JP7577126B2 - 二液硬化型組成物セット、熱伝導性硬化物及び電子機器 - Google Patents

二液硬化型組成物セット、熱伝導性硬化物及び電子機器 Download PDF

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JP7577126B2
JP7577126B2 JP2022555439A JP2022555439A JP7577126B2 JP 7577126 B2 JP7577126 B2 JP 7577126B2 JP 2022555439 A JP2022555439 A JP 2022555439A JP 2022555439 A JP2022555439 A JP 2022555439A JP 7577126 B2 JP7577126 B2 JP 7577126B2
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thermally conductive
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meth
amino
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正雄 小野塚
雅士 久米
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Denka Co Ltd
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Denka Co Ltd
Denki Kagaku Kogyo KK
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
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    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
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    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
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    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
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    • C08F230/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal
    • C08F230/02—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing phosphorus
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    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
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    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
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    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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    • H10W40/00—Arrangements for thermal protection or thermal control
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    • H—ELECTRICITY
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  • Chemical & Material Sciences (AREA)
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  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2022555439A 2020-10-05 2021-10-01 二液硬化型組成物セット、熱伝導性硬化物及び電子機器 Active JP7577126B2 (ja)

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PCT/JP2021/036405 WO2022075214A1 (ja) 2020-10-05 2021-10-01 二液硬化型組成物セット、熱伝導性硬化物及び電子機器

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CN116656128B (zh) * 2023-05-30 2025-09-09 深圳市傲川科技有限公司 一种有机硅导热相变材料及其制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003528198A (ja) 2000-03-16 2003-09-24 クロムプトン コーポレイション シリコーンアミノ−エポキシ架橋性システム
JP2004109179A (ja) 2002-09-13 2004-04-08 Dainippon Ink & Chem Inc カラーレジスト組成物
JP2011151280A (ja) 2010-01-25 2011-08-04 Denki Kagaku Kogyo Kk 放熱部材及びその製造方法
JP2016121350A (ja) 2014-12-24 2016-07-07 東洋インキＳｃホールディングス株式会社 シリカ分散体、および、活性エネルギー線硬化性樹脂組成物
CN107325782A (zh) 2017-05-19 2017-11-07 天永诚高分子材料（常州）有限公司 一种双组分灌封胶及其制备方法

Family Cites Families (4)

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Publication number Priority date Publication date Assignee Title
JPS60179417A (ja) * 1984-02-27 1985-09-13 Shin Etsu Chem Co Ltd 液状シリコ−ンゴム組成物
JP2900408B2 (ja) * 1989-06-27 1999-06-02 大日本インキ化学工業株式会社 低起泡性フッ素系界面活性剤
DE4309700C2 (de) * 1993-03-25 1995-02-23 Sigri Great Lakes Carbon Gmbh Verfahren zur Herstellung eines Schichtstoffes aus Metall und Graphit
JP3498823B2 (ja) * 1996-04-30 2004-02-23 電気化学工業株式会社 放熱スペーサーおよびその用途

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003528198A (ja) 2000-03-16 2003-09-24 クロムプトン コーポレイション シリコーンアミノ−エポキシ架橋性システム
JP2004109179A (ja) 2002-09-13 2004-04-08 Dainippon Ink & Chem Inc カラーレジスト組成物
JP2011151280A (ja) 2010-01-25 2011-08-04 Denki Kagaku Kogyo Kk 放熱部材及びその製造方法
JP2016121350A (ja) 2014-12-24 2016-07-07 東洋インキＳｃホールディングス株式会社 シリカ分散体、および、活性エネルギー線硬化性樹脂組成物
CN107325782A (zh) 2017-05-19 2017-11-07 天永诚高分子材料（常州）有限公司 一种双组分灌封胶及其制备方法

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