JP7560345B2 - ダイシングテープ - Google Patents

ダイシングテープ Download PDF

Info

Publication number
JP7560345B2
JP7560345B2 JP2020208544A JP2020208544A JP7560345B2 JP 7560345 B2 JP7560345 B2 JP 7560345B2 JP 2020208544 A JP2020208544 A JP 2020208544A JP 2020208544 A JP2020208544 A JP 2020208544A JP 7560345 B2 JP7560345 B2 JP 7560345B2
Authority
JP
Japan
Prior art keywords
resin
die bond
film
adhesive layer
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020208544A
Other languages
English (en)
Japanese (ja)
Other versions
JP2022095302A (ja
JP2022095302A5 (https=
Inventor
俊之 角田
慧 古川
浩和 佐藤
理恵 田中
晃良 増田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Maxell Ltd
Original Assignee
Maxell Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Maxell Ltd filed Critical Maxell Ltd
Priority to JP2020208544A priority Critical patent/JP7560345B2/ja
Priority to CN202111526569.8A priority patent/CN114634768A/zh
Priority to TW110146695A priority patent/TWI888683B/zh
Priority to KR1020210179328A priority patent/KR102907712B1/ko
Publication of JP2022095302A publication Critical patent/JP2022095302A/ja
Publication of JP2022095302A5 publication Critical patent/JP2022095302A5/ja
Application granted granted Critical
Publication of JP7560345B2 publication Critical patent/JP7560345B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing atoms other than carbon or hydrogen
    • C08L23/0869—Copolymers of ethene with unsaturated hydrocarbons containing atoms other than carbon or hydrogen with unsaturated acids, e.g. [meth]acrylic acid; with unsaturated esters, e.g. [meth]acrylic acid esters
    • C08L23/0876—Salts thereof, i.e. ionomers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/241—Polyolefin, e.g.rubber
    • C09J7/243—Ethylene or propylene polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/04—Presence of homo or copolymers of ethene
    • C09J2423/046—Presence of homo or copolymers of ethene in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2475/00—Presence of polyurethane
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2477/00—Presence of polyamide
    • C09J2477/006—Presence of polyamide in the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7428—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
JP2020208544A 2020-12-16 2020-12-16 ダイシングテープ Active JP7560345B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2020208544A JP7560345B2 (ja) 2020-12-16 2020-12-16 ダイシングテープ
CN202111526569.8A CN114634768A (zh) 2020-12-16 2021-12-13 切割胶带和切割芯片接合膜
TW110146695A TWI888683B (zh) 2020-12-16 2021-12-14 晶圓切割膠帶
KR1020210179328A KR102907712B1 (ko) 2020-12-16 2021-12-15 다이싱 테이프 및 다이싱 다이 본드 필름

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020208544A JP7560345B2 (ja) 2020-12-16 2020-12-16 ダイシングテープ

Publications (3)

Publication Number Publication Date
JP2022095302A JP2022095302A (ja) 2022-06-28
JP2022095302A5 JP2022095302A5 (https=) 2023-03-07
JP7560345B2 true JP7560345B2 (ja) 2024-10-02

Family

ID=81945987

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020208544A Active JP7560345B2 (ja) 2020-12-16 2020-12-16 ダイシングテープ

Country Status (4)

Country Link
JP (1) JP7560345B2 (https=)
KR (1) KR102907712B1 (https=)
CN (1) CN114634768A (https=)
TW (1) TWI888683B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2023188714A1 (https=) * 2022-03-31 2023-10-05
JP2024000458A (ja) * 2022-06-20 2024-01-05 マクセル株式会社 ダイシングテープおよびダイシングテープを使用する、半導体チップおよび半導体装置の製造方法
WO2026058931A1 (ja) * 2024-09-13 2026-03-19 株式会社レゾナック フィルム状接着剤、ダイシング・ダイボンディング一体型フィルム、並びに半導体装置及びその製造方法
CN119773242B (zh) * 2024-12-31 2025-10-17 中国科学院宁波材料技术与工程研究所 一种石墨烯纵向导热体及其制备方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160040043A1 (en) 2013-12-19 2016-02-11 Lg Chem, Ltd. Composition for forming adhesive layer of dicing film, and dicing film
JP2017098369A (ja) 2015-11-20 2017-06-01 三井・デュポンポリケミカル株式会社 ダイシングフィルム基材用樹脂組成物、ダイシングフィルム基材およびダイシングフィルム
JP2018056282A (ja) 2016-09-28 2018-04-05 リンテック株式会社 保護膜付き半導体チップの製造方法及び半導体装置の製造方法
WO2018123804A1 (ja) 2016-12-27 2018-07-05 三井・デュポンポリケミカル株式会社 ダイシングフィルム基材およびダイシングフィルム
JP2019009203A (ja) 2017-06-22 2019-01-17 日東電工株式会社 ダイシングダイボンドフィルム
JP2019016816A (ja) 2016-11-18 2019-01-31 古河電気工業株式会社 貼合体
JP2020053453A (ja) 2018-09-25 2020-04-02 古河電気工業株式会社 電子デバイスパッケージ用テープ
JP7440633B2 (ja) 2020-06-10 2024-02-28 三井化学東セロ株式会社 電子装置の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070119584A (ko) * 2007-08-27 2007-12-20 광 석 서 반도체 웨이퍼용 대전방지 다이싱 테이프
JP7105120B2 (ja) 2017-07-04 2022-07-22 日東電工株式会社 ダイシングテープ、ダイシングダイボンドフィルム、および半導体装置製造方法
JP7292308B2 (ja) * 2018-12-05 2023-06-16 リンテック株式会社 保護膜形成用複合シート、及び半導体チップの製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160040043A1 (en) 2013-12-19 2016-02-11 Lg Chem, Ltd. Composition for forming adhesive layer of dicing film, and dicing film
JP2017098369A (ja) 2015-11-20 2017-06-01 三井・デュポンポリケミカル株式会社 ダイシングフィルム基材用樹脂組成物、ダイシングフィルム基材およびダイシングフィルム
JP2018056282A (ja) 2016-09-28 2018-04-05 リンテック株式会社 保護膜付き半導体チップの製造方法及び半導体装置の製造方法
JP2019016816A (ja) 2016-11-18 2019-01-31 古河電気工業株式会社 貼合体
WO2018123804A1 (ja) 2016-12-27 2018-07-05 三井・デュポンポリケミカル株式会社 ダイシングフィルム基材およびダイシングフィルム
JP2019009203A (ja) 2017-06-22 2019-01-17 日東電工株式会社 ダイシングダイボンドフィルム
JP2020053453A (ja) 2018-09-25 2020-04-02 古河電気工業株式会社 電子デバイスパッケージ用テープ
JP7440633B2 (ja) 2020-06-10 2024-02-28 三井化学東セロ株式会社 電子装置の製造方法

Also Published As

Publication number Publication date
TWI888683B (zh) 2025-07-01
KR20220086506A (ko) 2022-06-23
CN114634768A (zh) 2022-06-17
TW202239850A (zh) 2022-10-16
JP2022095302A (ja) 2022-06-28
KR102907712B1 (ko) 2026-01-05

Similar Documents

Publication Publication Date Title
JP7560345B2 (ja) ダイシングテープ
TWI565591B (zh) A sheet having a subsequent resin layer, and a method for manufacturing the semiconductor device
TWI503395B (zh) 晶片接合薄膜、切割‧晶片接合薄膜以及半導體裝置的製造方法
KR101183730B1 (ko) 반도체 장치용 필름 및 반도체 장치
JP2022095302A5 (https=)
KR20230174171A (ko) 다이싱 테이프 및 다이싱 테이프를 사용하는, 반도체칩 및 반도체 장치의 제조 방법
WO2013015012A1 (ja) 半導体加工シート用基材フィルム、半導体加工シート及び半導体装置の製造方法
TW201742132A (zh) 半導體基板加工用黏著膠帶
JPWO2023281996A5 (https=)
WO2023281996A1 (ja) 粘着テープ
TWI642717B (zh) 切割膜片
JP2015211080A (ja) 半導体装置の製造方法
KR102872011B1 (ko) 다이싱 테이프용의 기재 필름 및 다이싱 테이프
JP2011089073A (ja) 粘着剤、粘着シート、多層粘着シート及び電子部品の製造方法
CN112778922B (zh) 切割带和切割芯片接合薄膜
KR102858925B1 (ko) 다이싱·다이본딩 일체형 필름 및 그 제조 방법, 및 반도체 장치의 제조 방법
JP7791018B2 (ja) ダイシングテープおよびダイシングテープを使用する、半導体装置の製造方法
JP7131349B2 (ja) 基板の研削方法
JP2026031183A (ja) ダイシングダイボンドフィルム、及び、半導体装置の製造方法
JP2025133341A (ja) 粘着テープ
TW202441605A (zh) 電子元件用黏著膠帶
JP2025133342A (ja) 粘着テープ
JP2023137425A (ja) ダイシング・ダイボンディング一体型フィルム及び半導体装置の製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230227

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230926

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20240731

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20240903

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20240919

R150 Certificate of patent or registration of utility model

Ref document number: 7560345

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150