JP7617347B1 - 樹脂組成物及び接続構造体の製造方法 - Google Patents

樹脂組成物及び接続構造体の製造方法 Download PDF

Info

Publication number
JP7617347B1
JP7617347B1 JP2024566008A JP2024566008A JP7617347B1 JP 7617347 B1 JP7617347 B1 JP 7617347B1 JP 2024566008 A JP2024566008 A JP 2024566008A JP 2024566008 A JP2024566008 A JP 2024566008A JP 7617347 B1 JP7617347 B1 JP 7617347B1
Authority
JP
Japan
Prior art keywords
resin composition
flux
electrode
solder
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024566008A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2025005037A1 (https=
JPWO2025005037A5 (https=
Inventor
雄太 山中
周治郎 定永
淳 長谷川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of JPWO2025005037A1 publication Critical patent/JPWO2025005037A1/ja
Application granted granted Critical
Publication of JP7617347B1 publication Critical patent/JP7617347B1/ja
Publication of JPWO2025005037A5 publication Critical patent/JPWO2025005037A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
JP2024566008A 2023-06-26 2024-06-24 樹脂組成物及び接続構造体の製造方法 Active JP7617347B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023104438 2023-06-26
JP2023104438 2023-06-26
PCT/JP2024/022797 WO2025005037A1 (ja) 2023-06-26 2024-06-24 樹脂組成物及び接続構造体の製造方法

Publications (3)

Publication Number Publication Date
JPWO2025005037A1 JPWO2025005037A1 (https=) 2025-01-02
JP7617347B1 true JP7617347B1 (ja) 2025-01-17
JPWO2025005037A5 JPWO2025005037A5 (https=) 2025-06-04

Family

ID=93939088

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024566008A Active JP7617347B1 (ja) 2023-06-26 2024-06-24 樹脂組成物及び接続構造体の製造方法

Country Status (4)

Country Link
JP (1) JP7617347B1 (https=)
CN (1) CN120604303A (https=)
TW (1) TW202515951A (https=)
WO (1) WO2025005037A1 (https=)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02500962A (ja) * 1986-10-31 1990-04-05 ジンマーライン‐エルルバッハー、エヴァルト　ヴィルヘルム フィルタ装置
JP2004508337A (ja) * 2000-09-08 2004-03-18 アバディーン　ユニヴァーシティ 薬剤耐性生物の治療
WO2012131971A1 (ja) * 2011-03-31 2012-10-04 積水化学工業株式会社 予備硬化物、粗化予備硬化物及び積層体
WO2017130892A1 (ja) * 2016-01-25 2017-08-03 積水化学工業株式会社 導電材料及び接続構造体
JP2019096550A (ja) * 2017-11-27 2019-06-20 積水化学工業株式会社 導電材料、接続構造体及び接続構造体の製造方法
WO2022210154A1 (ja) * 2021-04-01 2022-10-06 東レ株式会社 積層体および半導体装置の製造方法
WO2024034516A1 (ja) * 2022-08-08 2024-02-15 積水化学工業株式会社 導電ペースト及び接続構造体

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02500962A (ja) * 1986-10-31 1990-04-05 ジンマーライン‐エルルバッハー、エヴァルト　ヴィルヘルム フィルタ装置
JP2004508337A (ja) * 2000-09-08 2004-03-18 アバディーン　ユニヴァーシティ 薬剤耐性生物の治療
WO2012131971A1 (ja) * 2011-03-31 2012-10-04 積水化学工業株式会社 予備硬化物、粗化予備硬化物及び積層体
WO2017130892A1 (ja) * 2016-01-25 2017-08-03 積水化学工業株式会社 導電材料及び接続構造体
JP2019096550A (ja) * 2017-11-27 2019-06-20 積水化学工業株式会社 導電材料、接続構造体及び接続構造体の製造方法
WO2022210154A1 (ja) * 2021-04-01 2022-10-06 東レ株式会社 積層体および半導体装置の製造方法
WO2024034516A1 (ja) * 2022-08-08 2024-02-15 積水化学工業株式会社 導電ペースト及び接続構造体

Also Published As

Publication number Publication date
WO2025005037A1 (ja) 2025-01-02
TW202515951A (zh) 2025-04-16
JPWO2025005037A1 (https=) 2025-01-02
CN120604303A (zh) 2025-09-05

Similar Documents

Publication Publication Date Title
TWI809022B (zh) 焊料粒子、導電材料、焊料粒子之保管方法、導電材料之保管方法、導電材料之製造方法、連接構造體及連接構造體之製造方法
JP7730856B2 (ja) 導電材料、接続構造体及び接続構造体の製造方法
TWI798321B (zh) 焊料粒子、導電材料、焊料粒子之保管方法、導電材料之保管方法、導電材料之製造方法、連接構造體及連接構造體之製造方法
JP7356217B2 (ja) 導電材料、接続構造体及び接続構造体の製造方法
JP7518602B2 (ja) 導電材料、接続構造体及び接続構造体の製造方法
JP2023138947A (ja) 導電材料、接続構造体及び接続構造体の製造方法
JP7526371B2 (ja) 導電ペースト及び接続構造体
JP7617347B1 (ja) 樹脂組成物及び接続構造体の製造方法
TWI793307B (zh) 導電材料、連接構造體及連接構造體之製造方法
JP7497136B2 (ja) 導電材料、接続構造体及び接続構造体の製造方法
JP7698417B2 (ja) 導電材料、接続構造体及び接続構造体の製造方法
JP7637320B1 (ja) 樹脂組成物及び接続構造体の製造方法
JP7372745B2 (ja) 導電材料、接続構造体及び接続構造体の製造方法
JP7332458B2 (ja) 導電材料、接続構造体及び接続構造体の製造方法
JP7316109B2 (ja) 導電材料、接続構造体及び接続構造体の製造方法
JP7277289B2 (ja) 導電材料、接続構造体及び接続構造体の製造方法
JP2020092087A (ja) 導電フィルム及び接続構造体
JP2020119955A (ja) 接続構造体、接続構造体の製造方法、導電材料及び導電材料の製造方法
JP2019212621A (ja) 導電材料、接続構造体及び接続構造体の製造方法
JP7284699B2 (ja) 導電材料、接続構造体及び接続構造体の製造方法
JP2024010311A (ja) 導電材料、接続構造体及び接続構造体の製造方法
JP7303675B2 (ja) 導電材料、接続構造体及び接続構造体の製造方法
JP2024022788A (ja) 導電ペースト、導電ペーストの製造方法及び接続構造体
JP2021009774A (ja) 導電材料、接続構造体及び接続構造体の製造方法
JP2019145793A (ja) 電子部品、電子部品の製造方法及び接続構造体の製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20241107

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20241107

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20241107

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20241210

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20250106

R150 Certificate of patent or registration of utility model

Ref document number: 7617347

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150