TW202515951A - 樹脂組合物及連接構造體之製造方法 - Google Patents

樹脂組合物及連接構造體之製造方法 Download PDF

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Publication number
TW202515951A
TW202515951A TW113123810A TW113123810A TW202515951A TW 202515951 A TW202515951 A TW 202515951A TW 113123810 A TW113123810 A TW 113123810A TW 113123810 A TW113123810 A TW 113123810A TW 202515951 A TW202515951 A TW 202515951A
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TW
Taiwan
Prior art keywords
resin composition
electrode
flux
solder
less
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TW113123810A
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English (en)
Chinese (zh)
Inventor
山中雄太
定永周治郎
長谷川淳
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日商積水化學工業股份有限公司
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Publication of TW202515951A publication Critical patent/TW202515951A/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
TW113123810A 2023-06-26 2024-06-26 樹脂組合物及連接構造體之製造方法 TW202515951A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023-104438 2023-06-26
JP2023104438 2023-06-26

Publications (1)

Publication Number Publication Date
TW202515951A true TW202515951A (zh) 2025-04-16

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ID=93939088

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Application Number Title Priority Date Filing Date
TW113123810A TW202515951A (zh) 2023-06-26 2024-06-26 樹脂組合物及連接構造體之製造方法

Country Status (4)

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JP (1) JP7617347B1 (https=)
CN (1) CN120604303A (https=)
TW (1) TW202515951A (https=)
WO (1) WO2025005037A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1315668C (en) * 1986-10-31 1993-04-06 Ewald Wilhelm Simmerlein-Erlbacher Filter-device and a filter-appliance from such filter-device
GB0022084D0 (en) * 2000-09-08 2000-10-25 Univ Aberdeen Treatment of multiply antibiotic-resistant organisms
WO2012131971A1 (ja) * 2011-03-31 2012-10-04 積水化学工業株式会社 予備硬化物、粗化予備硬化物及び積層体
KR102618237B1 (ko) * 2016-01-25 2023-12-28 세키스이가가쿠 고교가부시키가이샤 도전 재료 및 접속 구조체
JP7014576B2 (ja) * 2017-11-27 2022-02-01 積水化学工業株式会社 導電材料、接続構造体及び接続構造体の製造方法
EP4316815A4 (en) * 2021-04-01 2025-04-02 Toray Industries, Inc. Laminate and manufacturing method of semiconductor device
JP7526371B2 (ja) * 2022-08-08 2024-07-31 積水化学工業株式会社 導電ペースト及び接続構造体

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Publication number Publication date
JP7617347B1 (ja) 2025-01-17
WO2025005037A1 (ja) 2025-01-02
JPWO2025005037A1 (https=) 2025-01-02
CN120604303A (zh) 2025-09-05

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