JP7510416B2 - 弾性波装置、高周波フロントエンド回路及び通信装置 - Google Patents

弾性波装置、高周波フロントエンド回路及び通信装置 Download PDF

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Publication number
JP7510416B2
JP7510416B2 JP2021530593A JP2021530593A JP7510416B2 JP 7510416 B2 JP7510416 B2 JP 7510416B2 JP 2021530593 A JP2021530593 A JP 2021530593A JP 2021530593 A JP2021530593 A JP 2021530593A JP 7510416 B2 JP7510416 B2 JP 7510416B2
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Japan
Prior art keywords
piezoelectric layer
wave device
support substrate
elastic wave
filter
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JP2021530593A
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Japanese (ja)
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JPWO2021006055A1 (https=
JPWO2021006055A5 (https=
Inventor
英樹 岩本
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02551—Characteristics of substrate, e.g. cutting angles of quartz substrates
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02007—Details of bulk acoustic wave devices
    • H03H9/02015—Characteristics of piezoelectric layers, e.g. cutting angles
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02228—Guided bulk acoustic wave devices or Lamb wave devices having interdigital transducers situated in parallel planes on either side of a piezoelectric layer
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02559—Characteristics of substrate, e.g. cutting angles of lithium niobate or lithium-tantalate substrates
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/64—Filters using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/64—Filters using surface acoustic waves
    • H03H9/6423—Means for obtaining a particular transfer characteristic
    • H03H9/6433—Coupled resonator filters
    • H03H9/6483—Ladder SAW filters

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
JP2021530593A 2019-07-05 2020-06-25 弾性波装置、高周波フロントエンド回路及び通信装置 Active JP7510416B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019126540 2019-07-05
JP2019126540 2019-07-05
PCT/JP2020/025013 WO2021006055A1 (ja) 2019-07-05 2020-06-25 弾性波装置、高周波フロントエンド回路及び通信装置

Publications (3)

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JPWO2021006055A1 JPWO2021006055A1 (https=) 2021-01-14
JPWO2021006055A5 JPWO2021006055A5 (https=) 2022-03-17
JP7510416B2 true JP7510416B2 (ja) 2024-07-03

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JP2021530593A Active JP7510416B2 (ja) 2019-07-05 2020-06-25 弾性波装置、高周波フロントエンド回路及び通信装置

Country Status (5)

Country Link
US (1) US12009799B2 (https=)
JP (1) JP7510416B2 (https=)
KR (1) KR102749040B1 (https=)
CN (1) CN113940002B (https=)
WO (1) WO2021006055A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102844652B1 (ko) * 2023-07-14 2025-08-11 (주)와이솔 스퓨리어스의 여진이 억제된 표면탄성파 소자

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015012005A1 (ja) 2013-07-25 2015-01-29 日本碍子株式会社 複合基板及びその製法
WO2018043610A1 (ja) 2016-09-02 2018-03-08 株式会社村田製作所 弾性波フィルタ装置、高周波フロントエンド回路及び通信装置
WO2018070369A1 (ja) 2016-10-11 2018-04-19 京セラ株式会社 弾性波装置
WO2018097016A1 (ja) 2016-11-25 2018-05-31 国立大学法人東北大学 弾性波デバイス

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007028538A (ja) * 2005-07-21 2007-02-01 Tdk Corp 弾性表面波装置
JP2013102418A (ja) * 2011-10-18 2013-05-23 Nippon Dempa Kogyo Co Ltd 弾性表面波素子及び電子部品
JP6274223B2 (ja) * 2013-12-26 2018-02-07 株式会社村田製作所 弾性波装置及びフィルタ装置
WO2017013968A1 (ja) * 2015-07-17 2017-01-26 株式会社村田製作所 弾性波装置
US10084427B2 (en) * 2016-01-28 2018-09-25 Qorvo Us, Inc. Surface acoustic wave device having a piezoelectric layer on a quartz substrate and methods of manufacturing thereof
US10924085B2 (en) 2016-10-17 2021-02-16 Qorvo Us, Inc. Guided acoustic wave device
WO2018180647A1 (ja) * 2017-03-31 2018-10-04 株式会社村田製作所 フィルタ装置、高周波モジュール、および通信装置
JP2019036963A (ja) * 2017-08-18 2019-03-07 スカイワークス ソリューションズ, インコーポレイテッドSkyworks Solutions, Inc. キャリアアグリゲーションシステム用の弾性表面波デバイスを備えたフィルタ
US11206007B2 (en) * 2017-10-23 2021-12-21 Qorvo Us, Inc. Quartz orientation for guided SAW devices

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015012005A1 (ja) 2013-07-25 2015-01-29 日本碍子株式会社 複合基板及びその製法
WO2018043610A1 (ja) 2016-09-02 2018-03-08 株式会社村田製作所 弾性波フィルタ装置、高周波フロントエンド回路及び通信装置
WO2018070369A1 (ja) 2016-10-11 2018-04-19 京セラ株式会社 弾性波装置
WO2018097016A1 (ja) 2016-11-25 2018-05-31 国立大学法人東北大学 弾性波デバイス

Also Published As

Publication number Publication date
KR20220008345A (ko) 2022-01-20
CN113940002B (zh) 2025-10-28
JPWO2021006055A1 (https=) 2021-01-14
US12009799B2 (en) 2024-06-11
CN113940002A (zh) 2022-01-14
KR102749040B1 (ko) 2025-01-02
WO2021006055A1 (ja) 2021-01-14
US20220131517A1 (en) 2022-04-28

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