CN120604303A - 树脂组合物和连接结构体的制造方法 - Google Patents

树脂组合物和连接结构体的制造方法

Info

Publication number
CN120604303A
CN120604303A CN202480011695.5A CN202480011695A CN120604303A CN 120604303 A CN120604303 A CN 120604303A CN 202480011695 A CN202480011695 A CN 202480011695A CN 120604303 A CN120604303 A CN 120604303A
Authority
CN
China
Prior art keywords
resin composition
electrode
flux
solder
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202480011695.5A
Other languages
English (en)
Chinese (zh)
Inventor
山中雄太
定永周治郎
长谷川淳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of CN120604303A publication Critical patent/CN120604303A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
CN202480011695.5A 2023-06-26 2024-06-24 树脂组合物和连接结构体的制造方法 Pending CN120604303A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023-104438 2023-06-26
JP2023104438 2023-06-26
PCT/JP2024/022797 WO2025005037A1 (ja) 2023-06-26 2024-06-24 樹脂組成物及び接続構造体の製造方法

Publications (1)

Publication Number Publication Date
CN120604303A true CN120604303A (zh) 2025-09-05

Family

ID=93939088

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202480011695.5A Pending CN120604303A (zh) 2023-06-26 2024-06-24 树脂组合物和连接结构体的制造方法

Country Status (4)

Country Link
JP (1) JP7617347B1 (https=)
CN (1) CN120604303A (https=)
TW (1) TW202515951A (https=)
WO (1) WO2025005037A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1315668C (en) * 1986-10-31 1993-04-06 Ewald Wilhelm Simmerlein-Erlbacher Filter-device and a filter-appliance from such filter-device
GB0022084D0 (en) * 2000-09-08 2000-10-25 Univ Aberdeen Treatment of multiply antibiotic-resistant organisms
WO2012131971A1 (ja) * 2011-03-31 2012-10-04 積水化学工業株式会社 予備硬化物、粗化予備硬化物及び積層体
KR102618237B1 (ko) * 2016-01-25 2023-12-28 세키스이가가쿠 고교가부시키가이샤 도전 재료 및 접속 구조체
JP7014576B2 (ja) * 2017-11-27 2022-02-01 積水化学工業株式会社 導電材料、接続構造体及び接続構造体の製造方法
EP4316815A4 (en) * 2021-04-01 2025-04-02 Toray Industries, Inc. Laminate and manufacturing method of semiconductor device
JP7526371B2 (ja) * 2022-08-08 2024-07-31 積水化学工業株式会社 導電ペースト及び接続構造体

Also Published As

Publication number Publication date
JP7617347B1 (ja) 2025-01-17
WO2025005037A1 (ja) 2025-01-02
TW202515951A (zh) 2025-04-16
JPWO2025005037A1 (https=) 2025-01-02

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