JP7550869B2 - 複合体及びその製造方法、並びに、積層体及びその製造方法 - Google Patents

複合体及びその製造方法、並びに、積層体及びその製造方法 Download PDF

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Publication number
JP7550869B2
JP7550869B2 JP2022550831A JP2022550831A JP7550869B2 JP 7550869 B2 JP7550869 B2 JP 7550869B2 JP 2022550831 A JP2022550831 A JP 2022550831A JP 2022550831 A JP2022550831 A JP 2022550831A JP 7550869 B2 JP7550869 B2 JP 7550869B2
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JP
Japan
Prior art keywords
resin
composite
nitride sintered
sintered body
filler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
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JP2022550831A
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English (en)
Japanese (ja)
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JPWO2022209971A1 (https=
JPWO2022209971A5 (https=
Inventor
仁孝 南方
政秀 金子
亮 吉松
真也 坂口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denka Co Ltd
Denki Kagaku Kogyo KK
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Publication of JPWO2022209971A1 publication Critical patent/JPWO2022209971A1/ja
Publication of JPWO2022209971A5 publication Critical patent/JPWO2022209971A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/82—Coating or impregnation with organic materials
    • C04B41/83—Macromolecular compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Porous Artificial Stone Or Porous Ceramic Products (AREA)
JP2022550831A 2021-03-31 2022-03-17 複合体及びその製造方法、並びに、積層体及びその製造方法 Active JP7550869B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021059225 2021-03-31
JP2021059225 2021-03-31
PCT/JP2022/012366 WO2022209971A1 (ja) 2021-03-31 2022-03-17 複合体及びその製造方法、並びに、積層体及びその製造方法

Publications (3)

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JPWO2022209971A1 JPWO2022209971A1 (https=) 2022-10-06
JPWO2022209971A5 JPWO2022209971A5 (https=) 2023-03-01
JP7550869B2 true JP7550869B2 (ja) 2024-09-13

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Country Link
JP (1) JP7550869B2 (https=)
WO (1) WO2022209971A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7374391B1 (ja) * 2022-02-28 2023-11-06 デンカ株式会社 複合シート、及び積層体
WO2024204446A1 (ja) * 2023-03-29 2024-10-03 デンカ株式会社 複合体及びその製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015022956A1 (ja) 2013-08-14 2015-02-19 電気化学工業株式会社 窒化ホウ素－樹脂複合体回路基板、窒化ホウ素－樹脂複合体放熱板一体型回路基板

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0634435B2 (ja) * 1985-11-27 1994-05-02 イビデン株式会社 電子回路用多層基板
JP7395163B2 (ja) * 2020-06-10 2023-12-11 東亞合成株式会社 セラミックス／樹脂複合材料、その製造方法及びその利用

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015022956A1 (ja) 2013-08-14 2015-02-19 電気化学工業株式会社 窒化ホウ素－樹脂複合体回路基板、窒化ホウ素－樹脂複合体放熱板一体型回路基板

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JPWO2022209971A1 (https=) 2022-10-06
WO2022209971A1 (ja) 2022-10-06

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