JP7553063B2 - 電子材料用硬化性樹脂組成物 - Google Patents

電子材料用硬化性樹脂組成物 Download PDF

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Publication number
JP7553063B2
JP7553063B2 JP2023556899A JP2023556899A JP7553063B2 JP 7553063 B2 JP7553063 B2 JP 7553063B2 JP 2023556899 A JP2023556899 A JP 2023556899A JP 2023556899 A JP2023556899 A JP 2023556899A JP 7553063 B2 JP7553063 B2 JP 7553063B2
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Prior art keywords
curable resin
mass
electronic materials
resin composition
phosphorus
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Japanese (ja)
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JPWO2023182347A1 (https=
JPWO2023182347A5 (https=
Inventor
拓人 池内
昌己 木下
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/32—Phosphorus-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/05—Alcohols; Metal alcoholates
    • C08K5/053—Polyhydroxylic alcohols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C08L101/10—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing hydrolysable silane groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/02—Polyalkylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2023556899A 2022-03-25 2023-03-22 電子材料用硬化性樹脂組成物 Active JP7553063B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022050930 2022-03-25
JP2022050930 2022-03-25
PCT/JP2023/011197 WO2023182347A1 (ja) 2022-03-25 2023-03-22 電子材料用硬化性樹脂組成物

Publications (3)

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JPWO2023182347A1 JPWO2023182347A1 (https=) 2023-09-28
JPWO2023182347A5 JPWO2023182347A5 (https=) 2024-03-01
JP7553063B2 true JP7553063B2 (ja) 2024-09-18

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JP2023556899A Active JP7553063B2 (ja) 2022-03-25 2023-03-22 電子材料用硬化性樹脂組成物

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JP (1) JP7553063B2 (https=)
TW (1) TW202403022A (https=)
WO (1) WO2023182347A1 (https=)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001005888A1 (en) 1999-07-16 2001-01-25 Polyplastics Co., Ltd. Polyacetal resin composition and process for the production thereof
JP2005187810A (ja) 2003-12-03 2005-07-14 Arisawa Mfg Co Ltd 難燃性樹脂組成物、並びに該組成物を用いたフレキシブルプリント配線板用金属張積層板、カバーレイ、接着シート及びフレキシブルプリント配線板
JP2010222548A (ja) 2009-02-25 2010-10-07 Ube Ind Ltd 硬化性樹脂組成物
JP2012214777A (ja) 2011-03-31 2012-11-08 Momentive Performance Materials Inc 電子部品封止用難燃性ポリオルガノシロキサン組成物
JP2016149388A (ja) 2015-02-10 2016-08-18 東洋インキＳｃホールディングス株式会社 電磁波シールドフィルム付き回路基板、およびその製造方法
JP2018162426A (ja) 2017-03-27 2018-10-18 三菱ケミカル株式会社 高難燃性・高信頼性を有する液状熱硬化性樹脂組成物およびその成形体
US20190315911A1 (en) 2018-04-12 2019-10-17 Nano And Advanced Materials Institute Limited Fire Retardant Compositions

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS606747A (ja) * 1984-05-09 1985-01-14 Kanegafuchi Chem Ind Co Ltd 室温硬化性組成物
JPH09302243A (ja) * 1996-05-10 1997-11-25 Chisso Corp 難燃性熱硬化性樹脂組成物及びその難燃性成形品
ES2205812T3 (es) * 1998-04-27 2004-05-01 Essex Specialty Products, Inc. Metodo para unir un vidrio de ventana a un sustrato utilizando una composicion adhesiva con funcionalidad silano.
JP2010126628A (ja) * 2008-11-27 2010-06-10 Nippon Zeon Co Ltd プリプレグ及び金属・樹脂積層体
CN109868017A (zh) * 2019-02-22 2019-06-11 常熟理工学院 一种膨胀性改性醋酸乙烯树脂基水性阻燃涂料

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001005888A1 (en) 1999-07-16 2001-01-25 Polyplastics Co., Ltd. Polyacetal resin composition and process for the production thereof
JP2005187810A (ja) 2003-12-03 2005-07-14 Arisawa Mfg Co Ltd 難燃性樹脂組成物、並びに該組成物を用いたフレキシブルプリント配線板用金属張積層板、カバーレイ、接着シート及びフレキシブルプリント配線板
JP2010222548A (ja) 2009-02-25 2010-10-07 Ube Ind Ltd 硬化性樹脂組成物
JP2012214777A (ja) 2011-03-31 2012-11-08 Momentive Performance Materials Inc 電子部品封止用難燃性ポリオルガノシロキサン組成物
JP2016149388A (ja) 2015-02-10 2016-08-18 東洋インキＳｃホールディングス株式会社 電磁波シールドフィルム付き回路基板、およびその製造方法
JP2018162426A (ja) 2017-03-27 2018-10-18 三菱ケミカル株式会社 高難燃性・高信頼性を有する液状熱硬化性樹脂組成物およびその成形体
US20190315911A1 (en) 2018-04-12 2019-10-17 Nano And Advanced Materials Institute Limited Fire Retardant Compositions

Also Published As

Publication number Publication date
TW202403022A (zh) 2024-01-16
JPWO2023182347A1 (https=) 2023-09-28
WO2023182347A1 (ja) 2023-09-28

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