JP7513985B2 - 研磨材組成物 - Google Patents
研磨材組成物 Download PDFInfo
- Publication number
- JP7513985B2 JP7513985B2 JP2020175240A JP2020175240A JP7513985B2 JP 7513985 B2 JP7513985 B2 JP 7513985B2 JP 2020175240 A JP2020175240 A JP 2020175240A JP 2020175240 A JP2020175240 A JP 2020175240A JP 7513985 B2 JP7513985 B2 JP 7513985B2
- Authority
- JP
- Japan
- Prior art keywords
- abrasive
- hardness
- abrasive grains
- grains
- particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000203 mixture Substances 0.000 title claims description 117
- 239000006061 abrasive grain Substances 0.000 claims description 144
- 239000002245 particle Substances 0.000 claims description 121
- 238000005498 polishing Methods 0.000 claims description 66
- 239000010432 diamond Substances 0.000 claims description 42
- 229910003460 diamond Inorganic materials 0.000 claims description 42
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 36
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 19
- 239000000377 silicon dioxide Substances 0.000 claims description 16
- 235000012239 silicon dioxide Nutrition 0.000 claims description 12
- 229910052580 B4C Inorganic materials 0.000 claims description 11
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 11
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 claims description 10
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 10
- 239000002002 slurry Substances 0.000 claims description 7
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 5
- 239000007787 solid Substances 0.000 claims description 5
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 5
- 239000000839 emulsion Substances 0.000 claims description 4
- 239000003921 oil Substances 0.000 claims description 4
- 239000003082 abrasive agent Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 9
- 239000002609 medium Substances 0.000 description 9
- 239000000843 powder Substances 0.000 description 8
- 230000003746 surface roughness Effects 0.000 description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 239000013078 crystal Substances 0.000 description 6
- 239000003960 organic solvent Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 239000004215 Carbon black (E152) Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 238000001354 calcination Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 229930195733 hydrocarbon Natural products 0.000 description 3
- 150000002430 hydrocarbons Chemical class 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 3
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 2
- 235000017491 Bambusa tulda Nutrition 0.000 description 2
- 241001330002 Bambuseae Species 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 239000011425 bamboo Substances 0.000 description 2
- 229910000420 cerium oxide Inorganic materials 0.000 description 2
- 239000008119 colloidal silica Substances 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 230000010534 mechanism of action Effects 0.000 description 2
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229910000601 superalloy Inorganic materials 0.000 description 2
- 239000001993 wax Substances 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000012736 aqueous medium Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910021418 black silicon Inorganic materials 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000007580 dry-mixing Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- 239000003021 water soluble solvent Substances 0.000 description 1
- 229920003169 water-soluble polymer Polymers 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Images
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
高硬度砥粒の含有量 要する研磨時間 平滑性
(1) 二酸化ケイ素粒子なし(比較例) 26~34分
(2) 5 重量% (比較例) 22~33分
(3) 10 重量% 16~21分 〇
(4) 15 重量% 15~20分 〇
(5) 20 重量% 14~19分 ◎
(6) 25 重量% 14~18分 ◎
(7) 30 重量% 13~17分 ◎
(8) 35 重量% 13~20分 〇
(9) 40 重量% 15~19分 〇
(10) 45 重量% (比較例) 17~22分
(11) 50 重量% (比較例) 17~25分
このように、ダイヤモンド粒子を10重量%以上含有させることで、研磨力は大きく向上するが、40重量%を超えると研磨力はむしろ低下する傾向にあることが分かった。
Claims (2)
- 平均粒径が0.3~10μmであるダイヤモンド粒子、炭化ホウ素粒子又は炭化ケイ素粒子の1種又は2種以上からなる高硬度砥粒と、該高硬度砥粒より硬度が低く、平均粒径が3~40μmである酸化アルミニウム粒子、二酸化ケイ素粒子又は酸化チタン粒子の1種又は2種以上からなる低硬度砥粒とを含有し、前記高硬度砥粒の平均粒径は、前記低硬度砥粒の平均粒径より小さく、前記高硬度砥粒の含有量は10~40重量%である砥粒混合物が水性又は油性媒体に分散され、前記高硬度砥粒及び前記低硬度砥粒の各粒子がそれぞれ分散しているスラリー、乳液又は半固体状のペーストである研磨材組成物。
- 請求項1に記載の研磨材組成物からなるバフ研磨用研磨材組成物。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020175240A JP7513985B2 (ja) | 2020-10-19 | 2020-10-19 | 研磨材組成物 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020175240A JP7513985B2 (ja) | 2020-10-19 | 2020-10-19 | 研磨材組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2022066727A JP2022066727A (ja) | 2022-05-02 |
JP7513985B2 true JP7513985B2 (ja) | 2024-07-10 |
Family
ID=81389652
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020175240A Active JP7513985B2 (ja) | 2020-10-19 | 2020-10-19 | 研磨材組成物 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP7513985B2 (ja) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015183052A (ja) | 2014-03-24 | 2015-10-22 | ケヰテック株式会社 | 研磨剤組成物 |
JP2017171840A (ja) | 2016-03-25 | 2017-09-28 | 株式会社フジミインコーポレーテッド | ブラスト研磨用スラリ |
JP2017179220A (ja) | 2016-03-31 | 2017-10-05 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
JP2017532774A (ja) | 2014-08-28 | 2017-11-02 | シンマット, インコーポレーテッドSinmat, Inc. | 軟質コア複合粒子による硬質基板の研磨 |
JP2018092697A (ja) | 2013-09-28 | 2018-06-14 | Hoya株式会社 | 研削工具、ガラス基板の製造方法、磁気ディスク用ガラス基板の製造方法及び磁気ディスクの製造方法 |
JP2019141974A (ja) | 2018-02-22 | 2019-08-29 | 株式会社ミズホ | 両面ラップ盤とそれを用いた薄肉ファインセラミックスの研削方法 |
-
2020
- 2020-10-19 JP JP2020175240A patent/JP7513985B2/ja active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018092697A (ja) | 2013-09-28 | 2018-06-14 | Hoya株式会社 | 研削工具、ガラス基板の製造方法、磁気ディスク用ガラス基板の製造方法及び磁気ディスクの製造方法 |
JP2015183052A (ja) | 2014-03-24 | 2015-10-22 | ケヰテック株式会社 | 研磨剤組成物 |
JP2017532774A (ja) | 2014-08-28 | 2017-11-02 | シンマット, インコーポレーテッドSinmat, Inc. | 軟質コア複合粒子による硬質基板の研磨 |
JP2017171840A (ja) | 2016-03-25 | 2017-09-28 | 株式会社フジミインコーポレーテッド | ブラスト研磨用スラリ |
JP2017179220A (ja) | 2016-03-31 | 2017-10-05 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
JP2019141974A (ja) | 2018-02-22 | 2019-08-29 | 株式会社ミズホ | 両面ラップ盤とそれを用いた薄肉ファインセラミックスの研削方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2022066727A (ja) | 2022-05-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP3605036B2 (ja) | 光学研摩配合物 | |
EP3800229B1 (en) | Polishing composition | |
KR100429940B1 (ko) | 개선된 세리아 분말 | |
JP3080873B2 (ja) | 耐摩耗性アルミナ質セラミックス及びその製造方法 | |
JP2006186381A (ja) | Cmp生成物 | |
KR101022982B1 (ko) | 폴리싱 슬러리 및 그 사용 방법 | |
JP2000336344A (ja) | 研磨剤 | |
JP6788988B2 (ja) | 研磨用組成物 | |
JP2972488B2 (ja) | 焼結複合研磨剤グリツト、その製造法並びに使用法 | |
JP7513985B2 (ja) | 研磨材組成物 | |
JP6622991B2 (ja) | 研磨用組成物 | |
JP2006326787A (ja) | 固定砥粒研削研磨用工具 | |
JP6059674B2 (ja) | 研磨剤組成物 | |
JP4301434B2 (ja) | 研磨砥粒及び研磨具 | |
JP6078864B2 (ja) | 研磨材 | |
JP4296362B2 (ja) | 研磨剤組成物 | |
JP5554052B2 (ja) | 研磨用組成物および研磨方法 | |
JP2000190228A (ja) | 固定砥粒加工工具 | |
JP2023141786A (ja) | 研磨スラリー及び研磨方法 | |
DE10163570A1 (de) | Neue Verwendung für Erdalkalimetallsalze | |
Rostoker | Nanometer Sized Alpha Alumina Polishing Slurry | |
MXPA00008063A (en) | Optical polishing formulation |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230425 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20240124 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20240206 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240314 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20240604 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20240619 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7513985 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |