JP7520569B2 - 情報処理装置、及び情報処理方法 - Google Patents

情報処理装置、及び情報処理方法 Download PDF

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Publication number
JP7520569B2
JP7520569B2 JP2020079056A JP2020079056A JP7520569B2 JP 7520569 B2 JP7520569 B2 JP 7520569B2 JP 2020079056 A JP2020079056 A JP 2020079056A JP 2020079056 A JP2020079056 A JP 2020079056A JP 7520569 B2 JP7520569 B2 JP 7520569B2
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Japan
Prior art keywords
processing
lot
substrate
data
displays
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English (en)
Japanese (ja)
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JP2021173915A (ja
JP2021173915A5 (https=
Inventor
貴裕 滝口
健太 北
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Canon Inc
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Canon Inc
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Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2020079056A priority Critical patent/JP7520569B2/ja
Priority to SG10202103768YA priority patent/SG10202103768YA/en
Priority to KR1020210048920A priority patent/KR102835870B1/ko
Priority to TW110113561A priority patent/TWI815106B/zh
Priority to US17/239,280 priority patent/US11579536B2/en
Priority to EP21170547.0A priority patent/EP3904979A3/en
Priority to CN202410533138.1A priority patent/CN118348747A/zh
Priority to CN202110465883.3A priority patent/CN113568276B/zh
Publication of JP2021173915A publication Critical patent/JP2021173915A/ja
Priority to US18/153,242 priority patent/US12007698B2/en
Publication of JP2021173915A5 publication Critical patent/JP2021173915A5/ja
Priority to US18/656,365 priority patent/US12353140B2/en
Priority to JP2024107305A priority patent/JP7732048B2/ja
Application granted granted Critical
Publication of JP7520569B2 publication Critical patent/JP7520569B2/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/14—Digital output to display device ; Cooperation and interconnection of the display device with other functional units
    • G06F3/1423—Digital output to display device ; Cooperation and interconnection of the display device with other functional units controlling a plurality of local displays, e.g. CRT and flat panel display
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70508—Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70525—Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70533—Controlling abnormal operating mode, e.g. taking account of waiting time, decision to rework or rework flow
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70681—Metrology strategies
    • G03F7/706831—Recipe selection or optimisation, e.g. select or optimise recipe parameters such as wavelength, polarisation or illumination modes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/706835—Metrology information management or control
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7046—Strategy, e.g. mark, sensor or wavelength selection
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/04—Program control other than numerical control, i.e. in sequence controllers or logic controllers
    • G05B19/042—Program control other than numerical control, i.e. in sequence controllers or logic controllers using digital processors
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F16/00—Information retrieval; Database structures therefor; File system structures therefor
    • G06F16/90—Details of database functions independent of the retrieved data types
    • G06F16/901—Indexing; Data structures therefor; Storage structures
    • G06F16/9024—Graphs; Linked lists
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/10—Complex mathematical operations
    • G06F17/18—Complex mathematical operations for evaluating statistical data, e.g. average values, frequency distributions, probability functions, regression analysis
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T11/00—Two-dimensional [2D] image generation
    • G06T11/20—Drawing from basic elements
    • G06T11/26—Drawing of charts or graphs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/20—Pc systems
    • G05B2219/26—Pc applications
    • G05B2219/2602—Wafer processing
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37224—Inspect wafer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Databases & Information Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Data Mining & Analysis (AREA)
  • Software Systems (AREA)
  • Automation & Control Theory (AREA)
  • Mathematical Analysis (AREA)
  • Mathematical Optimization (AREA)
  • Computational Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Pure & Applied Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Probability & Statistics with Applications (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • Algebra (AREA)
  • Evolutionary Biology (AREA)
  • Bioinformatics & Computational Biology (AREA)
  • Operations Research (AREA)
  • Quality & Reliability (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • User Interface Of Digital Computer (AREA)
  • Hardware Redundancy (AREA)
  • General Factory Administration (AREA)
JP2020079056A 2020-04-28 2020-04-28 情報処理装置、及び情報処理方法 Active JP7520569B2 (ja)

Priority Applications (11)

Application Number Priority Date Filing Date Title
JP2020079056A JP7520569B2 (ja) 2020-04-28 2020-04-28 情報処理装置、及び情報処理方法
SG10202103768YA SG10202103768YA (en) 2020-04-28 2021-04-13 Information processing apparatus and information processing method
KR1020210048920A KR102835870B1 (ko) 2020-04-28 2021-04-15 정보 처리장치 및 정보 처리방법
TW110113561A TWI815106B (zh) 2020-04-28 2021-04-15 資訊處理設備及資訊處理方法
US17/239,280 US11579536B2 (en) 2020-04-28 2021-04-23 Information processing apparatus and information processing method
EP21170547.0A EP3904979A3 (en) 2020-04-28 2021-04-26 Information processing apparatus and information processing method
CN202410533138.1A CN118348747A (zh) 2020-04-28 2021-04-28 信息处理装置和信息处理方法
CN202110465883.3A CN113568276B (zh) 2020-04-28 2021-04-28 信息处理装置和信息处理方法
US18/153,242 US12007698B2 (en) 2020-04-28 2023-01-11 Information processing apparatus and information processing method
US18/656,365 US12353140B2 (en) 2020-04-28 2024-05-06 Information processing apparatus and information processing method
JP2024107305A JP7732048B2 (ja) 2020-04-28 2024-07-03 情報処理装置、及び情報処理方法

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JP2020079056A JP7520569B2 (ja) 2020-04-28 2020-04-28 情報処理装置、及び情報処理方法

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JP2024107305A Division JP7732048B2 (ja) 2020-04-28 2024-07-03 情報処理装置、及び情報処理方法

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JP2021173915A JP2021173915A (ja) 2021-11-01
JP2021173915A5 JP2021173915A5 (https=) 2023-05-02
JP7520569B2 true JP7520569B2 (ja) 2024-07-23

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JP2024107305A Active JP7732048B2 (ja) 2020-04-28 2024-07-03 情報処理装置、及び情報処理方法

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US (3) US11579536B2 (https=)
EP (1) EP3904979A3 (https=)
JP (2) JP7520569B2 (https=)
KR (1) KR102835870B1 (https=)
CN (2) CN118348747A (https=)
SG (1) SG10202103768YA (https=)
TW (1) TWI815106B (https=)

Families Citing this family (1)

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JP7520569B2 (ja) * 2020-04-28 2024-07-23 キヤノン株式会社 情報処理装置、及び情報処理方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002260978A (ja) 2001-03-05 2002-09-13 Hitachi Ltd 試料処理装置用プロセスモニタ及び試料処理装置の制御方法
WO2005045907A1 (ja) 2003-11-10 2005-05-19 Renesas Technology Corp. 半導体集積回路装置の製造方法
WO2006019166A1 (ja) 2004-08-19 2006-02-23 Nikon Corporation アライメント情報表示方法とそのプログラム、アライメント方法、露光方法、デバイス製造方法、表示システム、表示装置、プログラム及び測定／検査装置
JP2006237052A (ja) 2005-02-22 2006-09-07 Nikon System:Kk 情報表示方法、情報表示プログラム、情報表示装置及びデバイス製造システム、並びに基板処理装置
JP2007042701A (ja) 2005-08-01 2007-02-15 Nikon Corp 情報表示システム
US20130253866A1 (en) 2010-11-13 2013-09-26 Abb Technology Ag Intelligent visualisation in the monitoring of process and/or system variables
WO2014006807A1 (ja) 2012-07-03 2014-01-09 シャープ株式会社 グラフ描画装置、グラフ描画方法、工程管理システム、工程管理方法および可読記憶媒体
JP2014529909A (ja) 2011-09-01 2014-11-13 ケーエルエー−テンカー コーポレイション 問題のある高度プロセス制御パラメータの検出及び訂正のための方法及びシステム

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5859964A (en) * 1996-10-25 1999-01-12 Advanced Micro Devices, Inc. System and method for performing real time data acquisition, process modeling and fault detection of wafer fabrication processes
US6477685B1 (en) 1999-09-22 2002-11-05 Texas Instruments Incorporated Method and apparatus for yield and failure analysis in the manufacturing of semiconductors
JP2002149222A (ja) 2000-11-08 2002-05-24 Mitsubishi Electric Corp 製品の生産ラインにおける品質管理方法および品質管理システム
JP2005294754A (ja) * 2004-04-05 2005-10-20 Toshiba Corp 電子ビーム描画装置、電子ビーム描画方法、電子ビーム描画プログラム及び直接描画方式を用いた半導体装置の製造方法
US7343583B2 (en) 2004-07-09 2008-03-11 Kla-Tencor Technologies Corporation System and method for searching for patterns of semiconductor wafer features in semiconductor wafer data
JP2009170612A (ja) 2008-01-15 2009-07-30 Canon Inc 情報処理装置、情報処理方法、処理システムおよびコンピュータプログラム
JP5673577B2 (ja) * 2012-02-07 2015-02-18 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
CN103293878B (zh) 2013-05-31 2015-07-15 上海华力微电子有限公司 光刻机产能监测系统
JP7052280B2 (ja) * 2016-11-29 2022-04-12 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP6808684B2 (ja) 2018-06-14 2021-01-06 キヤノン株式会社 情報処理装置、判定方法、プログラム、リソグラフィシステム、および物品の製造方法
JP7520569B2 (ja) * 2020-04-28 2024-07-23 キヤノン株式会社 情報処理装置、及び情報処理方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002260978A (ja) 2001-03-05 2002-09-13 Hitachi Ltd 試料処理装置用プロセスモニタ及び試料処理装置の制御方法
WO2005045907A1 (ja) 2003-11-10 2005-05-19 Renesas Technology Corp. 半導体集積回路装置の製造方法
WO2006019166A1 (ja) 2004-08-19 2006-02-23 Nikon Corporation アライメント情報表示方法とそのプログラム、アライメント方法、露光方法、デバイス製造方法、表示システム、表示装置、プログラム及び測定／検査装置
JP2006237052A (ja) 2005-02-22 2006-09-07 Nikon System:Kk 情報表示方法、情報表示プログラム、情報表示装置及びデバイス製造システム、並びに基板処理装置
JP2007042701A (ja) 2005-08-01 2007-02-15 Nikon Corp 情報表示システム
US20130253866A1 (en) 2010-11-13 2013-09-26 Abb Technology Ag Intelligent visualisation in the monitoring of process and/or system variables
JP2014529909A (ja) 2011-09-01 2014-11-13 ケーエルエー−テンカー コーポレイション 問題のある高度プロセス制御パラメータの検出及び訂正のための方法及びシステム
WO2014006807A1 (ja) 2012-07-03 2014-01-09 シャープ株式会社 グラフ描画装置、グラフ描画方法、工程管理システム、工程管理方法および可読記憶媒体

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