JP7617083B2 - 固体撮像素子、および、撮像装置 - Google Patents

固体撮像素子、および、撮像装置 Download PDF

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JP7617083B2
JP7617083B2 JP2022516859A JP2022516859A JP7617083B2 JP 7617083 B2 JP7617083 B2 JP 7617083B2 JP 2022516859 A JP2022516859 A JP 2022516859A JP 2022516859 A JP2022516859 A JP 2022516859A JP 7617083 B2 JP7617083 B2 JP 7617083B2
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transistor
circuit
capacitive elements
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JPWO2021215093A1 (https=
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ルォンフォン 朝倉
博武 加藤
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Sony Semiconductor Solutions Corp
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • H04N25/771—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising storage means other than floating diffusion
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/40—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/40—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled
    • H04N25/46—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled by combining or binning pixels
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
    • H04N25/65—Noise processing, e.g. detecting, correcting, reducing or removing noise applied to reset noise, e.g. KTC noise related to CMOS structures by techniques other than CDS
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • H04N25/772—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising A/D, V/T, V/F, I/T or I/F converters
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/78—Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/79—Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
    • H04N25/616—Noise processing, e.g. detecting, correcting, reducing or removing noise involving a correlated sampling function, e.g. correlated double sampling [CDS] or triple sampling

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)
JP2022516859A 2020-04-21 2021-02-17 固体撮像素子、および、撮像装置 Active JP7617083B2 (ja)

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JP2020075185 2020-04-21
JP2020075185 2020-04-21
PCT/JP2021/005832 WO2021215093A1 (ja) 2020-04-21 2021-02-17 固体撮像素子、および、撮像装置

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JPWO2021215093A1 JPWO2021215093A1 (https=) 2021-10-28
JP7617083B2 true JP7617083B2 (ja) 2025-01-17

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US (2) US11974057B2 (https=)
EP (1) EP4142280B1 (https=)
JP (1) JP7617083B2 (https=)
KR (1) KR20230004483A (https=)
CN (3) CN121691950A (https=)
TW (1) TWI870579B (https=)
WO (1) WO2021215093A1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021215093A1 (ja) * 2020-04-21 2021-10-28 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子、および、撮像装置
KR102933507B1 (ko) * 2021-02-18 2026-03-04 에스케이하이닉스 주식회사 이미지 센싱 장치
JPWO2023085138A1 (https=) 2021-11-12 2023-05-19
WO2023105916A1 (ja) * 2021-12-08 2023-06-15 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子、撮像装置、および、固体撮像素子の制御方法
CN119404515A (zh) * 2022-06-29 2025-02-07 索尼半导体解决方案公司 固态成像元件、成像装置和控制固态成像元件的方法
WO2024042849A1 (ja) * 2022-08-25 2024-02-29 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子、および、固体撮像素子の制御方法
TW202441975A (zh) * 2023-03-24 2024-10-16 日商索尼半導體解決方案公司 光檢測裝置及電子機器
WO2025105333A1 (ja) * 2023-11-17 2025-05-22 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置
WO2025197256A1 (ja) * 2024-03-18 2025-09-25 ソニーセミコンダクタソリューションズ株式会社 撮像装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018113606A (ja) 2017-01-12 2018-07-19 ブリルニクスジャパン株式会社 固体撮像装置、固体撮像装置の駆動方法、および電子機器
JP2018207488A (ja) 2017-06-01 2018-12-27 パナソニックＩｐマネジメント株式会社 撮像装置
WO2019239670A1 (ja) 2018-06-14 2019-12-19 ソニーセミコンダクタソリューションズ株式会社 信号処理回路、固体撮像素子、および、信号処理回路の制御方法

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JP4882652B2 (ja) * 2006-10-06 2012-02-22 ソニー株式会社 固体撮像装置、固体撮像装置の駆動方法および撮像装置
US8717474B2 (en) * 2009-12-04 2014-05-06 Canon Kabushiki Kaisha Imaging apparatus and method for driving the same
JP4846076B1 (ja) 2010-06-11 2011-12-28 株式会社ブルックマンテクノロジ 増幅型固体撮像装置
JP6164846B2 (ja) * 2012-03-01 2017-07-19 キヤノン株式会社 撮像装置、撮像システム、撮像装置の駆動方法
JP2014209696A (ja) * 2012-07-23 2014-11-06 ソニー株式会社 固体撮像装置、信号読み出し方法、および電子機器
US9979918B2 (en) * 2014-01-30 2018-05-22 Shanghai Ic R&D Center Co., Ltd Image sensor and data tranmission method thereof
US9654712B2 (en) * 2015-10-07 2017-05-16 Semiconductor Components Industries, Llc Pixels with a global shutter and high dynamic range
JP2018011272A (ja) * 2016-07-15 2018-01-18 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子、及び、固体撮像素子の駆動方法、並びに、電子機器
JP2018182462A (ja) * 2017-04-07 2018-11-15 ルネサスエレクトロニクス株式会社 撮像素子
EP4535815A1 (en) * 2017-05-10 2025-04-09 Brillnics Singapore Pte. Ltd. Solid-state imaging device, method for driving solid-state imaging device, and electronic apparatus
EP3651450B1 (en) * 2017-07-07 2025-12-31 Brillnics Singapore Pte. Ltd. Semiconductor Imaging Device, Control Method for Semiconductor Imaging Device, and Electronic Equipment
JP7198675B2 (ja) * 2018-01-29 2023-01-04 日本放送協会 固体撮像素子、その駆動回路および撮像装置
CN108419032B (zh) * 2018-03-01 2021-01-05 思特威(上海)电子科技有限公司 支持多种曝光模式的hdr图像传感器像素结构及成像系统
WO2021215093A1 (ja) * 2020-04-21 2021-10-28 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子、および、撮像装置

Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
JP2018113606A (ja) 2017-01-12 2018-07-19 ブリルニクスジャパン株式会社 固体撮像装置、固体撮像装置の駆動方法、および電子機器
JP2018207488A (ja) 2017-06-01 2018-12-27 パナソニックＩｐマネジメント株式会社 撮像装置
WO2019239670A1 (ja) 2018-06-14 2019-12-19 ソニーセミコンダクタソリューションズ株式会社 信号処理回路、固体撮像素子、および、信号処理回路の制御方法

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Publication number Publication date
CN115336256A (zh) 2022-11-11
EP4142280A4 (en) 2023-09-20
US20230028780A1 (en) 2023-01-26
CN115336256B (zh) 2025-12-19
CN121908154A (zh) 2026-04-21
JPWO2021215093A1 (https=) 2021-10-28
EP4142280A1 (en) 2023-03-01
US11974057B2 (en) 2024-04-30
EP4142280B1 (en) 2025-11-05
TW202201949A (zh) 2022-01-01
US20240348943A1 (en) 2024-10-17
KR20230004483A (ko) 2023-01-06
CN121691950A (zh) 2026-03-17
TWI870579B (zh) 2025-01-21
WO2021215093A1 (ja) 2021-10-28

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