JP7562418B2 - アレイ基板及び表示装置 - Google Patents

アレイ基板及び表示装置 Download PDF

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Publication number
JP7562418B2
JP7562418B2 JP2020560908A JP2020560908A JP7562418B2 JP 7562418 B2 JP7562418 B2 JP 7562418B2 JP 2020560908 A JP2020560908 A JP 2020560908A JP 2020560908 A JP2020560908 A JP 2020560908A JP 7562418 B2 JP7562418 B2 JP 7562418B2
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Japan
Prior art keywords
conductive portion
array substrate
electrode
connection section
electrode pad
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JP2020560908A
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English (en)
Japanese (ja)
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JP2022515578A (ja
JP2022515578A5 (https=
Inventor
震 ▲張▼
庭良 ▲劉▼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
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BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
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Publication of JP2022515578A publication Critical patent/JP2022515578A/ja
Publication of JP2022515578A5 publication Critical patent/JP2022515578A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/441—Interconnections, e.g. scanning lines
    • H10D86/443—Interconnections, e.g. scanning lines adapted for preventing breakage, peeling or short circuiting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/441—Interconnections, e.g. scanning lines

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP2020560908A 2019-01-08 2019-12-23 アレイ基板及び表示装置 Active JP7562418B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201910016329.X 2019-01-08
CN201910016329.XA CN109742115B (zh) 2019-01-08 2019-01-08 阵列基板和显示装置
PCT/CN2019/127345 WO2020143437A1 (zh) 2019-01-08 2019-12-23 阵列基板和显示装置

Publications (3)

Publication Number Publication Date
JP2022515578A JP2022515578A (ja) 2022-02-21
JP2022515578A5 JP2022515578A5 (https=) 2023-01-06
JP7562418B2 true JP7562418B2 (ja) 2024-10-07

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ID=66363834

Family Applications (1)

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JP2020560908A Active JP7562418B2 (ja) 2019-01-08 2019-12-23 アレイ基板及び表示装置

Country Status (5)

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US (3) US11462572B2 (https=)
EP (1) EP3910678A4 (https=)
JP (1) JP7562418B2 (https=)
CN (1) CN109742115B (https=)
WO (1) WO2020143437A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109742115B (zh) * 2019-01-08 2021-01-26 京东方科技集团股份有限公司 阵列基板和显示装置

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004102053A (ja) 2002-09-11 2004-04-02 Seiko Epson Corp 電気光学装置、電気光学装置の製造方法及び電子機器
JP2004355014A (ja) 2004-07-26 2004-12-16 Hitachi Ltd 表示装置
JP2005250062A (ja) 2004-03-03 2005-09-15 Toshiba Matsushita Display Technology Co Ltd 液晶表示装置
JP2012099290A (ja) 2010-10-29 2012-05-24 Hitachi Displays Ltd 有機ｅｌ表示装置
WO2012070558A1 (ja) 2010-11-26 2012-05-31 シャープ株式会社 配線基板および表示装置用配線基板
WO2013186919A1 (ja) 2012-06-15 2013-12-19 パイオニア株式会社 有機エレクトロルミネッセンスデバイス
CN106707646A (zh) 2017-02-07 2017-05-24 厦门天马微电子有限公司 一种阵列基板和显示面板
CN106919287A (zh) 2017-03-08 2017-07-04 上海中航光电子有限公司 一种触控显示面板和触控显示装置
US20170237027A1 (en) 2014-12-30 2017-08-17 Lg Display Co., Ltd. Flexible Display Device with Chamfered Polarization Layer
US20170345847A1 (en) 2016-05-27 2017-11-30 Samsung Display Co., Ltd. Display apparatus
JP2017215965A (ja) 2016-05-31 2017-12-07 三星ディスプレイ株式會社Ｓａｍｓｕｎｇ Ｄｉｓｐｌａｙ Ｃｏ．，Ｌｔｄ． 表示装置
JP2018200787A (ja) 2017-05-26 2018-12-20 株式会社ジャパンディスプレイ 表示装置

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JP2005062582A (ja) * 2003-08-18 2005-03-10 Hitachi Displays Ltd 表示装置
KR100611153B1 (ko) * 2003-11-27 2006-08-09 삼성에스디아이 주식회사 평판 표시 소자
KR100700650B1 (ko) * 2005-01-05 2007-03-27 삼성에스디아이 주식회사 유기 전계 발광 장치 및 그 제조 방법
KR100765519B1 (ko) * 2006-02-07 2007-10-10 엘지전자 주식회사 전계발광소자 및 그의 제조방법
CN101510383B (zh) * 2009-03-26 2011-12-07 友达光电股份有限公司 平面显示面板
KR101781506B1 (ko) * 2010-12-23 2017-09-26 엘지디스플레이 주식회사 유기전계 발광소자용 기판
KR101987382B1 (ko) * 2012-12-21 2019-06-10 엘지디스플레이 주식회사 유연한 표시장치와 이의 제조방법
KR102086644B1 (ko) * 2013-12-31 2020-03-09 엘지디스플레이 주식회사 플렉서블표시장치 및 이의 제조방법
KR102140042B1 (ko) * 2014-03-27 2020-08-03 엘지디스플레이 주식회사 표시장치 어레이 기판
US9793106B2 (en) * 2014-11-06 2017-10-17 Texas Instruments Incorporated Reliability improvement of polymer-based capacitors by moisture barrier
US9765328B2 (en) 2014-11-25 2017-09-19 Arizona Board Of Regents On Behalf Of Arizona State University Nuclease-resistant DNA analogues
KR102477299B1 (ko) * 2015-06-12 2022-12-14 삼성디스플레이 주식회사 디스플레이 장치
US9715304B2 (en) 2015-06-30 2017-07-25 Synaptics Incorporated Regular via pattern for sensor-based input device
KR101763616B1 (ko) * 2015-07-29 2017-08-02 삼성디스플레이 주식회사 유기 발광 표시 장치
KR102643637B1 (ko) * 2016-03-02 2024-03-06 삼성디스플레이 주식회사 디스플레이 장치
KR102525124B1 (ko) * 2016-04-05 2023-04-26 삼성디스플레이 주식회사 표시 장치
KR102648401B1 (ko) 2016-09-30 2024-03-18 삼성디스플레이 주식회사 디스플레이 장치
CN107369692B (zh) * 2017-06-09 2021-04-30 厦门天马微电子有限公司 显示面板及显示装置
CN107065336B (zh) * 2017-06-13 2020-05-01 厦门天马微电子有限公司 一种阵列基板、显示面板及显示装置
KR102544242B1 (ko) * 2018-03-16 2023-06-19 삼성디스플레이 주식회사 표시 장치
KR102562901B1 (ko) * 2018-03-26 2023-08-04 삼성디스플레이 주식회사 디스플레이 장치
WO2019186836A1 (ja) * 2018-03-28 2019-10-03 シャープ株式会社 表示デバイス及び表示デバイスの製造方法
CN109742115B (zh) * 2019-01-08 2021-01-26 京东方科技集团股份有限公司 阵列基板和显示装置

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004102053A (ja) 2002-09-11 2004-04-02 Seiko Epson Corp 電気光学装置、電気光学装置の製造方法及び電子機器
JP2005250062A (ja) 2004-03-03 2005-09-15 Toshiba Matsushita Display Technology Co Ltd 液晶表示装置
JP2004355014A (ja) 2004-07-26 2004-12-16 Hitachi Ltd 表示装置
JP2012099290A (ja) 2010-10-29 2012-05-24 Hitachi Displays Ltd 有機ｅｌ表示装置
WO2012070558A1 (ja) 2010-11-26 2012-05-31 シャープ株式会社 配線基板および表示装置用配線基板
WO2013186919A1 (ja) 2012-06-15 2013-12-19 パイオニア株式会社 有機エレクトロルミネッセンスデバイス
US20170237027A1 (en) 2014-12-30 2017-08-17 Lg Display Co., Ltd. Flexible Display Device with Chamfered Polarization Layer
US20170345847A1 (en) 2016-05-27 2017-11-30 Samsung Display Co., Ltd. Display apparatus
JP2017215965A (ja) 2016-05-31 2017-12-07 三星ディスプレイ株式會社Ｓａｍｓｕｎｇ Ｄｉｓｐｌａｙ Ｃｏ．，Ｌｔｄ． 表示装置
CN106707646A (zh) 2017-02-07 2017-05-24 厦门天马微电子有限公司 一种阵列基板和显示面板
CN106919287A (zh) 2017-03-08 2017-07-04 上海中航光电子有限公司 一种触控显示面板和触控显示装置
JP2018200787A (ja) 2017-05-26 2018-12-20 株式会社ジャパンディスプレイ 表示装置

Also Published As

Publication number Publication date
JP2022515578A (ja) 2022-02-21
EP3910678A4 (en) 2022-10-12
US20220406821A1 (en) 2022-12-22
EP3910678A1 (en) 2021-11-17
CN109742115B (zh) 2021-01-26
US20250338740A1 (en) 2025-10-30
US20210249447A1 (en) 2021-08-12
CN109742115A (zh) 2019-05-10
US11462572B2 (en) 2022-10-04
US12389768B2 (en) 2025-08-12
WO2020143437A1 (zh) 2020-07-16

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