JP7541570B2 - 携帯端末 - Google Patents

携帯端末 Download PDF

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Publication number
JP7541570B2
JP7541570B2 JP2022507973A JP2022507973A JP7541570B2 JP 7541570 B2 JP7541570 B2 JP 7541570B2 JP 2022507973 A JP2022507973 A JP 2022507973A JP 2022507973 A JP2022507973 A JP 2022507973A JP 7541570 B2 JP7541570 B2 JP 7541570B2
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JP
Japan
Prior art keywords
heat
main body
metal structure
vapor chamber
thermally conductive
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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JP2022507973A
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English (en)
Japanese (ja)
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JPWO2021186686A5 (https=
JPWO2021186686A1 (https=
Inventor
祐哉 橋
智則 櫻井
泰亮 渡邉
峻一 ▲高▼岡
Original Assignee
Fcnt合同会社
Ｆｃｎｔ合同会社
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Publication of JPWO2021186686A1 publication Critical patent/JPWO2021186686A1/ja
Publication of JPWO2021186686A5 publication Critical patent/JPWO2021186686A5/ja
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Telephone Set Structure (AREA)
JP2022507973A 2020-03-19 2020-03-19 携帯端末 Active JP7541570B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/012372 WO2021186686A1 (ja) 2020-03-19 2020-03-19 携帯端末

Publications (3)

Publication Number Publication Date
JPWO2021186686A1 JPWO2021186686A1 (https=) 2021-09-23
JPWO2021186686A5 JPWO2021186686A5 (https=) 2022-12-02
JP7541570B2 true JP7541570B2 (ja) 2024-08-28

Family

ID=77771998

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022507973A Active JP7541570B2 (ja) 2020-03-19 2020-03-19 携帯端末

Country Status (2)

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JP (1) JP7541570B2 (https=)
WO (1) WO2021186686A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113873858B (zh) * 2021-11-30 2022-04-22 荣耀终端有限公司 壳体和电子设备
CN114501202A (zh) * 2022-02-16 2022-05-13 展讯通信（上海）有限公司 一种扬声器模组及智能终端设备

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013174376A (ja) 2012-02-24 2013-09-05 Furukawa Electric Co Ltd:The シート状ヒートパイプ、及びシート状ヒートパイプを備えた電子機器
US20150083371A1 (en) 2013-09-24 2015-03-26 Asia Vital Components Co., Ltd. Heat dissipation structure for hand-held mobile device
JP2015095629A (ja) 2013-11-14 2015-05-18 株式会社フジクラ 携帯型電子機器の冷却構造
JP2017041530A (ja) 2015-08-19 2017-02-23 株式会社フジクラ 携帯型電子機器用熱拡散板
WO2019026786A1 (ja) 2017-08-04 2019-02-07 株式会社村田製作所 ベーパーチャンバー

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11237193A (ja) * 1998-02-19 1999-08-31 Furukawa Electric Co Ltd:The 板型ヒートパイプとそれを用いた実装構造

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013174376A (ja) 2012-02-24 2013-09-05 Furukawa Electric Co Ltd:The シート状ヒートパイプ、及びシート状ヒートパイプを備えた電子機器
US20150083371A1 (en) 2013-09-24 2015-03-26 Asia Vital Components Co., Ltd. Heat dissipation structure for hand-held mobile device
JP2015095629A (ja) 2013-11-14 2015-05-18 株式会社フジクラ 携帯型電子機器の冷却構造
JP2017041530A (ja) 2015-08-19 2017-02-23 株式会社フジクラ 携帯型電子機器用熱拡散板
WO2019026786A1 (ja) 2017-08-04 2019-02-07 株式会社村田製作所 ベーパーチャンバー

Also Published As

Publication number Publication date
WO2021186686A1 (ja) 2021-09-23
JPWO2021186686A1 (https=) 2021-09-23

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