CN109742115B - 阵列基板和显示装置 - Google Patents

阵列基板和显示装置 Download PDF

Info

Publication number
CN109742115B
CN109742115B CN201910016329.XA CN201910016329A CN109742115B CN 109742115 B CN109742115 B CN 109742115B CN 201910016329 A CN201910016329 A CN 201910016329A CN 109742115 B CN109742115 B CN 109742115B
Authority
CN
China
Prior art keywords
electrode
array substrate
electrode pad
conductive portion
connection segment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201910016329.XA
Other languages
English (en)
Chinese (zh)
Other versions
CN109742115A (zh
Inventor
张震
刘庭良
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd, Chengdu BOE Optoelectronics Technology Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to CN201910016329.XA priority Critical patent/CN109742115B/zh
Publication of CN109742115A publication Critical patent/CN109742115A/zh
Priority to EP19908209.0A priority patent/EP3910678A4/en
Priority to US16/768,194 priority patent/US11462572B2/en
Priority to PCT/CN2019/127345 priority patent/WO2020143437A1/zh
Priority to JP2020560908A priority patent/JP7562418B2/ja
Application granted granted Critical
Publication of CN109742115B publication Critical patent/CN109742115B/zh
Priority to US17/891,173 priority patent/US12389768B2/en
Priority to US19/263,794 priority patent/US20250338740A1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/441—Interconnections, e.g. scanning lines
    • H10D86/443—Interconnections, e.g. scanning lines adapted for preventing breakage, peeling or short circuiting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/441—Interconnections, e.g. scanning lines

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
CN201910016329.XA 2019-01-08 2019-01-08 阵列基板和显示装置 Active CN109742115B (zh)

Priority Applications (7)

Application Number Priority Date Filing Date Title
CN201910016329.XA CN109742115B (zh) 2019-01-08 2019-01-08 阵列基板和显示装置
EP19908209.0A EP3910678A4 (en) 2019-01-08 2019-12-23 ARRAY SUBSTRATE AND DISPLAY DEVICE
US16/768,194 US11462572B2 (en) 2019-01-08 2019-12-23 Array substrate and display device
PCT/CN2019/127345 WO2020143437A1 (zh) 2019-01-08 2019-12-23 阵列基板和显示装置
JP2020560908A JP7562418B2 (ja) 2019-01-08 2019-12-23 アレイ基板及び表示装置
US17/891,173 US12389768B2 (en) 2019-01-08 2022-08-19 Array substrate and display device
US19/263,794 US20250338740A1 (en) 2019-01-08 2025-07-09 Array substrate and display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910016329.XA CN109742115B (zh) 2019-01-08 2019-01-08 阵列基板和显示装置

Publications (2)

Publication Number Publication Date
CN109742115A CN109742115A (zh) 2019-05-10
CN109742115B true CN109742115B (zh) 2021-01-26

Family

ID=66363834

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910016329.XA Active CN109742115B (zh) 2019-01-08 2019-01-08 阵列基板和显示装置

Country Status (5)

Country Link
US (3) US11462572B2 (https=)
EP (1) EP3910678A4 (https=)
JP (1) JP7562418B2 (https=)
CN (1) CN109742115B (https=)
WO (1) WO2020143437A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109742115B (zh) * 2019-01-08 2021-01-26 京东方科技集团股份有限公司 阵列基板和显示装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1584684A (zh) * 2003-08-18 2005-02-23 株式会社日立显示器 显示装置
KR20070080425A (ko) * 2006-02-07 2007-08-10 엘지전자 주식회사 전계발광소자 및 그의 제조방법

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4529346B2 (ja) * 2002-09-11 2010-08-25 セイコーエプソン株式会社 電気光学装置、電気光学装置の製造方法及び電子機器
KR100611153B1 (ko) * 2003-11-27 2006-08-09 삼성에스디아이 주식회사 평판 표시 소자
JP2005250062A (ja) * 2004-03-03 2005-09-15 Toshiba Matsushita Display Technology Co Ltd 液晶表示装置
JP2004355014A (ja) * 2004-07-26 2004-12-16 Hitachi Ltd 表示装置
KR100700650B1 (ko) * 2005-01-05 2007-03-27 삼성에스디아이 주식회사 유기 전계 발광 장치 및 그 제조 방법
CN101510383B (zh) * 2009-03-26 2011-12-07 友达光电股份有限公司 平面显示面板
JP2012099290A (ja) * 2010-10-29 2012-05-24 Hitachi Displays Ltd 有機ｅｌ表示装置
WO2012070558A1 (ja) * 2010-11-26 2012-05-31 シャープ株式会社 配線基板および表示装置用配線基板
KR101781506B1 (ko) * 2010-12-23 2017-09-26 엘지디스플레이 주식회사 유기전계 발광소자용 기판
WO2013186919A1 (ja) * 2012-06-15 2013-12-19 パイオニア株式会社 有機エレクトロルミネッセンスデバイス
KR101987382B1 (ko) * 2012-12-21 2019-06-10 엘지디스플레이 주식회사 유연한 표시장치와 이의 제조방법
KR102086644B1 (ko) * 2013-12-31 2020-03-09 엘지디스플레이 주식회사 플렉서블표시장치 및 이의 제조방법
KR102140042B1 (ko) * 2014-03-27 2020-08-03 엘지디스플레이 주식회사 표시장치 어레이 기판
US9793106B2 (en) * 2014-11-06 2017-10-17 Texas Instruments Incorporated Reliability improvement of polymer-based capacitors by moisture barrier
US9765328B2 (en) 2014-11-25 2017-09-19 Arizona Board Of Regents On Behalf Of Arizona State University Nuclease-resistant DNA analogues
US9287329B1 (en) * 2014-12-30 2016-03-15 Lg Display Co., Ltd. Flexible display device with chamfered polarization layer
KR102477299B1 (ko) * 2015-06-12 2022-12-14 삼성디스플레이 주식회사 디스플레이 장치
US9715304B2 (en) 2015-06-30 2017-07-25 Synaptics Incorporated Regular via pattern for sensor-based input device
KR101763616B1 (ko) * 2015-07-29 2017-08-02 삼성디스플레이 주식회사 유기 발광 표시 장치
KR102643637B1 (ko) * 2016-03-02 2024-03-06 삼성디스플레이 주식회사 디스플레이 장치
KR102525124B1 (ko) * 2016-04-05 2023-04-26 삼성디스플레이 주식회사 표시 장치
KR102404573B1 (ko) * 2016-05-27 2022-06-03 삼성디스플레이 주식회사 디스플레이 장치
KR102544532B1 (ko) * 2016-05-31 2023-06-20 삼성디스플레이 주식회사 표시 장치
KR102648401B1 (ko) 2016-09-30 2024-03-18 삼성디스플레이 주식회사 디스플레이 장치
CN106707646A (zh) * 2017-02-07 2017-05-24 厦门天马微电子有限公司 一种阵列基板和显示面板
CN106919287B (zh) * 2017-03-08 2020-03-20 上海中航光电子有限公司 一种触控显示面板和触控显示装置
JP6947536B2 (ja) * 2017-05-26 2021-10-13 株式会社ジャパンディスプレイ 表示装置
CN107369692B (zh) * 2017-06-09 2021-04-30 厦门天马微电子有限公司 显示面板及显示装置
CN107065336B (zh) * 2017-06-13 2020-05-01 厦门天马微电子有限公司 一种阵列基板、显示面板及显示装置
KR102544242B1 (ko) * 2018-03-16 2023-06-19 삼성디스플레이 주식회사 표시 장치
KR102562901B1 (ko) * 2018-03-26 2023-08-04 삼성디스플레이 주식회사 디스플레이 장치
WO2019186836A1 (ja) * 2018-03-28 2019-10-03 シャープ株式会社 表示デバイス及び表示デバイスの製造方法
CN109742115B (zh) * 2019-01-08 2021-01-26 京东方科技集团股份有限公司 阵列基板和显示装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1584684A (zh) * 2003-08-18 2005-02-23 株式会社日立显示器 显示装置
KR20070080425A (ko) * 2006-02-07 2007-08-10 엘지전자 주식회사 전계발광소자 및 그의 제조방법

Also Published As

Publication number Publication date
JP2022515578A (ja) 2022-02-21
EP3910678A4 (en) 2022-10-12
US20220406821A1 (en) 2022-12-22
EP3910678A1 (en) 2021-11-17
JP7562418B2 (ja) 2024-10-07
US20250338740A1 (en) 2025-10-30
US20210249447A1 (en) 2021-08-12
CN109742115A (zh) 2019-05-10
US11462572B2 (en) 2022-10-04
US12389768B2 (en) 2025-08-12
WO2020143437A1 (zh) 2020-07-16

Similar Documents

Publication Publication Date Title
US8896012B2 (en) Light emitting diode
CN104620399B (zh) 晶圆级发光二极管阵列
CN107516704B (zh) 具有反射电极的发光装置
CN107482042A (zh) Oled显示基板及其制作方法、oled显示装置
US10164153B2 (en) Light-emitting element
US11637218B2 (en) Light-emitting diode
US20070069218A1 (en) Light-emitting diode chip
CN107810561A (zh) 太阳能电池的一维金属化
CN102593287A (zh) 发光二极管晶粒及其制造方法、发光二极管封装结构
CN108389945A (zh) 发光元件
CN114420865A (zh) Oled显示模组和oled显示装置
US20250338740A1 (en) Array substrate and display device
US12225755B2 (en) Display panel and display device including heat transferring guiding layer
US9735367B2 (en) Light emitting diode
US20160190461A1 (en) Light emitting diode
US9564594B2 (en) Light emitting diode
CN113196877A (zh) 有机el面板
US11258033B2 (en) Display panel and display module
CN102593306B (zh) 发光二极管晶粒及其制造方法、发光二极管封装结构
JP7411426B2 (ja) 発光装置
KR102785427B1 (ko) 유기발광 표시패널 및 이를 포함하는 유기발광 표시장치
JP2013026027A (ja) 有機ｅｌデバイスおよびその製造方法
CN100426542C (zh) 发光二极管芯片
CN102593302A (zh) 发光二极管晶粒及其制造方法、发光二极管封装结构
US7759675B2 (en) Organic electroluminescent device

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant