KR102835870B1 - 정보 처리장치 및 정보 처리방법 - Google Patents
정보 처리장치 및 정보 처리방법Info
- Publication number
- KR102835870B1 KR102835870B1 KR1020210048920A KR20210048920A KR102835870B1 KR 102835870 B1 KR102835870 B1 KR 102835870B1 KR 1020210048920 A KR1020210048920 A KR 1020210048920A KR 20210048920 A KR20210048920 A KR 20210048920A KR 102835870 B1 KR102835870 B1 KR 102835870B1
- Authority
- KR
- South Korea
- Prior art keywords
- processing
- lot
- image
- display
- processing data
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/14—Digital output to display device ; Cooperation and interconnection of the display device with other functional units
- G06F3/1423—Digital output to display device ; Cooperation and interconnection of the display device with other functional units controlling a plurality of local displays, e.g. CRT and flat panel display
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70508—Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70525—Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70533—Controlling abnormal operating mode, e.g. taking account of waiting time, decision to rework or rework flow
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70681—Metrology strategies
- G03F7/706831—Recipe selection or optimisation, e.g. select or optimise recipe parameters such as wavelength, polarisation or illumination modes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/706835—Metrology information management or control
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7046—Strategy, e.g. mark, sensor or wavelength selection
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Program-control systems
- G05B19/02—Program-control systems electric
- G05B19/04—Program control other than numerical control, i.e. in sequence controllers or logic controllers
- G05B19/042—Program control other than numerical control, i.e. in sequence controllers or logic controllers using digital processors
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Program-control systems
- G05B19/02—Program-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F16/00—Information retrieval; Database structures therefor; File system structures therefor
- G06F16/90—Details of database functions independent of the retrieved data types
- G06F16/901—Indexing; Data structures therefor; Storage structures
- G06F16/9024—Graphs; Linked lists
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
- G06F17/10—Complex mathematical operations
- G06F17/18—Complex mathematical operations for evaluating statistical data, e.g. average values, frequency distributions, probability functions, regression analysis
-
- G06T11/206—
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T11/00—Two-dimensional [2D] image generation
- G06T11/20—Drawing from basic elements
- G06T11/26—Drawing of charts or graphs
-
- H01L21/67276—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
- H10P72/0612—Production flow monitoring, e.g. for increasing throughput
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/20—Pc systems
- G05B2219/26—Pc applications
- G05B2219/2602—Wafer processing
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/37—Measurements
- G05B2219/37224—Inspect wafer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Databases & Information Systems (AREA)
- General Engineering & Computer Science (AREA)
- Data Mining & Analysis (AREA)
- Software Systems (AREA)
- Automation & Control Theory (AREA)
- Mathematical Analysis (AREA)
- Mathematical Optimization (AREA)
- Computational Mathematics (AREA)
- Mathematical Physics (AREA)
- Pure & Applied Mathematics (AREA)
- Human Computer Interaction (AREA)
- Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Probability & Statistics with Applications (AREA)
- Bioinformatics & Cheminformatics (AREA)
- Algebra (AREA)
- Evolutionary Biology (AREA)
- Bioinformatics & Computational Biology (AREA)
- Operations Research (AREA)
- Quality & Reliability (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- User Interface Of Digital Computer (AREA)
- Hardware Redundancy (AREA)
- General Factory Administration (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2020-079056 | 2020-04-28 | ||
| JP2020079056A JP7520569B2 (ja) | 2020-04-28 | 2020-04-28 | 情報処理装置、及び情報処理方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20210133142A KR20210133142A (ko) | 2021-11-05 |
| KR102835870B1 true KR102835870B1 (ko) | 2025-07-21 |
Family
ID=75690136
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020210048920A Active KR102835870B1 (ko) | 2020-04-28 | 2021-04-15 | 정보 처리장치 및 정보 처리방법 |
Country Status (7)
| Country | Link |
|---|---|
| US (3) | US11579536B2 (https=) |
| EP (1) | EP3904979A3 (https=) |
| JP (2) | JP7520569B2 (https=) |
| KR (1) | KR102835870B1 (https=) |
| CN (2) | CN118348747A (https=) |
| SG (1) | SG10202103768YA (https=) |
| TW (1) | TWI815106B (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7520569B2 (ja) * | 2020-04-28 | 2024-07-23 | キヤノン株式会社 | 情報処理装置、及び情報処理方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100446925B1 (ko) * | 2001-03-05 | 2004-09-08 | 가부시끼가이샤 히다치 세이사꾸쇼 | 시료처리장치용 공정모니터장치 및 시료처리장치의 제어방법 |
| KR102055956B1 (ko) | 2011-09-01 | 2019-12-13 | 케이엘에이 코포레이션 | 문제가 있는 어드밴스드 프로세스 제어 파라미터들을 검출하고 보정하기 위한 방법 및 시스템 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5859964A (en) * | 1996-10-25 | 1999-01-12 | Advanced Micro Devices, Inc. | System and method for performing real time data acquisition, process modeling and fault detection of wafer fabrication processes |
| US6477685B1 (en) | 1999-09-22 | 2002-11-05 | Texas Instruments Incorporated | Method and apparatus for yield and failure analysis in the manufacturing of semiconductors |
| JP2002149222A (ja) | 2000-11-08 | 2002-05-24 | Mitsubishi Electric Corp | 製品の生産ラインにおける品質管理方法および品質管理システム |
| TW200516686A (en) * | 2003-11-10 | 2005-05-16 | Renesas Tech Corp | Manufacturing method for semiconductor integrated circuit device |
| JP2005294754A (ja) * | 2004-04-05 | 2005-10-20 | Toshiba Corp | 電子ビーム描画装置、電子ビーム描画方法、電子ビーム描画プログラム及び直接描画方式を用いた半導体装置の製造方法 |
| US7343583B2 (en) | 2004-07-09 | 2008-03-11 | Kla-Tencor Technologies Corporation | System and method for searching for patterns of semiconductor wafer features in semiconductor wafer data |
| JP4715749B2 (ja) * | 2004-08-19 | 2011-07-06 | 株式会社ニコン | アライメント情報表示方法とそのプログラム、アライメント方法、露光方法、デバイス製造方法、表示システム、表示装置 |
| JP2006237052A (ja) * | 2005-02-22 | 2006-09-07 | Nikon System:Kk | 情報表示方法、情報表示プログラム、情報表示装置及びデバイス製造システム、並びに基板処理装置 |
| JP4720991B2 (ja) * | 2005-08-01 | 2011-07-13 | 株式会社ニコン | 情報表示システム |
| JP2009170612A (ja) | 2008-01-15 | 2009-07-30 | Canon Inc | 情報処理装置、情報処理方法、処理システムおよびコンピュータプログラム |
| EP2453330A1 (de) * | 2010-11-13 | 2012-05-16 | ABB Technology AG | Intelligente Visualisierung der Überwachung von Prozess- und/oder Anlagegrössen |
| JP5673577B2 (ja) * | 2012-02-07 | 2015-02-18 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及び記憶媒体 |
| JP5866446B2 (ja) * | 2012-07-03 | 2016-02-17 | シャープ株式会社 | グラフ描画装置、グラフ描画方法、工程管理システム、工程管理方法、制御プログラムおよび可読記憶媒体 |
| CN103293878B (zh) | 2013-05-31 | 2015-07-15 | 上海华力微电子有限公司 | 光刻机产能监测系统 |
| JP7052280B2 (ja) * | 2016-11-29 | 2022-04-12 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及び記憶媒体 |
| JP6808684B2 (ja) | 2018-06-14 | 2021-01-06 | キヤノン株式会社 | 情報処理装置、判定方法、プログラム、リソグラフィシステム、および物品の製造方法 |
| JP7520569B2 (ja) * | 2020-04-28 | 2024-07-23 | キヤノン株式会社 | 情報処理装置、及び情報処理方法 |
-
2020
- 2020-04-28 JP JP2020079056A patent/JP7520569B2/ja active Active
-
2021
- 2021-04-13 SG SG10202103768YA patent/SG10202103768YA/en unknown
- 2021-04-15 TW TW110113561A patent/TWI815106B/zh active
- 2021-04-15 KR KR1020210048920A patent/KR102835870B1/ko active Active
- 2021-04-23 US US17/239,280 patent/US11579536B2/en active Active
- 2021-04-26 EP EP21170547.0A patent/EP3904979A3/en active Pending
- 2021-04-28 CN CN202410533138.1A patent/CN118348747A/zh active Pending
- 2021-04-28 CN CN202110465883.3A patent/CN113568276B/zh active Active
-
2023
- 2023-01-11 US US18/153,242 patent/US12007698B2/en active Active
-
2024
- 2024-05-06 US US18/656,365 patent/US12353140B2/en active Active
- 2024-07-03 JP JP2024107305A patent/JP7732048B2/ja active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100446925B1 (ko) * | 2001-03-05 | 2004-09-08 | 가부시끼가이샤 히다치 세이사꾸쇼 | 시료처리장치용 공정모니터장치 및 시료처리장치의 제어방법 |
| KR102055956B1 (ko) | 2011-09-01 | 2019-12-13 | 케이엘에이 코포레이션 | 문제가 있는 어드밴스드 프로세스 제어 파라미터들을 검출하고 보정하기 위한 방법 및 시스템 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2021173915A (ja) | 2021-11-01 |
| US20240288780A1 (en) | 2024-08-29 |
| JP7520569B2 (ja) | 2024-07-23 |
| EP3904979A2 (en) | 2021-11-03 |
| EP3904979A3 (en) | 2022-01-12 |
| US11579536B2 (en) | 2023-02-14 |
| KR20210133142A (ko) | 2021-11-05 |
| US12353140B2 (en) | 2025-07-08 |
| CN118348747A (zh) | 2024-07-16 |
| US20230161270A1 (en) | 2023-05-25 |
| CN113568276A (zh) | 2021-10-29 |
| TWI815106B (zh) | 2023-09-11 |
| JP2024125416A (ja) | 2024-09-18 |
| CN113568276B (zh) | 2024-05-07 |
| US20210333722A1 (en) | 2021-10-28 |
| TW202209001A (zh) | 2022-03-01 |
| JP7732048B2 (ja) | 2025-09-01 |
| SG10202103768YA (en) | 2021-11-29 |
| US12007698B2 (en) | 2024-06-11 |
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