JPWO2022209971A5 - - Google Patents
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- Publication number
- JPWO2022209971A5 JPWO2022209971A5 JP2022550831A JP2022550831A JPWO2022209971A5 JP WO2022209971 A5 JPWO2022209971 A5 JP WO2022209971A5 JP 2022550831 A JP2022550831 A JP 2022550831A JP 2022550831 A JP2022550831 A JP 2022550831A JP WO2022209971 A5 JPWO2022209971 A5 JP WO2022209971A5
- Authority
- JP
- Japan
- Prior art keywords
- resin
- filled
- composite
- nitride sintered
- producing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims 35
- 229920005989 resin Polymers 0.000 claims 35
- 239000002131 composite material Substances 0.000 claims 16
- 239000011342 resin composition Substances 0.000 claims 8
- 238000004519 manufacturing process Methods 0.000 claims 7
- 150000004767 nitrides Chemical class 0.000 claims 7
- 239000011248 coating agent Substances 0.000 claims 6
- 238000000576 coating method Methods 0.000 claims 6
- 239000011148 porous material Substances 0.000 claims 4
- 238000010438 heat treatment Methods 0.000 claims 3
- 238000005470 impregnation Methods 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 238000010030 laminating Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021059225 | 2021-03-31 | ||
| JP2021059225 | 2021-03-31 | ||
| PCT/JP2022/012366 WO2022209971A1 (ja) | 2021-03-31 | 2022-03-17 | 複合体及びその製造方法、並びに、積層体及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022209971A1 JPWO2022209971A1 (https=) | 2022-10-06 |
| JPWO2022209971A5 true JPWO2022209971A5 (https=) | 2023-03-01 |
| JP7550869B2 JP7550869B2 (ja) | 2024-09-13 |
Family
ID=83459117
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022550831A Active JP7550869B2 (ja) | 2021-03-31 | 2022-03-17 | 複合体及びその製造方法、並びに、積層体及びその製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7550869B2 (https=) |
| WO (1) | WO2022209971A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7374391B1 (ja) * | 2022-02-28 | 2023-11-06 | デンカ株式会社 | 複合シート、及び積層体 |
| WO2024204446A1 (ja) * | 2023-03-29 | 2024-10-03 | デンカ株式会社 | 複合体及びその製造方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0634435B2 (ja) * | 1985-11-27 | 1994-05-02 | イビデン株式会社 | 電子回路用多層基板 |
| EP3035778B1 (en) * | 2013-08-14 | 2018-10-03 | Denka Company Limited | Boron nitride/resin composite circuit board, and circuit board including boron nitride/resin composite integrated with heat radiation plate |
| JP7395163B2 (ja) * | 2020-06-10 | 2023-12-11 | 東亞合成株式会社 | セラミックス／樹脂複合材料、その製造方法及びその利用 |
-
2022
- 2022-03-17 WO PCT/JP2022/012366 patent/WO2022209971A1/ja not_active Ceased
- 2022-03-17 JP JP2022550831A patent/JP7550869B2/ja active Active
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