |
| US20150131239A1 (en) | 2013-10-17 | 2015-05-14 | Korea University Research And Business Foundation | Three Dimensional Stretchable Electronic Device and Manufacturing Method Comprising the Same |
| WO2021235282A1 (ja) | 2020-05-21 | 2021-11-25 | 株式会社村田製作所 | 伸縮性配線基板 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11297218A (ja) * | 1998-04-13 | 1999-10-29 | Hitachi Ltd | プラズマディスプレイパネルの電極構造 |
-
2023
- 2023-05-15 JP JP2024523047A patent/JP7622905B2/ja active Active
- 2023-05-15 WO PCT/JP2023/018134 patent/WO2023228798A1/ja not_active Ceased
-
2024
- 2024-11-21 US US18/955,236 patent/US20250089159A1/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003209338A (ja) | 2002-01-11 | 2003-07-25 | Alps Electric Co Ltd | プリント配線基板の製造方法 |
| JP2005123419A (ja) | 2003-10-17 | 2005-05-12 | Tohoku Pioneer Corp | 配線基板、配線パターンの形成方法、有機elパネル |
| US20110272181A1 (en) | 2010-05-07 | 2011-11-10 | Samsung Electronics Co., Ltd. | Multilayer Stretchable Cable |
| US20150131239A1 (en) | 2013-10-17 | 2015-05-14 | Korea University Research And Business Foundation | Three Dimensional Stretchable Electronic Device and Manufacturing Method Comprising the Same |
| WO2021235282A1 (ja) | 2020-05-21 | 2021-11-25 | 株式会社村田製作所 | 伸縮性配線基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2023228798A1 (https=) | 2023-11-30 |
| US20250089159A1 (en) | 2025-03-13 |
| WO2023228798A1 (ja) | 2023-11-30 |
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